EP20K600CF672C6 vs EP20K600CF672C8N Comparison
Detailed side-by-side comparison of EP20K600CF672C6 by Altera and EP20K600CF672C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Altera
EP20K600CF672C6
EP20K600CF672C6 - 600K Gate APEX 20KC FPGA | Altera | BGA-672
EP20K600CF672C6 ObsoleteIntel
EP20K600CF672C8N
EP20K600CF672C8N - 600K-Gate FPGA, 508 I/O | Intel | APEX 20K
EP20K600CF672C8N β ActiveSpecification Comparison
| Parameter | EP20K600CF672C6 | EP20K600CF672C8N |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $480.00 | $108.00 |
| Family | APEX 20KC | APEX 20KC |
| Typical Gate Count | 600,000 gates | β |
| Logic Elements (LEs) | 24,320 | β |
| Embedded System Blocks (ESBs) | 160 (each 2,048 bits) | β |
| Maximum Embedded RAM | 311,296 bits (311 kbit) | β |
| Maximum User I/O Pins | 508 | β |
| Package | 672-ball FineLine BGA (CF672) | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| Package Body Size | 27 mm Γ 27 mm | β |
| Speed Grade | -6 (C6) | β |
| Operating Temperature | 0 Β°C to +85 Β°C (commercial) | 0Β°C to 85Β°C |
| Core Voltage | 1.8 V | β |
| I/O Standards Supported | LVCMOS, LVTTL, HSTL, SSTL, GTL+ | β |
| Embedded PLLs | 4 | β |
| Process Technology | 0.18 Β΅m CMOS, 6 metal layers | β |
| Configuration Method | SRAM-based, JTAG, EPC16/EPC2 | [DATA_NEEDED: configuration memory and programming method] |
| RoHS Status | Non-RoHS (legacy process) | unknown |
| Device Type | β | SPLD |
| Product Type | β | FPGA / programmable logic device |
| Nominal Gate Capacity | β | 600K gates |
| Logic Elements or Cells | β | 24,320 |
| Macros | β | 2,432 |
| User I/O Count | β | 508 |
| Package Terminals | β | 652 pins |
| Package Description | β | 672-pin FC-FBGA |
| Supply Voltage | β | 1.8 V |
| Listed Frequency | β | 301.21 MHz |
| Propagation Delay | β | 1.48 ns |
| Fabrication Process | β | 0.15 Β΅m |
| Interconnect Metal | β | All-layer copper metal |
| I/O Configuration | β | 508 user I/O |
| Mounting Type | β | Surface mount |
| REACH Status | β | unknown |
| AEC-Q100 Qualification | β | unknown |
| Core Current | β | [DATA_NEEDED: core supply current] |
| I/O Bank Voltage | β | [DATA_NEEDED: supported I/O voltage range] |
| Junction Temperature | β | [DATA_NEEDED: maximum junction temperature] |
| Thermal Resistance | β | [DATA_NEEDED: junction-to-ambient thermal resistance] |