EP20K600CF672C9N vs EP20K600CF672C8N Comparison

Detailed side-by-side comparison of EP20K600CF672C9N by Intel and EP20K600CF672C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP20K600CF672C9N EP20K600CF672C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Active
Stock Status In Stock In Stock
Unit Price (USD) $175.00 $108.00
Family APEX 20KC APEX 20KC
Device Type Loadable PLD / SRAM FPGA SPLD
System Gates 600,000 β€”
Logic Elements 24,320 β€”
Maximum Operating Frequency 250 MHz β€”
Propagation Delay 1.48 ns (per logic element) 1.48 ns
Core Supply Voltage 1.71 V to 1.89 V (1.8 V nominal) β€”
User I/Os 488 β€”
Total Terminals 672 β€”
Package Type FineLine BGA (FC-FBGA), 1.00 mm pitch, 45 x 45 mm β€”
Process Technology 0.15 Β΅m all-layer copper β€”
Operating Temperature 0 C to 85 C (commercial) 0Β°C to 85Β°C
Mounting Type Surface Mount Surface mount
Configuration Interface JTAG (IEEE 1149.1), passive serial, active serial β€”
Embedded Memory MultiCore EABs supporting up to 311,000 RAM bits β€”
RoHS Status [DATA_NEEDED: RoHS status] unknown
Product Type β€” FPGA / programmable logic device
Nominal Gate Capacity β€” 600K gates
Logic Elements or Cells β€” 24,320
Macros β€” 2,432
User I/O Count β€” 508
Package Terminals β€” 652 pins
Package β€” BGA-652, 45 x 45 mm, 1.27 mm pitch
Package Description β€” 672-pin FC-FBGA
Supply Voltage β€” 1.8 V
Listed Frequency β€” 301.21 MHz
Fabrication Process β€” 0.15 Β΅m
Interconnect Metal β€” All-layer copper metal
I/O Configuration β€” 508 user I/O
REACH Status β€” unknown
AEC-Q100 Qualification β€” unknown
Configuration Method β€” [DATA_NEEDED: configuration memory and programming method]
Core Current β€” [DATA_NEEDED: core supply current]
I/O Bank Voltage β€” [DATA_NEEDED: supported I/O voltage range]
Junction Temperature β€” [DATA_NEEDED: maximum junction temperature]
Thermal Resistance β€” [DATA_NEEDED: junction-to-ambient thermal resistance]

Datasheets & Resources

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