EP20K60EFC144-2XN vs EP20K60ETC144-1X Comparison
Detailed side-by-side comparison of EP20K60EFC144-2XN by Altera and EP20K60ETC144-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Altera
EP20K60EFC144-2XN - APEX-20KE FPGA 60K Gates 93 I/O 144-BGA | Intel/Altera
EP20K60EFC144-2XN NrndIntel
EP20K60ETC144-1X - 60K-Gate APEX-20KE FPGA, 144-LQFP | Intel/Altera
EP20K60ETC144-1X β Last Time BuySpecification Comparison
| Parameter | EP20K60EFC144-2XN | EP20K60ETC144-1X |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $152.00 | $152.00 |
| Series | APEX-20KE | APEX-20KE |
| Family | APEX-20K (MultiCore Architecture) | β |
| Typical Gate Count | 60,000 gates | β |
| Logic Elements / Embedded Array Blocks | 2,560 | β |
| Embedded Memory (Bits) | 32,768 | β |
| Maximum User I/O | 93 | β |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | β |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V | β |
| I/O Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | β |
| Package Type | 144-BGA (Fine-pitch Ball Grid Array) | β |
| Package Code (per MPN suffix) | FBGA / LBGA, 13x13 mm | β |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 C to +85 C (commercial) | β |
| Speed Grade | -2 (per MPN suffix) | β |
| Configuration Method | JTAG (IEEE 1149.1), Passive Serial, Parallel | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS, SRAM-based LUT | CMOS |
| Logic Elements / Cells | β | 2,560 |
| Total Gates | β | 60,000 |
| Total RAM Bits | β | 32,768 |
| Number of I/O | β | 92 |
| Number of Logic Elements/Cells | β | 2,560 |
| Core Voltage | β | 1.8 V (1.71 V to 1.89 V) |
| Propagation Delay | β | 1.72 ns |
| Internal Frequency (Max) | β | 160 MHz |
| Operating Temperature | β | 0 C to +85 C |
| Process Technology | β | 0.22 um CMOS |
| Package / Case | β | 144-LQFP |
| Supplier Device Package | β | 144-TQFP (20x20 mm) |
| Terminal Pitch | β | 0.5 mm |
| Lead Finish / Terminal Form | β | Gull Wing (LQFP) |
| Architecture | β | MultiCore (SOPC) |
| MSL Level | β | [DATA_NEEDED: MSL level] |