EP20K60EFC144-2XN - APEX-20KE FPGA 60K Gates 93 I/O 144-BGA | Intel/Altera
MPN: EP20K60EFC144-2XN ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $185 | $18,500.00 |
| 250 | $168 | $42,000.00 |
| 500 | $152 | $76,000.00 |
EP20K60EFC144-2XN Overview
What is an FPGA? A Field Programmable Gate Array is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells - all of which can be reconfigured after manufacturing to implement arbitrary digital logic. The APEX-20KE family specifically introduced MultiCore architecture combining look-up tables (LUTs), embedded system blocks (ESBs) for memory, and a high-bandwidth interconnect fabric. In the broader taxonomy, the EP20K60EFC144-2XN is a PLD -> programmable logic -> FPGA -> SRAM-based LUT FPGA -> system-on-a-programmable-chip (SOPC) device.
Key features include 2,560 embedded array blocks / logic elements, 32,768 bits of embedded SRAM, 93 maximum user I/Os, and in-system programmability via an IEEE 1149.1 (JTAG) interface or the passive serial configuration scheme. The device supports a propagation delay in the nanosecond range and is specified for commercial temperature operation (0 C to 85 C TJ). The 144-FBGA package provides high I/O density in a small footprint suitable for space-constrained board designs.
The APEX-20KE architecture combines logic, memory, and a high-speed interconnect, allowing designers to implement datapath, control logic, and on-chip RAM in a single device. The MultiCore architecture integrates MegaLAB structures that contain LABs (Logic Array Blocks), ESBs (Embedded System Blocks), and a local interconnect, with row/column interconnect resources enabling high fanout signal distribution.
Typical applications for the EP20K60EFC144-2XN include telecommunications infrastructure (line cards, protocol bridges), industrial automation and motor control, glue logic and bus interfacing in legacy system upgrades, prototyping of ASIC designs, and embedded DSP front-ends. The combination of moderate gate count, embedded memory, and 93 I/O pins makes it appropriate for designs that exceed the capacity of CPLDs but do not require a modern high-density FPGA.
When designing with this device, ensure that the configuration scheme (passive serial, JTAG, or parallel) is correctly selected to match the system boot requirements. The 144-FBGA package requires careful PCB layout with microvia or via-in-pad technology and controlled-impedance routing to maintain signal integrity on high-speed I/O. Note that the APEX-20KE family has been classified as a mature/legacy product by Altera/Intel - verify long-term availability before committing to new designs.
This page synthesizes distributor pricing, drop-in same-package alternatives (including tape-and-reel and speed-grade variants of the same die), and practical design notes not found in the manufacturer datasheet alone, helping engineers sourcing or qualifying this legacy FPGA.
Drop-in alternatives for EP20K60EFC144-2XN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP20K60EFC144-2XN (same form factor and footprint) — differing in Operating Temperature, Speed Grade, Package, Process Technology, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K60EFC144-2X
✅ Drop-In✓ In Stock
$42.65 / Unit
View Datasheet →EP20K60EFC144-1XN
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP20K600EFC144-2XN
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EP20K60EFC144-2XN Maximum Ratings & Electrical Characteristics
| Series | APEX-20KE |
| Family | APEX-20K (MultiCore Architecture) |
| Typical Gate Count | 60,000 gates |
| Logic Elements / Embedded Array Blocks | 2,560 |
| Embedded Memory (Bits) | 32,768 |
| Maximum User I/O | 93 |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| Package Type | 144-BGA (Fine-pitch Ball Grid Array) |
| Package Code (per MPN suffix) | FBGA / LBGA, 13x13 mm |
| Mounting Type | Surface Mount |
| Operating Temperature (TJ) | 0 C to +85 C (commercial) |
| Speed Grade | -2 (per MPN suffix) |
| Configuration Method | JTAG (IEEE 1149.1), Passive Serial, Parallel |
| Logic Family | CMOS, SRAM-based LUT |
EP20K60EFC144-2XN fbga / lbga, 13x13 mm Pin Configuration Guide
Pin configuration for EP20K60EFC144-2XN (fbga / lbga, 13x13 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K60EFC144-2XN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP20K60EFC144-2XN is suitable for 6 applications: Telecommunications Line Card Glue Logic, Industrial Motor Control and Automation, ASIC Prototyping and Emulation Platform, Legacy System Upgrade and Bridge Logic, Embedded DSP Front-End Processing, Display and Video Interface Bridging.
Telecommunications Line Card Glue Logic
The EP20K60EFC144-2XN fits telecommunications line card glue logic because its 60K-gate capacity, 93 user I/Os, and JTAG-based in-system programmability support protocol bridging, framing, and bus-interface functions between line-side PHYs and network processors. With 32 Kbits of embedded SRAM it can host small FIFOs and lookup tables without an external memory device, and the 144-FBGA package concentrates 93 I/Os in a 13x13 mm footprint suitable for dense line-card PCB layouts. Designers typically pair it with serializer/deserializer (SERDES) devices and use its MultiCore LABs to implement ATM/SONET framing, UTOPIA/POS-PHY interfaces, or simple TDM switching fabrics in legacy telecom equipment.
Recommended
Industrial Motor Control and Automation
For industrial motor-control and PLC applications, the EP20K60EFC144-2XN provides the logic capacity to implement PWM modulators, encoder decoding, and fieldbus interfaces in a single device. Its 1.71-1.89 V core supply enables low-heat operation in factory-floor enclosures, while the 93 I/Os accommodate multi-axis servo control, encoder inputs, and opto-isolated digital I/O channels. The 32 Kbits of embedded memory support commutation tables and PID-loop coefficient storage without external RAM. The commercial 0-85 C junction temperature range covers most factory-automation environments, and the BGA package suits the dense multi-axis controller PCBs common in modern servo drives.
Recommended
ASIC Prototyping and Emulation Platform
Engineers commonly use the EP20K60EFC144-2XN as an ASIC prototyping vehicle because its 2,560 logic elements and 32 Kbits of embedded SRAM map cleanly onto mid-complexity ASIC netlists for functional verification. The 93 user I/Os provide ample breakout to bring ASIC signals to test fixtures, and the JTAG configuration interface allows rapid design-iteration cycles using the Quartus II 13.0 programmer. Multiple EP20K60EFC144-2XN devices can be cascaded on a prototype board to validate larger ASICs, with the APEX-20K family supporting a coherent interconnect scheme. This application relies on the device's mature toolchain support for synthesis from VHDL/Verilog sources.
Recommended
Legacy System Upgrade and Bridge Logic
Designers tasked with maintaining or upgrading legacy systems commonly deploy the EP20K60EFC144-2XN as glue-logic between older microprocessors, peripheral buses, and newer memory or interface standards. Its 93 I/Os and 1.71-1.89 V core support mixed-voltage bridging - the I/O banks can interface 5 V and 3.3 V legacy buses - and its MultiCore architecture allows a single chip to replace multiple discrete PAL/GAL devices and 74-series glue logic. The 60K-gate capacity suits complex state machines for bus arbitration, address decoding, and protocol translation in legacy mainframe, industrial controller, and military-aerospace retrofit designs.
Recommended
Embedded DSP Front-End Processing
The EP20K60EFC144-2XN suits embedded DSP front-end applications - particularly preprocessing of sensor or audio data before a dedicated DSP or microcontroller - because its 32 Kbits of embedded SRAM can implement small coefficient buffers and delay lines. The MultiCore LAB architecture supports fast carry-chain arithmetic for accumulators and FIR filter taps, and the 93 user I/Os allow direct connection to multi-channel ADC front-ends. For audio systems, the device can implement sample-rate conversion or equalization; for instrumentation, it handles front-end decimation or digital filtering before handing data to a downstream processor.
Recommended
Display and Video Interface Bridging
The EP20K60EFC144-2XN can serve as a video or display-interface bridge for legacy flat-panel controllers, format converters, and timing generators. Its 93 user I/Os provide ample pins to bring in parallel RGB or LVDS data paths and drive multiple output formats simultaneously, while the embedded 32 Kbits of SRAM can buffer scan-line data and lookup-table color spaces. Designers implement horizontal/vertical timing generators, gamma-correction tables, and format scalers in the MultiCore LABs, using the BGA package to keep trace lengths short on high-speed pixel clocks. The commercial temperature grade suits indoor kiosk, signage, and instrumentation display applications.
Recommended
Recommended Products Summary
Engineering reference data for EP20K60EFC144-2XN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K60EFC144-2X | EP20K60EFC144-1XN | EP20K60EFC144-2 | EP20K600EFC144-2XN |
|---|---|---|---|---|---|
| Package | 144-FBGA (13x13 mm) | 144-FBGA (13x13 mm) - same | 144-FBGA (13x13 mm) - same | 144-LQFP - different footprint | 144-FBGA (13x13 mm) - same |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Family / Series | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20K (base) | APEX-20KE |
| Typical Gates | 60,000 | 60,000 | 60,000 | 60,000 | 600,000 |
| User I/O | 93 | 93 | 93 | 92 | 93 |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -2 |
Key Differentiators
- Identical die in different lead-finish options (vs EP20K60EFC144-2X)
- Lower-speed-grade option for cost-sensitive designs (vs EP20K60EFC144-1XN)
- Same-package upgrade path to 10x more logic (vs EP20K600EFC144-2XN)
Design Notes
The 144-FBGA package has a 1.0 mm or finer ball pitch and requires PCB fabrication with microvia (laser-drilled or staggered via) technology to route signals out from the inner balls. Use via-in-pad with filled and plated-over vias for the inner-row balls that would otherwise break out only through dog-bone fan-outs. Maintain a continuous ground plane under the BGA and use 50 ohm controlled-impedance traces for clock and high-speed I/O signals. Allow at least 4 PCB layers (signal/ground/power/signal) for the BGA breakout region, with decoupling capacitors placed on the outer layer directly adjacent to the corresponding power/ground balls.
The EP20K60EFC144-2XN requires two supply rails: VCCINT (1.71-1.89 V) for the core logic and VCCIO (per-bank, up to 3.3 V) for the I/O banks. Estimated: at 100 MHz internal operation with 70% I/O toggling, the device draws approximately 300-500 mA from VCCINT and a smaller amount from VCCIO - designers should budget 1 A for VCCINT to cover inrush during configuration. Place 0.1 uF ceramic decoupling capacitors adjacent to every VCCINT and VCCIO ball pair, and add bulk 33-100 uF tantalum or polymer capacitors near the supply pins. Power-on sequencing should hold the device in reset until both VCCINT and VCCIO are stable.
Common pitfalls include: (1) attempting to use a newer Quartus version - APEX-20KE support ended with Quartus II 13.0sp1, and Quartus Prime does not support this family; (2) confusing the EP20K60EFC144-2 (LQFP, APEX-20K base, 92 I/Os) with the -2XN (FBGA, APEX-20KE, 93 I/Os); (3) omitting the configuration device - APEX-20KE requires an external EPC configuration PROM or JTAG programmer to load the bitstream; (4) not planning for JTAG chain access - bring TMS/TCK/TDO/TDI to a header for in-system programming and boundary-scan test.
Compliance Information
The 'N' suffix in the MPN typically denotes a RoHS-compliant or lead-free finish per Altera/Intel part-numbering convention, but the Verified Web Data does not explicitly state RoHS, REACH, lead-free, or halogen-free status. AEC-Q100 does not apply to FPGAs of this family.
