EP2A15B652C9 vs EP2A25B652C9 Comparison

Detailed side-by-side comparison of EP2A15B652C9 by Intel and EP2A25B652C9 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A15B652C9 EP2A25B652C9
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $195.00 $105.00
Family APEX II β€”
Logic Elements 15,600 24,320
Embedded System Blocks 425 Kbits β€”
Number of DLLs/PLLs 4 PLUs β€”
Core Voltage 1.5 V β€”
I/O Voltage Standards 1.5 V, 1.8 V, 2.5 V, 3.3 V (LVTTL, LVCMOS, LVDS, SSTL, HSTL) LVTTL, LVCMOS, SSTL, LVDS
Speed Grade -9 (fastest APEX II commercial) C9 (-7 commercial)
Operating Temperature 0 C to +85 C (commercial) β€”
Package 652-ball FineLine BGA 652-ball FineLine BGA
Configuration Method SRAM-based, JTAG 1149.1 boundary scan β€”
Programming File Format .pof / .sof (Quartus) β€”
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
MSL Level 3 (168 hours) [DATA_NEEDED: moisture sensitivity level]
RoHS Status Compliant [DATA_NEEDED: RoHS compliance status]
Lead-Free Yes [DATA_NEEDED: lead-free status]
Lifecycle Status Obsolete - new design not recommended β€”
Device Family β€” APEX II (EP2A25)
Process Technology β€” 0.18 Β΅m CMOS
Operating Temperature Range β€” [DATA_NEEDED: commercial/industrial temperature range]
Core Voltage (VCCINT) β€” 1.8 V
Configuration Interface β€” JTAG (IEEE 1149.1), passive serial, MAX configuration scheme
Embedded Memory β€” Embedded array blocks (EABs)
Embedded Multipliers β€” Yes (DSP blocks)
Maximum User I/O β€” [DATA_NEEDED: maximum usable I/O count for 652 BGA]

Datasheets & Resources

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