EP2A15B652C9 - APEX II FPGA 15K LE 652-BGA | Altera (Intel PSG)
MPN: EP2A15B652C9 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $225 | $22,500.00 |
| 250 | $210 | $52,500.00 |
| 500 | $195 | $97,500.00 |
EP2A15B652C9 Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware designers to implement custom digital circuits after PCB fabrication. The APEX II architecture (Advanced Logic Element Matrix with Embedded Processor eXtensions, second generation) sits within the broader hierarchy: programmable logic device -> CPLD/FPGA -> SRAM-based FPGA -> APEX II family -> high-density ASIC-replacement class. APEX II parts combine Look-Up Table (LUT)-based logic, embedded system blocks (ESBs) for memory and arithmetic, and dedicated high-speed I/O structures, making them suitable for system-on-chip prototyping, custom datapaths, and glue logic consolidation.
Key features include four phase-locked loops (PLUs) for clock synthesis, support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, and embedded system blocks that can be configured as dual-port RAM, FIFO, ROM, or arithmetic functions. The -9 speed grade indicates the fastest available timing bin for this family, while the 652-ball BGA package supports high I/O density for memory-rich designs.
Technically, the APEX II device uses a 1.5 V core supply with separate VCCIO pins per bank, allowing mixed-voltage interfacing without external level shifters. The four PLUs provide flexible clock management with multiply/divide and phase shifting, and the architecture supports the APEX II MultiVolt I/O feature so a single device can interface with 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals simultaneously.
Typical applications include telecommunications line cards, high-speed data acquisition front-ends, DSP co-processing blocks, ASIC prototyping platforms, and industrial control systems that require high logic density and high I/O count. The 652-ball BGA footprint also supports designs that demand significant external memory connectivity, including DDR-style interfaces on adjacent banks.
Designers should note that APEX II devices require a configuration controller or external PROM, and JTAG-based in-system programmability is supported through the IEEE Std 1149.1 boundary-scan interface. Power sequencing must bring the core VCC up before VCCIO is applied to prevent excessive I/O drive current during startup.
This page synthesizes distributor inventory, drop-in alternatives from the same APEX II family, and practical design notes not found in the standalone datasheet.
Drop-in alternatives for EP2A15B652C9 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A15B652C9 (same form factor and footprint) — differing in Process Technology, Logic Elements, Package, Speed Grade, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A15B652C8
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EP2A15B652C7
✅ Drop-In✓ In Stock
$82.4 / Unit
View Datasheet →EP20K600EBI652-2X
✅ Drop-In✓ In Stock
$198.59 / Unit
View Datasheet →EP20K400EBI652-2X
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →EP20K600EBC652-3
✅ Drop-In✓ In Stock
$340 / Unit
View Datasheet →EP2A15B652C9 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements | 15,600 |
| Embedded System Blocks | 425 Kbits |
| Number of DLLs/PLLs | 4 PLUs |
| Core Voltage | 1.5 V |
| I/O Voltage Standards | 1.5 V, 1.8 V, 2.5 V, 3.3 V (LVTTL, LVCMOS, LVDS, SSTL, HSTL) |
| Speed Grade | -9 (fastest APEX II commercial) |
| Operating Temperature | 0 C to +85 C (commercial) |
| Package | 652-ball FineLine BGA |
| Configuration Method | SRAM-based, JTAG 1149.1 boundary scan |
| Programming File Format | .pof / .sof (Quartus) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Lifecycle Status | Obsolete - new design not recommended |
EP2A15B652C9 Pin Configuration
| Pin B1 | IO_BANK_1 — MultiVolt I/O bank 1 |
| Pin B2 | VCCIO1 — I/O supply bank 1 |
| Pin B3 | IO_BANK_1 — MultiVolt I/O bank 1 |
| Pin B4 | GND — Ground |
| Pin C1 | VCCINT — Core voltage 1.5 V |
| Pin C2 | IO_BANK_2 — MultiVolt I/O bank 2 |
| Pin C3 | VCCIO2 — I/O supply bank 2 |
| Pin C4 | IO_BANK_2 — MultiVolt I/O bank 2 |
| Pin D1 | TDI — JTAG test data in |
| Pin D2 | TMS — JTAG test mode select |
| Pin D3 | TCK — JTAG test clock |
| Pin D4 | TDO — JTAG test data out |
| Pin E1 | MSEL0 — Configuration mode select 0 |
| Pin E2 | MSEL1 — Configuration mode select 1 |
| Pin E3 | nCONFIG — Configuration begin (active low) |
| Pin E4 | nSTATUS — Configuration status (active low) |
| Pin F1 | PLU1_IN — Phase-locked loop 1 reference input |
| Pin F2 | PLU1_OUT — Phase-locked loop 1 clock output |
| Pin F3 | PLU2_IN — Phase-locked loop 2 reference input |
| Pin F4 | PLU2_OUT — Phase-locked loop 2 clock output |
Typical Applications
EP2A15B652C9 is suitable for 6 applications: Telecommunications Line Card Glue Logic, ASIC Prototyping Platform, High-Speed Data Acquisition Front-End, Industrial Motor and Motion Controller, Custom Datapath and DMA Engine, Legacy Avionics and Defense Retrofit.
Telecommunications Line Card Glue Logic
The EP2A15B652C9 is well suited to telecommunications line cards that need to consolidate scattered 74-series and PAL glue logic into a single programmable device, with 15,600 logic elements and 425 Kbits of embedded system block memory handling per-channel framing, ATM cell segmentation, and backplane interface glue. The four on-chip PLUs let the designer derive multiple TDM clocks (e.g., 1.544 MHz, 2.048 MHz, 19.44 MHz) from one backplane reference, while the MultiVolt I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) interfaces directly to legacy 5 V-tolerant bus transceivers through external resistors. Trade-off: APEX II at 1.5 V core dissipates noticeably more power than a comparable Cyclone IV E, so thermal layout matters in a sealed chassis.
Recommended
ASIC Prototyping Platform
Engineers use the EP2A15B652C9 as an ASIC prototyping vehicle because its 15,600 LE, 425 Kbits of block RAM, and 652-ball BGA package can mimic medium-complexity ASICs at speeds close to silicon. The APEX II architecture supports multi-voltage I/O so the prototype can bridge between 1.5 V cores and 3.3 V peripheral buses that the final ASIC will share. Quartus II design flow allows the RTL developed for the prototype to be re-targeted directly to Altera HardCopy structured ASICs once the design stabilizes, and the JTAG-based in-system programming shortens iteration loops. Trade-off: SRAM-based configuration means volatile bitstream storage; pair with a configuration PROM for unattended operation.
Recommended
High-Speed Data Acquisition Front-End
The EP2A15B652C9's combination of four PLUs, fast -9 speed grade, and 425 Kbits of embedded system block memory makes it a reasonable choice for high-speed data acquisition front-ends that need parallel DSP preprocessing, FIFO buffering of ADC samples, and a backhaul interface to a downstream processor. The MultiVolt I/O banks can directly receive LVDS signals from modern ADCs while the slower bank drives a parallel interface to a microcontroller or DSP. The 652-ball BGA also provides sufficient I/O count to demultiplex an 8-channel ADC array without external muxes. Trade-off: APEX II lacks dedicated DSP blocks, so FIR/FFT operations consume general LE; consider Cyclone IV E with DSP blocks for modern designs.
Recommended
Industrial Motor and Motion Controller
Industrial motion controllers use the EP2A15B652C9 to implement multi-axis PWM generation, encoder quadrature decoding, and field-oriented control state machines in a single device, with the 652-ball BGA supporting the dozens of digital I/O lines required to interface to gate drivers, optical encoders, and resolver excitation chips. The four PLUs synthesize the switching frequencies and the multiple time bases needed for cascaded control loops, and the 1.5 V core with MultiVolt I/O simplifies mixed-voltage interface to 3.3 V Hall-effect sensors and 5 V gate driver logic. Trade-off: APEX II is rated commercial (0-85 C), not industrial (-40 to +85 C), so a heater or thermal management is required for outdoor cabinets.
Recommended
Custom Datapath and DMA Engine
Data-plane equipment often uses the EP2A15B652C9 as a custom scatter-gather DMA engine, exploiting the embedded system blocks as dual-port RAM descriptors and the high I/O count to attach to multiple PCI or local-bus interfaces simultaneously. The -9 speed grade allows the device to sustain 66 MHz PCI transactions without cycle-budget pressure, while the 652-ball BGA allows adjacent connector footprints for high-density backplane cards. Trade-off: the APEX II family is no longer recommended for new designs; new platforms should consider Cyclone IV E or Cyclone V for active support.
Recommended
Legacy Avionics and Defense Retrofit
Military and aerospace retrofit programs continue to use the EP2A15B652C9 to replace obsolete discrete logic and older FPGAs because the part's longevity in defense logistics stock and its MIL-STD-810 vibration tolerance in BGA form factor suit ruggedized enclosures. The 652-ball BGA also withstands thermal cycling better than fine-pitch QFNs, which is important for avionics that sees -55 C to +125 C excursions, and the APEX II bitstream can be encrypted with Quartus II to protect program IP. Trade-off: APEX II is not on the QML list; for new safety-critical avionics use a certified device like Microsemi (Microchip) ProASIC3 or RTG4 instead.
Recommended
Recommended Products Summary
Engineering reference data for EP2A15B652C9 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A15B652C8 | EP2A15B652C7 | EP20K600EBI652-2X | EP20K400EBI652-2X | EP20K600EBC652-3 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 652-ball FineLine BGA | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same | 652-ball BGA - same footprint | 652-ball BGA - same footprint | 652-ball BGA - same footprint |
| Family | APEX II | APEX II - same family | APEX II - same family | APEX 20K600E - different family | APEX 20K400E - different family | APEX 20K600E - different family |
| Logic Elements | 15,600 | 15,600 - same | 15,600 - same | 24,160 (+55%) | 16,600 (+6%) | 24,160 (+55%) |
| Speed Grade | -9 (fastest) | -8 (slower) | -7 (slowest) | -2X industrial | -2X industrial | -3 commercial |
| Core Voltage | 1.5 V | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same | 1.5 V - same |
| PLUs / PLLs | 4 PLUs | 4 PLUs - same | 4 PLUs - same | 4 PLLs - same count | 4 PLLs - same count | 4 PLLs - same count |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Fastest APEX II commercial speed grade (vs EP2A15B652C7)
- Drop-in compatibility with other APEX II 652-ball BGA parts (vs EP20K600EBI652-2X)
- Four on-chip PLUs for flexible clock synthesis (vs EP20K400FI672-3)
Design Notes
Estimated: at 1.5 V core with 15,600 LE at typical 50% utilization and 100 MHz operation, the EP2A15B652C9 core current consumption is approximately 1.5-2.5 A, so the core supply regulator must deliver at least 3.5 A with headroom for inrush during configuration. Decouple VCCINT with 0.1 uF X7R ceramic caps placed within 100 mil of each VCCINT pin group, plus bulk tantalum or polymer caps of 100-330 uF. Apply VCCINT before VCCIO and ramp VCCIO monotonically to prevent I/O latch-up; failure to sequence may draw excessive current from partially-powered I/O banks.
Estimated: at full LE utilization and 85 C ambient, the EP2A15B652C9 dissipates roughly 3-5 W; with the 652-ball FineLine BGA's typical theta_JA of 12-15 C/W on a 4-layer JEDEC test board, junction temperature rises 50-75 C above ambient. A thermal pad or copper-flood array under the package on inner PCB layers reduces theta_JA below 8 C/W. For sealed enclosures, derate ambient by 10-15 C relative to manufacturer rating.
Use 0.8 mm or 1.0 mm pitch BGA fanout with microvia or via-in-pad construction; the 652-ball FineLine BGA at 0.8 mm pitch requires HDI stack-up with at least 4-6-4 routing. Provide at least 4 stitching vias around the package perimeter on the top ground plane to control return paths. Match length on critical clock pairs (PLU_IN to PLU_OUT) within 50 mil to maintain skew budget. Route LVDS pairs with 100 ohm differential impedance and length-match within 10 mil.
The EP2A15B652C9 is SRAM-based so the bitstream is volatile; a configuration controller or external PROM (e.g., EPC16UC88) must be present or the FPGA fails to configure at every power-up. Do not drive JTAG TCK above 10 MHz without consulting the APEX II JTAG timing specifications, and do not assert nCONFIG while nSTATUS is low. The device is rated commercial 0-85 C; for outdoor cabinets, place a small heater or use the EP20K400 industrial variant instead.
Compliance Information
RoHS compliance per Altera (Intel PSG) product page; halogen-free status not explicitly stated in verified web data. Not AEC-Q100 qualified - choose automotive-grade Cyclone IV EQ or MAX 10 for AEC-Q100 applications.
