EP2A15B724C9 vs EP2A15F672C7N Comparison
Detailed side-by-side comparison of EP2A15B724C9 by Intel and EP2A15F672C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A15B724C9 | EP2A15F672C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $268.50 | $171.00 |
| Series | APEX II | β |
| Family | APEX II (EP2A15) | APEX II |
| Logic Elements | 16640 | β |
| Number of Gates | 600000 | β |
| Embedded Memory (RAM bits) | 425984 | β |
| User I/O Count | 492 | β |
| Supply Voltage (Core) | 1.5 V | β |
| I/O Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | β |
| Process Technology | 0.15 Β΅m all-layer copper (up to 8 metal layers) | 0.15 Β΅m all-layer copper CMOS |
| Maximum Internal Frequency | 500 MHz | 500 MHz |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | Up to 1 Gbps (True-LVDS) |
| Interface Standards | LVDS, LVPECL, PCML, HyperTransport | β |
| Embedded Memory Type | ESB - dual-port RAM / ROM / FIFO / CAM | β |
| Clock Management | On-chip PLLs | β |
| Package | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) | 672-ball FC-FBGA (FineLine BGA) |
| Operating Temperature | Commercial (0 Β°C to +85 Β°C) | Commercial (0C to +85C) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Elements (Cells) | β | 16,640 |
| Embedded Memory Bits | β | 425,984 |
| User I/Os | β | 492 |
| Metal Layers | β | Up to 8 |
| Core Voltage | β | 1.5 V |
| Speed Grade | β | -7 |
| I/O Standards Supported | β | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL |
| Configuration Methods | β | JTAG, Passive Serial |