EP2A15B724C9 - APEX II FPGA 16640 Cells 1.5V 724-BGA | Intel
MPN: EP2A15B724C9 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $385 | $385.00 |
| 10 | $350 | $3,500.00 |
| 100 | $312.5 | $31,250.00 |
| 500 | $287 | $143,500.00 |
| 1,000 | $268.5 | $268,500.00 |
EP2A15B724C9 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can reconfigure after manufacturing. FPGAs sit in the digital logic hierarchy between simple PLDs/CPLDs and fixed-function ASICs: more capable than a CPLD for high logic density and DSP workloads, but lower NRE cost and faster time-to-market than a full ASIC. APEX II specifically targets high-density data-path and memory-rich designs such as telecommunications backplanes, video processing, and protocol bridging.
Key features of the EP2A15B724C9 include 16640 logic elements, 425984 RAM bits distributed across embedded system blocks (ESBs) that can be configured as dual-port RAM, ROM, FIFO, or CAM, dedicated high-speed interconnect (FAST channel), and a clock network with PLL-based clock management. The 0.15 µm copper process and True-LVDS signaling deliver data rates up to 1 Gbps per LVDS pair, with additional support for LVPECL, PCML, and HyperTransport interface standards for chip-to-chip and backplane links.
The APEX II architecture combines look-up-table (LUT) based logic elements with high-density embedded memory and a four-level hierarchical interconnect (LAB, MegaLAB, MegaLAB interconnects, FAST channel). MultiVolt I/O and on-chip termination simplify mixed-voltage board design, while the embedded PLLs provide precise clock synthesis, multiplication, division, and phase shifting across multiple clock domains.
Typical applications include high-speed telecommunications backplanes using 1 Gbps LVDS links, video and image processing pipelines, network switches and routers, protocol bridging (e.g., SPI to LVDS, PCI to RapidIO), DSP co-processing cards, and ASIC prototyping. The 492 user I/O pins and 425984 bits of RAM make the EP2A15B724C9 well suited to designs that need many parallel interfaces plus substantial on-chip buffering.
When designing with this device, place at least 8 to 12 low-impedance decoupling capacitors (0.1 µF and 0.01 µF) near each power pin to suppress switching noise on the 1.5 V core rail. Note that the APEX II family has been NRND for several years; for new designs, evaluate a Cyclone or Stratix equivalent from Intel's current portfolio unless the legacy footprint, I/O count, or qualification is mandatory.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2A15B724C9 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A15B724C9 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, PLLs, Maximum Internal Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A15B724C8
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP2A15B724C7
✅ Drop-In✓ In Stock
$125 / Unit
View Datasheet →EP2A15B724C9N
✅ Drop-In📋 Reference alternative (not in catalog)
EP2A15B724C
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A15B724C9 Maximum Ratings & Electrical Characteristics
| Series | APEX II |
| Family | APEX II (EP2A15) |
| Logic Elements | 16640 |
| Number of Gates | 600000 |
| Embedded Memory (RAM bits) | 425984 |
| User I/O Count | 492 |
| Supply Voltage (Core) | 1.5 V |
| I/O Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) |
| Process Technology | 0.15 µm all-layer copper (up to 8 metal layers) |
| Maximum Internal Frequency | 500 MHz |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) |
| Interface Standards | LVDS, LVPECL, PCML, HyperTransport |
| Embedded Memory Type | ESB - dual-port RAM / ROM / FIFO / CAM |
| Clock Management | On-chip PLLs |
| Package | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) |
| Operating Temperature | Commercial (0 °C to +85 °C) |
| Mounting Type | Surface Mount |
EP2A15B724C9 724-ball fcbga (fine-pitch chip-scale bga) Pin Configuration Guide
Pin configuration for EP2A15B724C9 (724-ball fcbga (fine-pitch chip-scale bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A15B724C9.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A15B724C9 is suitable for 7 applications: Telecommunications Backplane Interconnect, Video and Image Processing Pipelines, ASIC Prototyping and Logic Emulation, Network Switches and Protocol Bridges, Industrial Control and DSP Co-Processing, Test and Measurement Instrumentation, Aerospace and Defense Embedded Systems.
Telecommunications Backplane Interconnect
The EP2A15B724C9's True-LVDS capability at up to 1 Gbps per differential pair and 492 user I/O pins make it an ideal datapath engine for telecom backplanes. The 425984 bits of embedded RAM provide line-rate buffering, while the 16640 logic elements handle framing, lane alignment, and protocol processing across multiple high-speed links. Its HyperTransport and LVPECL support also enable tight integration with network processors, reducing chip count on line cards.
Recommended
Video and Image Processing Pipelines
With 425984 RAM bits distributed across embedded system blocks (ESBs), the EP2A15B724C9 can buffer full video frames and line buffers in real time without external memory. The 16640 logic elements sustain wide datapaths for pixel processing, color-space conversion, scaling, and overlay generation. The MultiVolt I/O supports both 1.8 V and 3.3 V image sensors, and the 1 Gbps LVDS links forward processed frames to display controllers at high refresh rates.
Recommended
ASIC Prototyping and Logic Emulation
The 600000 system gates and 16640 logic elements make the EP2A15B724C9 well suited as a single-chip or multi-FPGA ASIC prototype target, emulating sub-million-gate ASICs with in-system speed verification. Its 492 user I/O pins provide ample signal visibility, and embedded PLLs regenerate the ASIC's clock tree for realistic timing analysis. Quartus II synthesis and the APEX II's high routing density shorten bring-up time compared with older CPLD/FPGA prototypes.
Recommended
Network Switches and Protocol Bridges
The EP2A15B724C9's 425984 RAM bits are ideal for building packet buffers, header decoders, and lookup tables in managed Ethernet switches and protocol bridges. Its 492 I/O pins can directly drive multiple SGMII / LVDS PHYs, while the 16640 logic elements run forwarding engines and ACLs. The 1 Gbps LVDS capability enables backplane interconnect between line cards in a chassis at line rate.
Recommended
Industrial Control and DSP Co-Processing
The EP2A15B724C9 delivers 16640 logic elements and embedded multipliers in a logic-rich architecture that supports parallel DSP operations such as FIR filtering, FFT, and motion control. Its MultiVolt I/O enables direct interface to both legacy 5 V-tolerant and modern 3.3 V sensors and actuators, while its 724-ball FCBGA package provides 492 user I/Os for multi-axis control loops. On-chip PLLs provide deterministic clock synthesis for high-speed control sampling.
Recommended
Test and Measurement Instrumentation
The EP2A15B724C9's combination of 425984 RAM bits for deep sample buffers, 492 user I/O pins for multi-channel capture, and 1 Gbps True-LVDS for high-speed data export suits it to logic analyzers, protocol analyzers, and ATE load boards. The 0.15 µm copper process provides low jitter on high-speed paths, while the embedded PLLs enable precise trigger and timing generation across multiple acquisition channels in parallel.
Recommended
Aerospace and Defense Embedded Systems
With 16640 logic elements, 425984 RAM bits, and True-LVDS at 1 Gbps, the EP2A15B724C9 provides the logic density and signal integrity required for avionics databuses, mission computers, and EW subsystems. Its 724-ball FCBGA package withstands vibration profiles typical of aerospace platforms, while the on-chip PLLs and embedded memory support deterministic real-time processing. For new programs, however, radiation-tolerant modern Intel FPGAs are preferred.
Recommended
Recommended Products Summary
Engineering reference data for EP2A15B724C9 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A15B724C8 | EP2A15B724C7 | EP2A15B724C9N | EP2A15B724C |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 724-ball FCBGA | 724-ball FCBGA (same) | 724-ball FCBGA (same) | 724-ball FCBGA (same) | 724-ball FCBGA (same) |
| Logic Elements | 16640 | 16640 (same) | 16640 (same) | 16640 (same) | 16640 (same) |
| Embedded RAM (bits) | 425984 | 425984 (same) | 425984 (same) | 425984 (same) | 425984 (same) |
| User I/O Count | 492 | 492 (same) | 492 (same) | 492 (same) | 492 (same) |
| Speed Grade | 9 (fastest) | 8 (~10-15% slower fmax) | 7 (~20% slower fmax) | 9 (same, lead-free finish) | Commercial standard (typically C7/C8 equivalent) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| LVDS Max Data Rate | 1 Gbps | 1 Gbps (same) | 1 Gbps (same) | 1 Gbps (same) | 1 Gbps (same) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest APEX II speed grade (vs EP2A15B724C8)
- True-LVDS at 1 Gbps on a copper 0.15 µm process (vs EP2A15B724C7)
- Drop-in compatible lead-free variant available (vs EP2A15B724C9N)
- 492 user I/Os with MultiVolt mixed-voltage support (vs EP2A15B652C9)
Design Notes
The EP2A15B724C9 requires a clean 1.5 V core supply and stable MultiVolt I/O rails at 1.5 V / 1.8 V / 2.5 V / 3.3 V. Place 0.1 µF and 0.01 µF ceramic decoupling capacitors within 5 mm of every power pin, and bulk 47 µF to 220 µF tantalum or polymer capacitors on the core rail to handle in-rush during configuration. Use an isolated ground plane split cleanly between the PLL analog section and the digital logic to minimize jitter. Voltage sequencing is not strictly required for APEX II but is recommended: power up the 1.5 V core first, then the I/O rails.
The 724-ball FCBGA package requires BGA-grade PCB technology: microvia escape routing or via-in-pad construction, 4 mil to 6 mil trace widths and clearances, and controlled-impedance routing for LVDS pairs (typically 100 Ω differential). Decoupling capacitors should be placed on the opposite PCB side in the BGA shadow (landside) to minimize loop inductance. Thermal vias under the die are recommended for designs exceeding moderate power dissipation. The IBIS model must be used for signal-integrity simulation on LVDS and HyperTransport links.
Common pitfalls with APEX II designs include: (1) forgetting to reserve JTAG pins TDO/TDI/TCK/TMS/TCLK_CONFIG when assigning user I/O, which can lock out debug access; (2) exceeding 492 user I/Os by ignoring VCCINT, GND, JTAG, and dedicated clock pins in the pin count; (3) underestimating configuration time when using serial EPC/EPCS configuration devices (slow passive-serial mode); (4) mismatched LVDS termination at the receiver resulting in signal-integrity failures at 1 Gbps. Use the Quartus II Pin Planner and SignalTap II embedded logic analyzer to validate pin assignments and timing closure before layout.
Estimated: at typical utilization of 60-70% logic elements and 100 MHz internal clock, the EP2A15B724C9 dissipates approximately 1.5-2.5 W. The FCBGA package relies heavily on the PCB's ground/power planes and thermal vias for heat removal; without thermal vias the junction temperature can rise above 100 °C in a still-air environment. For sustained high-utilization designs (>3 W), provide airflow (200 LFM minimum) or a heatsink attached to the BGA lid. Always validate thermal performance against the APEX II thermal model and the design's measured switching activity.
The True-LVDS channels at 1 Gbps require tightly controlled 100 Ω differential impedance with intra-pair skew below 5 ps and inter-pair skew below 50 ps over the entire matched-length path. Keep LVDS pairs on the same PCB layer and minimize the number of vias (preferably zero on the receiver side). Source-series termination with a 100 Ω differential resistor near the transmitter, and a 100 Ω receiver-side resistor, ensures a clean 1 Gbps eye. Use HyperTransport mode only when both endpoints are HyperTransport-compliant; mixing with generic LVDS can fail link training.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status not explicitly confirmed in verified web data; the EP2A15B724C9N variant is typically Pb-free. AEC-Q100 not applicable (FPGA for industrial/aerospace/telecom, not automotive).
