EP2A15B724C9 vs EP2A25B724-C7 Comparison
Detailed side-by-side comparison of EP2A15B724C9 by Intel and EP2A25B724-C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A15B724C9 | EP2A25B724-C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $268.50 | $195.00 |
| Series | APEX II | β |
| Family | APEX II (EP2A15) | APEX II |
| Logic Elements | 16640 | 24,320 |
| Number of Gates | 600000 | β |
| Embedded Memory (RAM bits) | 425984 | β |
| User I/O Count | 492 | β |
| Supply Voltage (Core) | 1.5 V | β |
| I/O Voltages Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) | β |
| Process Technology | 0.15 Β΅m all-layer copper (up to 8 metal layers) | 0.15 Β΅m all-layer copper, up to 8 metal layers |
| Maximum Internal Frequency | 500 MHz | β |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | β |
| Interface Standards | LVDS, LVPECL, PCML, HyperTransport | β |
| Embedded Memory Type | ESB - dual-port RAM / ROM / FIFO / CAM | β |
| Clock Management | On-chip PLLs | β |
| Package | 724-ball FCBGA (Fine-pitch Chip-Scale BGA) | 724-BBGA, FCBGA |
| Operating Temperature | Commercial (0 Β°C to +85 Β°C) | Commercial (0C to +85C) |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Device | β | EP2A25 |
| System Gates | β | 622,592 |
| User I/Os | β | 540 |
| Core Voltage | β | 1.5 V |
| High-Speed Interface | β | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Embedded Memory (ESB) | β | Configurable as 4 Kbit SRAM or product-term logic per ESB |
| PLLs | β | Up to 8 |
| Multi-Voltage I/O | β | 1.5 V / 1.8 V / 2.5 V / 3.3 V banks |
| Speed Grade | β | C7 |