EP2A15F672C7AA vs EP2A15F672C7N Comparison
Detailed side-by-side comparison of EP2A15F672C7AA by Intel and EP2A15F672C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A15F672C7AA | EP2A15F672C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $215.00 | $171.00 |
| Family | APEX II | APEX II |
| Typical Gates | 600K | β |
| Maximum System Gates | 1.4M | β |
| Logic Elements (LEs) | 16,640 | β |
| Maximum User I/O | 492 | β |
| Operating Frequency (internal) | 500 MHz | β |
| LVDS Data Rate | 1 Gbps True-LVDS | Up to 1 Gbps (True-LVDS) |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, LVDS, LVPECL, PCML, HyperTransport | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL |
| MultiVolt I/O Bank Voltages | 1.5V / 1.8V / 2.5V / 3.3V | β |
| Embedded Memory | Dual-port RAM blocks + CAM blocks | β |
| PLLs | 4 enhanced PLLs | β |
| Package | 672-ball FC-FBGA (flip-chip) | 672-ball FC-FBGA (FineLine BGA) |
| Process Technology | 0.15 micrometer all-layer copper (up to 8 metal layers) | 0.15 Β΅m all-layer copper CMOS |
| Programming Interfaces | Passive Serial, Fast Passive Parallel, JTAG (IEEE 1149.1) | β |
| Operating Temperature Grade | Commercial (0C to +85C) | β |
| Lifecycle | Last-Time-Buy / EOL announced Nov-Dec 2016 | β |
| RoHS Status | Compliant (per Full-Electronic listing) | [DATA_NEEDED: RoHS status] |
| Logic Elements (Cells) | β | 16,640 |
| Embedded Memory Bits | β | 425,984 |
| User I/Os | β | 492 |
| Metal Layers | β | Up to 8 |
| Maximum Internal Frequency | β | 500 MHz |
| Speed Grade | β | -7 |
| Operating Temperature | β | Commercial (0C to +85C) |
| Configuration Methods | β | JTAG, Passive Serial |
| Mounting Type | β | Surface Mount (BGA) |