EP2A15F672C7AA - APEX II FPGA 600K Gates 1.5V FC-FBGA672
MPN: EP2A15F672C7AA ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $252 | $25,200.00 |
| 500 | $232.5 | $116,250.00 |
| 1,000 | $215 | $215,000.00 |
EP2A15F672C7AA Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LEs), programmable interconnect, and I/O cells that the designer can wire up after manufacture using an HDL and a vendor toolchain (Quartus for Altera APEX II). FPGAs sit in the programmable-logic hierarchy above CPLDs and below fixed-function ASICs, and are typically chosen when time-to-market, design revision flexibility, or low-to-mid volume production outweigh the unit-cost advantage of an ASIC. APEX II parts in particular target high-speed communications and bus-interface applications that benefit from multi-gigabit transceivers.
The EP2A15F672C7AA provides four enhanced PLLs for clock management, dedicated dual-port RAM blocks, and embedded content-addressable memory (CAM) blocks for look-up intensive functions. The MultiVolt I/O architecture allows each bank to be placed at 1.5V, 1.8V, 2.5V, or 3.3V, allowing direct interface to mixed-voltage peripherals without external level shifters. JTAG (IEEE 1149.1) boundary-scan and in-system programmability via the passive serial, fast passive parallel, or JTAG ports shorten board bring-up cycles.
Typical applications for this part include high-speed serial interface bridging, telecom backplane aggregation, ASIC prototyping and emulation, bus-width conversion between PCI, PCI-X, and RapidIO links, and custom glue logic for storage and imaging subsystems. The 492 I/O count makes it suitable for designs that previously required a gate-array and benefit from being re-spinable in software.
When designing with this device, attention must be paid to the FC-FBGA672 land pattern and PCB stack-up. The package requires a multi-layer board with controlled-impedance routing, microvia or via-in-pad technology, and matched-length traces on the LVDS pairs to maintain the 1 Gbps signaling budget. Decoupling must follow the reference design in the APEX II handbook (a minimum of 100 low-ESR capacitors distributed across the die area). The part has been flagged Last-Time-Buy / EOL by Altera (PDN dated Nov-Dec 2016), so new designs should consider the APEX II successor families or evaluate a Cyclone / Stratix equivalent.
Drop-in alternatives for EP2A15F672C7AA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A15F672C7AA (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Logic Elements.
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View Datasheet →EP2A15F672C7AA Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Typical Gates | 600K |
| Maximum System Gates | 1.4M |
| Logic Elements (LEs) | 16,640 |
| Maximum User I/O | 492 |
| Operating Frequency (internal) | 500 MHz |
| LVDS Data Rate | 1 Gbps True-LVDS |
| Core Voltage | 1.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, LVDS, LVPECL, PCML, HyperTransport |
| MultiVolt I/O Bank Voltages | 1.5V / 1.8V / 2.5V / 3.3V |
| Embedded Memory | Dual-port RAM blocks + CAM blocks |
| PLLs | 4 enhanced PLLs |
| Package | 672-ball FC-FBGA (flip-chip) |
| Process Technology | 0.15 micrometer all-layer copper (up to 8 metal layers) |
| Programming Interfaces | Passive Serial, Fast Passive Parallel, JTAG (IEEE 1149.1) |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Lifecycle | Last-Time-Buy / EOL announced Nov-Dec 2016 |
| RoHS Status | Compliant (per Full-Electronic listing) |
EP2A15F672C7AA 672-ball fc-fbga (flip-chip) Pin Configuration Guide
Pin configuration for EP2A15F672C7AA (672-ball fc-fbga (flip-chip) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A15F672C7AA.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A15F672C7AA is suitable for 6 applications: Telecom Backplane Aggregation, ASIC Prototyping and Emulation, Bus Interface Bridging (PCI / PCI-X / RapidIO), Custom Glue Logic for Storage Controllers, High-Speed Imaging and Video Pipeline, Industrial Control and Test Instrumentation.
Telecom Backplane Aggregation
The EP2A15F672C7AA's 1 Gbps True-LVDS, LVPECL, and HyperTransport I/O capability makes it well suited to backplane aggregation in telecom line cards. With 492 user I/O, the device can bridge multiple lower-speed serial lanes to a single high-speed uplink, replacing several discrete PHY devices. The 600K-gate capacity covers packet parsing, queuing, and shaping logic for SONET/SDH or Ethernet aggregation. The 1.5V core with MultiVolt I/O banks allows direct interface to legacy 3.3V framers while keeping internal power low.
Recommended
ASIC Prototyping and Emulation
The 16,640 logic elements and embedded dual-port RAM/CAM blocks provide the capacity to prototype mid-complexity ASICs that would otherwise require a multi-million-dollar fabrication cycle. Design teams can validate RTL against real-world I/O timing at 500 MHz internal clock and verify mixed-voltage bus behavior before committing to silicon. The JTAG (IEEE 1149.1) interface simplifies iterative debug, and the FC-FBGA672 footprint is shared with multiple APEX II densities, enabling a single prototype PCB to host several design revisions.
Recommended
Bus Interface Bridging (PCI / PCI-X / RapidIO)
Bus-width conversion and protocol bridging between PCI, PCI-X, and RapidIO is a classic APEX II use case. The MultiVolt I/O banks (1.5/1.8/2.5/3.3V) allow direct connection to 3.3V PCI signaling on one side and 1.5V RapidIO on the other, removing external level shifters. The 492 I/O count is sufficient to implement a wide PCI-X bridge plus arbitration and FIFO logic on the same die. This reduces board area and BOM count versus a discrete bridge chip plus control CPLD.
Recommended
Custom Glue Logic for Storage Controllers
Storage subsystems (RAID controllers, NAS front-ends, HDD interface boards) often need custom glue logic between SATA/SAS PHYs, memory controllers, and the host CPU. The EP2A15F672C7AA provides enough logic capacity (16,640 LEs) for command queuing, error-correction insertion, and DMA engine state machines, while its dual-port RAM blocks implement shared FIFOs between the host and storage paths. The CAM blocks accelerate address-lookup tables for LBA mapping. The 1.5V core keeps total power below 5W typical.
Recommended
High-Speed Imaging and Video Pipeline
Imaging front-ends that aggregate data from multiple Camera Link, LVDS, or HDMI sources benefit from the EP2A15F672C7AA's 1 Gbps LVDS capability and 492 I/O count. The device can ingest multiple 10-bit Camera Link channels in parallel and feed a downstream processor or memory buffer via 64-bit DDR-style buses, all inside one part. Embedded CAM blocks enable histogram-based auto-exposure algorithms that would otherwise need a separate ASIC. The 1.5V core and aggressive clock gating make it acceptable for thermally constrained camera enclosures.
Recommended
Industrial Control and Test Instrumentation
Industrial control and test-and-measurement systems need flexible, re-programmable glue between sensors, ADCs, DACs, and a host controller. The EP2A15F672C7AA's mixed-voltage I/O banks handle legacy 5V-tolerant interfaces via external clamping while the core runs at 1.5V. The four enhanced PLLs generate independent clocks for ADC sampling, DAC reconstruction, and host bus interfaces. Industrial designers benefit from the JTAG in-system programmability for field firmware updates and from the APEX II family being supported by mature Quartus II toolchains (versions 4.x through 9.x).
Recommended
Recommended Products Summary
Engineering reference data for EP2A15F672C7AA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A15F672C7 | EP2A15B724C9 | EP2A15B724C8 | EP2A15B652C9 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) |
| Typical Gates | 600K | 600K | 600K | 600K | 600K |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Maximum User I/O | 492 | 492 | 492 | 492 | 492 |
| Internal Clock | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -7 | -7 | -9 (faster) | -8 (faster) | -9 (faster) |
| Lifecycle | Last-Time-Buy (EOL Nov-Dec 2016) | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Key Differentiators
- 492 user I/O exceeds most contemporary FPGAs in this LE class (vs XC7A15T-2CSG324C)
- Built-in 1 Gbps True-LVDS / HyperTransport I/O capability (vs XC7A15T-2CSG324C)
- Drop-in packing-variant compatibility with EP2A15F672C7 (vs EP2A15F672C7)
Design Notes
The 672-ball FC-FBGA package requires a multi-layer PCB (8+ layers recommended) with controlled-impedance routing and microvia or via-in-pad technology. Use a 1.0 mm ball pitch with sub-2-mil trace/space and matched-length traces on LVDS pairs to maintain the 1 Gbps signaling budget. Reference the Altera APEX II development kit layout and AN 224 (high-speed BGA layout) for layer-stack-up guidance.
Use the Altera PowerPlay early-power-estimator spreadsheet to size the 1.5V core regulator and decoupling network. A minimum of 100 low-ESR ceramic decoupling capacitors (0.1 uF, 0.01 uF, and bulk 22 uF) must be distributed across the die footprint. Observe the power-sequencing rules in the APEX II handbook (VCCINT before VCCIO) to avoid latch-up. Estimated: 16,640 LEs at typical 50% utilization and 300 MHz clock draw approximately 1.8W core power plus I/O bank power.
For 1 Gbps True-LVDS links, route each pair with 100 ohm differential impedance, intra-pair skew below 10 ps, and length-matched to within 50 mil across all lanes in a bus. Use AC-coupling capacitors (100 nF) on the receive path. Reference the Altera LVDS I/O application note (AN 207) for transceiver-specific guidelines. IBIS models for APEX II are available from the Altera website for signal-integrity simulation in HyperLynx or ADS.
Do not assume the EP2A15F672C7AA is in production - it was Last-Time-Buy with EOL dated November-December 2016. New designs should plan to migrate to Cyclone IV GX (EP4CGX15), Cyclone V (5CGXFC7), or Stratix IV (EP4SGX70) for continued supply. When sourcing via brokers, verify lot date code and traceability to mitigate counterfeit risk. The 'AA' suffix in the part number denotes a packing variant - it is NOT a speed-grade or temperature-grade change.
Compliance Information
RoHS compliant per Full-Electronic listing that references device PCN All Dev Pkg Chg 1/Aug/2018. Reach declaration available from Intel FPGA on request. AEC-Q100 not applicable for this commercial-grade FPGA. Halogen-free status not explicitly stated in available data.
