EP2A40B724C7 vs EP2A25B724-C7 Comparison

Detailed side-by-side comparison of EP2A40B724C7 by Intel and EP2A25B724-C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A40B724C7 EP2A25B724-C7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $650.00 $195.00
Family APEX II APEX II
Logic Elements / Cells 38,400 β€”
Total System Gates 1,500,000 β€”
Embedded RAM Bits 655,360 β€”
Maximum User I/O 540 β€”
Core Supply Voltage 1.425 V to 1.575 V (typ. 1.5 V) β€”
Process Technology 0.15 Β΅m CMOS, up to 8 metal layers, all-layer copper 0.15 Β΅m all-layer copper, up to 8 metal layers
Maximum Internal Frequency 562 MHz β€”
PLLs 4 Up to 8
Package 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm 724-BBGA, FCBGA
Operating Temperature 0 Β°C to +85 Β°C (commercial) Commercial (0C to +85C)
I/O Standards Supported LVTTL, LVCMOS, 1.5 V/1.8 V/2.5 V/3.3 V, SSTL, HSTL, PCI, LVDS, LVPECL, PCML, HyperTransport, True-LVDS (1 Gbps) β€”
Configuration Method JTAG (IEEE 1149.1), Passive Serial, Passive Parallel, Active Serial via EPC configuration devices β€”
MultiVolt I/O Support 1.5 V, 1.8 V, 2.5 V, 3.3 V β€”
DDR Memory Support Yes (via ESB / I/O circuitry) β€”
RoHS Status Non-compliant (lead-bearing FCBGA) [DATA_NEEDED: RoHS status]
MSL Level [DATA_NEEDED: MSL level] β€”
Mounting Type Surface Mount (BGA) Surface Mount
Device β€” EP2A25
System Gates β€” 622,592
Logic Elements β€” 24,320
User I/Os β€” 540
Core Voltage β€” 1.5 V
High-Speed Interface β€” True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps
Embedded Memory (ESB) β€” Configurable as 4 Kbit SRAM or product-term logic per ESB
Multi-Voltage I/O β€” 1.5 V / 1.8 V / 2.5 V / 3.3 V banks
Speed Grade β€” C7

Datasheets & Resources

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