EP2A40B724C7 - APEX II FPGA 1.5M Gates 540 I/O FCBGA | Intel (Altera)
MPN: EP2A40B724C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $815.12 | $815.12 |
| 10 | $780 | $7,800.00 |
| 25 | $745.5 | $18,637.50 |
| 100 | $698 | $69,800.00 |
| 250 | $650 | $162,500.00 |
EP2A40B724C7 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital logic through configuration memory after manufacturing. APEX II sits in the device hierarchy as FPGA -> programmable logic -> logic IC -> integrated circuit, combining Look-Up Table (LUT)-based logic, embedded memory blocks, and high-speed I/O on a single die. APEX II specifically targets high-density, high-bandwidth designs that previously required ASICs or custom gate arrays.
Key features of the EP2A40B724C7 include 562 MHz maximum internal operating frequency, 1.5 V core supply (1.425 V to 1.575 V), built-in PLLs for clock management, MultiVolt I/O supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, and dedicated high-speed True-LVDS channels capable of 1 Gbps data rates. The device also provides 4 PLLs, double-data-rate (DDR) support, and in-system programmability through the IEEE 1149.1 JTAG interface.
The APEX II architecture uses a MultiCore architecture combining fine-grain logic elements (LEs), embedded system blocks (ESBs) usable as either dual-port RAM, ROM, or CAM, and FastTrack interconnect. The 0.15 µm copper process enables higher integration density and lower power-per-gate than the 0.18 µm and 0.25 µm predecessors such as APEX 20K and FLEX 10K families.
Typical applications include telecommunications line cards and baseband processing, high-speed serial I/O bridging, network routers and switches, DSP co-processing in test & measurement equipment, and ASIC prototyping. The 540 user I/O count makes it suitable for parallel bus-centric designs such as processor interfaces, memory controllers, and legacy industrial backplanes.
When designing with this device, ensure 1.5 V core decoupling uses low-ESR ceramic capacitors placed within 5 mm of each power pin. The 1.5 V supply must be ramped monotonically to prevent in-rush currents. Configuration via JTAG or passive serial configuration PROM (EPC family) should be validated on the bench before mass production.
This page synthesizes distributor pricing, drop-in compatible APEX II variants, and practical design notes for the EP2A40B724C7 - information not consolidated on any single distributor page.
Drop-in alternatives for EP2A40B724C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40B724C7 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, System Gates, Maximum Internal Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A25B724C7
✅ Drop-In✓ In Stock
$760 / Unit
View Datasheet →EP2A25F724
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$112 / Unit
View Datasheet →EP2A25B724-C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$195 / Unit
View Datasheet →EP2A15B724C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$125 / Unit
View Datasheet →EP2A15B724C9
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$268.5 / Unit
View Datasheet →EP2A15B724C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$185 / Unit
View Datasheet →EP2A40B724C7 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements / Cells | 38,400 |
| Total System Gates | 1,500,000 |
| Embedded RAM Bits | 655,360 |
| Maximum User I/O | 540 |
| Core Supply Voltage | 1.425 V to 1.575 V (typ. 1.5 V) |
| Process Technology | 0.15 µm CMOS, up to 8 metal layers, all-layer copper |
| Maximum Internal Frequency | 562 MHz |
| PLLs | 4 |
| Package | 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm |
| Operating Temperature | 0 °C to +85 °C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, 1.5 V/1.8 V/2.5 V/3.3 V, SSTL, HSTL, PCI, LVDS, LVPECL, PCML, HyperTransport, True-LVDS (1 Gbps) |
| Configuration Method | JTAG (IEEE 1149.1), Passive Serial, Passive Parallel, Active Serial via EPC configuration devices |
| MultiVolt I/O Support | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| DDR Memory Support | Yes (via ESB / I/O circuitry) |
| RoHS Status | Non-compliant (lead-bearing FCBGA) |
| Mounting Type | Surface Mount (BGA) |
EP2A40B724C7 724-ball fcbga (fineline bga), 35 mm x 35 mm Pin Configuration Guide
Pin configuration for EP2A40B724C7 (724-ball fcbga (fineline bga), 35 mm x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40B724C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40B724C7 is suitable for 6 applications: Telecommunications Line Cards, High-Speed Serial I/O Bridging, ASIC Prototyping and Emulation, DSP Co-Processing, Industrial Control and Factory Automation, Legacy Test & Measurement Equipment.
Telecommunications Line Cards
The EP2A40B724C7's 38,400 logic elements and 540 user I/O pins make it well-suited for legacy telecommunications line card designs that aggregate multiple E1/T1 or Ethernet interfaces. The 655,360 bits of embedded RAM allow on-chip buffering of packet payloads, while the four PLLs provide independent clock domains for line-rate serializers. Designers use the APEX II LUT-based fabric to implement TDM framers, HDLC controllers, and protocol converters without external glue logic, with 1 Gbps True-LVDS I/O enabling direct connection to high-speed SERDES. The 1.5 V core and MultiVolt I/O simplify mixed-voltage interfacing with 3.3 V and 2.5 V bus interfaces common in telecom backplanes.
Recommended
High-Speed Serial I/O Bridging
With 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport I/O support, the EP2A40B724C7 functions as a multi-protocol bridge between legacy parallel buses and high-speed serial links. Its 562 MHz internal fabric can sustain serialization/deserialization at gigabit line rates while running protocol state machines, CRC engines, and link training logic in the LUT fabric. The 655 Kb of embedded RAM buffers protocol headers and payloads, and the four PLLs generate the required bit-clock, word-clock, and oversampled clocks for clock-data recovery. This makes the device suitable for proprietary backplane bridges, switch fabric interfaces, and ASIC prototyping where multiple serial protocols converge.
Recommended
ASIC Prototyping and Emulation
The 1.5 million system gates and 38,400 logic elements provide enough capacity to prototype mid-complexity ASIC designs (typically up to 500k ASIC gates) at near-real-time speeds. Engineers map ASIC RTL into the APEX II LUT fabric, leverage embedded system blocks (ESBs) for dual-port RAM and ROM, and use the 540 I/O pins to fan out to external peripherals that mimic the final ASIC environment. The 1.5 V core and high-speed I/O enable direct co-simulation with ASIC verification testbenches. Quartus II provides incremental compile and SignalTap logic analyzer support, accelerating iterative debug cycles for ASIC sign-off.
Recommended
DSP Co-Processing
The EP2A40B724C7 can co-process DSP algorithms in parallel with a host CPU or DSP chip, accelerating FIR filters, FFTs, and image-processing kernels. The 655 Kb of embedded RAM serves as coefficient storage and data buffers, while the 38,400 logic elements implement wide datapaths with high gate utilization. The four PLLs enable multiple clock domains for sample-rate conversion and oversampling. The MultiVolt I/O connects seamlessly to 3.3 V DSP peripherals, and the 540 I/O count supports wide parallel interfaces to external SRAM or SDRAM banks used as scratch memory.
Recommended
Industrial Control and Factory Automation
Industrial control systems benefit from the EP2A40B724C7's high I/O count and embedded memory for handling multiple sensor inputs, motor control loops, and communication protocols simultaneously. The 0 °C to 85 °C commercial temperature range suits factory-floor enclosures. The 540 I/O pins interface with parallel sensor arrays, encoder inputs, and PWM outputs, while the LUT fabric implements PLC-style ladder logic, PID controllers, and fieldbus protocol stacks. The 1.5 V core and selectable I/O voltages connect to legacy 5 V-tolerant peripherals through proper bank voltage selection.
Recommended
Legacy Test & Measurement Equipment
Test and measurement instruments such as logic analyzers, protocol testers, and signal generators use the EP2A40B724C7 to capture and process high-speed data streams. Its 562 MHz internal frequency and 1 Gbps LVDS I/O enable real-time pattern generation and acquisition, while the 655 Kb of embedded RAM buffers sample data before offloading to host processors. The four PLLs synchronize sample clocks with trigger sources, and the 540 user I/Os connect to multiple parallel probe channels. Quartus II SignalTap integration provides on-chip logic analyzer capability for hardware debug.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40B724C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A25B724C7 | EP2A25F724 | EP2A25B724-C7 | EP2A15B724C7 | EP2A15B724C9 |
|---|---|---|---|---|---|---|
| Package | 724-ball FCBGA (35x35) | 724-ball FCBGA (35x35) - same | 724-ball FCBGA (35x35) - same | 724-ball FCBGA (35x35) - same | 724-ball FCBGA (35x35) - same | 724-ball FCBGA (35x35) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 38,400 | 25,000 (-35%) | 25,000 (-35%) | 25,000 (-35%) | 15,800 (-59%) | 15,800 (-59%) |
| Total System Gates | 1.5 M | 1.0 M (-33%) | 1.0 M (-33%) | 1.0 M (-33%) | 0.6 M (-60%) | 0.6 M (-60%) |
| Embedded RAM Bits | 655,360 | 425,984 (-35%) | 425,984 (-35%) | 425,984 (-35%) | 270,336 (-59%) | 270,336 (-59%) |
| Core Voltage | 1.5 V (1.425 V - 1.575 V) | 1.5 V (1.425 V - 1.575 V) - same | 1.5 V (1.425 V - 1.575 V) - same | 1.5 V (1.425 V - 1.575 V) - same | 1.5 V (1.425 V - 1.575 V) - same | 1.5 V (1.425 V - 1.575 V) - same |
| Speed Grade | C7 (commercial, speed bin 7) | C7 - same | F speed grade (lower) | C7 - same | C7 - same | C9 (faster) |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C - same | 0 °C to 85 °C - same | 0 °C to 85 °C - same | 0 °C to 85 °C - same | 0 °C to 85 °C - same |
| RoHS Status | Non-compliant (Pb-bearing BGA) | Non-compliant (Pb-bearing BGA) | Non-compliant (Pb-bearing BGA) | Non-compliant (Pb-bearing BGA) | Non-compliant (Pb-bearing BGA) | Non-compliant (Pb-bearing BGA) |
Key Differentiators
- Highest-density APEX II in 724-ball FCBGA package (vs EP2A25B724C7)
- Faster C7 speed grade (vs EP2A25F724)
- 540 user I/Os vs 503 in 672-ball package variant (vs EP2A40F672C7)
- Larger embedded memory (vs EP2A15B724C7)
Design Notes
The EP2A40B724C7 requires a 1.5 V core supply with 1.425 V to 1.575 V tolerance. Place at least four 10 µF X5R ceramic decoupling capacitors within 5 mm of the VCCINT pins, plus 0.1 µF and 1 nF capacitors at every VCC/GND pair. Estimated worst-case core current is 2-3 A depending on design utilization; verify with the Quartus II PowerPlay analyzer before finalizing the power tree. The 1.5 V rail must ramp monotonically to within the operating range in less than 100 ms to prevent in-rush current latch-up.
Although the FCBGA package provides low thermal resistance (estimated θJA ~10-12 °C/W with 4-layer JEDEC PCB), the APEX II EP2A40 can dissipate 5-10 W in fully-utilized high-speed designs. The user I/O bank voltages (VCCIO) generate additional heat proportional to switching activity. Place thermal vias in the BGA land pattern to provide a thermal path to internal copper planes. For industrial applications near the upper temperature limit, consider a heatsink or airflow to keep junction temperature below 125 °C.
The 724-ball FCBGA uses a 1.27 mm ball pitch. All balls are arranged in a staggered array; follow Altera's recommended land pattern exactly and use NSMD (non-solder mask defined) pads for better solder joint reliability. The 35 mm x 35 mm package body requires microvia or stacked-via technology on standard 4-layer PCBs to break out all balls to inner routing layers. Avoid placing vias in the thermal pad pattern to maximize solder joint thermal conductivity.
Common pitfalls with the EP2A40B724C7 include: (1) over-driving the JTAG TCK pin beyond 10 MHz which can corrupt configuration; (2) leaving VCCIO bank pins floating which may cause indeterminate logic levels at power-up; (3) failing to instantiate the nCONFIG, nSTATUS, and CONF_DONE pull-up resistors per the APEX II datasheet, leading to configuration failures; (4) using a non-compliant Pb-free reflow profile on the lead-bearing FCBGA which causes solder joint voids. Always validate configuration with the Quartus II programmer before depopulating the board.
At 1 Gbps True-LVDS data rates, the EP2A40B724C7 requires controlled-impedance differential routing (typically 100 Ω differential) with matched lengths within 5 mils to minimize skew. Use 4-layer or higher PCB stackups with a continuous ground reference plane under high-speed traces. The 540 user I/Os include shared LVDS and LVPECL pairs; assign them carefully in the Quartus II pin planner to avoid adjacent aggressor coupling. Use series AC-coupling capacitors (100 nF) on all 1 Gbps LVDS links per the APEX II Hardware Design Guidelines.
Compliance Information
Lead-bearing FCBGA package is not RoHS compliant. Altera introduced RoHS variants with the 'N' suffix (e.g. EP2A40B724C7N). Reach, halogen-free, and conflict-minerals data not present in the Verified Web Data and should be obtained from the manufacturer lot documentation if required.
