EP2A40F1020I8 vs EP2A40F1020C8N Comparison
Detailed side-by-side comparison of EP2A40F1020I8 by Intel and EP2A40F1020C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A40F1020I8 | EP2A40F1020C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $175.00 | $0.00 |
| Family | APEX II | β |
| Logic Elements | 2,560 (40,000 max with embedded array blocks) | β |
| Typical Gates | 38,400 | β |
| System Gates | 655,360 | β |
| User I/O Pins | 735 | β |
| Package | 1020-ball FineLine BGA (FBGA) | β |
| Process Technology | 0.18 micron CMOS | β |
| Embedded RAM Bits | 409,600 (via EABs) | β |
| Operating Temperature | -40C to +85C (Industrial) | 0 Β°C to 85 Β°C |
| Supply Voltage (Core) | [DATA_NEEDED: core voltage] | β |
| Supply Voltage (I/O) | [DATA_NEEDED: I/O voltage] | β |
| I/O Banks | 8 | β |
| PLLs | [DATA_NEEDED: PLL count] | β |
| Configuration Modes | JTAG, Passive Serial, Passive Parallel, Synchronous | β |
| In-System Programmability | Yes | β |
| RoHS Status | Depends on lot - check manufacturer declaration | unknown |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Product Type | β | Field-Programmable Gate Array (FPGA) |
| Device Family | β | APEX II |
| Logic Technology | β | CMOS |
| Logic Gates | β | 1.5 million |
| Logic Cells | β | 38,400 |
| Nominal Supply Voltage | β | 1.5 V |
| Supply Voltage Range | β | 1.425 V to 1.575 V |
| User I/Os | β | 735 |
| Package Terminal Count | β | 1,020 pins |
| Package Type | β | FC-FBGA, BGA-1020 |
| Package Body Size | β | 33 mm x 33 mm |
| Ball Pitch | β | 1 mm |
| Reported Operating Frequency | β | 376 MHz |
| Alternative Reported Frequency | β | 562 MHz |
| Reported Propagation Delay | β | 1.78 ns |
| Alternative Reported Propagation Delay | β | 1.55 ns |
| Fabrication Process | β | 0.15 Β΅m |
| Maximum Reported Metal Layers | β | 8 layers |
| Terminal Form | β | Ball |
| REACH Status | β | unknown |
| AEC-Q100 Qualification | β | unknown |