EP2A40F1020C8N - 1.5M-Gate APEX II FPGA | Intel | Industrial Logic
MPN: EP2A40F1020C8N ✗ End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2A40F1020C8N Overview
A field-programmable gate array, or FPGA, is a semiconductor device whose logic architecture, interconnections, and I/O behavior can be configured after manufacture. FPGAs occupy the programmable-logic tier between fixed-function application-specific integrated circuits and software-defined processors. APEX II devices combine reusable logic resources, programmable routing, embedded memory, and high-speed differential I/O, making them suitable for parallel data processing, communications, and industrial control. Within the semiconductor hierarchy, EP2A40F1020C8N is an FPGA, programmable logic device, CMOS integrated circuit, and programmable semiconductor.
Its principal engineering attributes include 1.5 million gates, 38,400 cells, 735 user I/Os, and 1,020 BGA terminals. The reported logic process is 0.15 µm, while the package is described as 1020-pin FC-FBGA or BGA-1020 with a 33 mm by 33 mm body and 1 mm pitch. A 1.425 V to 1.575 V operating-supply range surrounds the nominal 1.5 V rail. These characteristics support systems that need dense parallel logic and many external interfaces.
The APEX II architecture combines programmable logic cells with routing resources and dedicated I/O structures. The verified APEX II family documentation also describes 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport capabilities. Such interfaces permit point-to-point high-speed connections, although implementation requires the configuration, termination, and timing rules in the manufacturer datasheet. The 735 user I/O count gives designers substantial interface capacity, but power integrity and simultaneous-signal performance depend on board-level implementation.
Typical applications include industrial automation, communications equipment, high-speed digital signal processing, protocol bridging, and test or measurement systems. The FPGA can implement parallel datapaths and control functions in one device, while the high pin count accommodates numerous buses, differential links, and memory or peripheral interfaces. The commercial temperature grade is reported as 0 °C to 85 °C, so systems intended for wider ranges require qualification and may need another device.
Designers should first resolve the conflicting frequency and propagation-delay values against the exact APEX II family datasheet and selected speed-grade data. A fine-pitch 1,020-ball package also demands controlled-impedance routing, robust power distribution, correct decoupling, thermal analysis, and manufacturer-recommended BGA assembly. The nominal 1.5 V rail must remain within the stated 1.425 V to 1.575 V range.
This page combines verified device specifications, package and supply constraints, source traceability, and practical replacement guidance. Because the cross-reference search returned no verified pin-compatible alternatives, engineers should use the EP2A40F1020C8N ordering code and APEX II datasheet as the controlling records when evaluating substitutes or planning board redesigns.
Drop-in alternatives for EP2A40F1020C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40F1020C8N (same form factor and footprint) — differing in Package, Process Technology, System Gates, Operating Temperature, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →EP2A40F1020C8N Maximum Ratings & Electrical Characteristics
| Product Type | Field-Programmable Gate Array (FPGA) |
| Device Family | APEX II |
| Logic Technology | CMOS |
| Logic Gates | 1.5 million |
| Logic Cells | 38,400 |
| Nominal Supply Voltage | 1.5 V |
| Supply Voltage Range | 1.425 V to 1.575 V |
| User I/Os | 735 |
| Package Terminal Count | 1,020 pins |
| Package Type | FC-FBGA, BGA-1020 |
| Package Body Size | 33 mm x 33 mm |
| Ball Pitch | 1 mm |
| Reported Operating Frequency | 376 MHz |
| Alternative Reported Frequency | 562 MHz |
| Reported Propagation Delay | 1.78 ns |
| Alternative Reported Propagation Delay | 1.55 ns |
| Fabrication Process | 0.15 µm |
| Maximum Reported Metal Layers | 8 layers |
| Operating Temperature | 0 °C to 85 °C |
| Mounting Type | Surface Mount |
| Terminal Form | Ball |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
EP2A40F1020C8N 33 mm x 33 mm Pin Configuration Guide
Pin configuration for EP2A40F1020C8N (33 mm x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40F1020C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40F1020C8N is suitable for 6 applications: Industrial Automation Control, Communications Protocol Equipment, High-Speed Data Acquisition, Test and Measurement Instrumentation, Digital Signal Processing Back-End, Legacy Embedded System Maintenance.
Industrial Automation Control
EP2A40F1020C8N fits industrial automation control when a design needs dense programmable logic, 735 user I/Os, and multiple parallel interfaces in one BGA device. Its 1.5 million gates and 38,400 cells can support machine-control state machines, sensor aggregation, actuator sequencing, and communications glue logic. The 1.5 V nominal supply requires a tightly regulated 1.425 V to 1.575 V rail, while the reported 0 °C to 85 °C operating range must be checked against the cabinet environment. Engineers should use the exact APEX II configuration flow, preserve the legacy pin assignments, and validate timing with the selected device documentation.
Recommended
Communications Protocol Equipment
EP2A40F1020C8N can implement protocol bridging, packet handling, channel coding, and high-speed interface adaptation in communications equipment. The APEX II family documentation describes 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport capabilities, making differential I/O a relevant system consideration. Its 735 user I/Os allow several narrow or wide interfaces to be consolidated, while 38,400 cells provide capacity for parallel datapath processing. Because the supplied sources report both 376 MHz and 562 MHz figures, frequency planning must rely on the exact family datasheet and the interface-specific timing conditions rather than an unverified headline number.
Recommended
High-Speed Data Acquisition
EP2A40F1020C8N is suitable for data-acquisition systems that need many interface signals, parallel processing, and configurable timing. The device’s 735 user I/Os can connect to ADC or DAC controls, data buses, clocks, status signals, and downstream processing blocks, while 38,400 cells support buffering, formatting, and trigger logic. The 1.5 V rail and reported 1.55 ns or 1.78 ns propagation-delay values make power-integrity and timing closure important. Confirm the actual source of the timing figures, observe the 1.425 V to 1.575 V supply range, and model the complete acquisition path before committing the device to a new design.
Recommended
Test and Measurement Instrumentation
EP2A40F1020C8N can serve in test and measurement equipment where programmable sequencing, multiple instrument interfaces, and deterministic parallel logic are required. The FPGA’s 1.5 million gates and 38,400 cells allow control, capture, formatting, and communication functions to be integrated around an acquisition subsystem. The 1,020-ball BGA provides 735 user I/Os for instrument buses, clock distribution, and service interfaces, but signal integrity depends on controlled impedance and correct decoupling. Since the component is marked obsolete, existing instrumentation should be supported through controlled inventory and verified configuration files while new platforms evaluate a currently supported FPGA family.
Recommended
Digital Signal Processing Back-End
EP2A40F1020C8N fits a digital signal-processing back-end that needs parallel arithmetic, buffering, and interface adaptation. Its 38,400 cells and 1.5 million gates provide a broad programmable fabric for filters, framing, control, and data movement, while the APEX II family’s high-speed differential interface descriptions support suitable external links when the selected I/O mode is supported. The design must distinguish the conflicting 376 MHz, 562 MHz, 1.55 ns, and 1.78 ns source figures. Confirm resource utilization, clock domains, I/O-bank restrictions, and configuration support in the manufacturer documentation; the supplied web data does not provide a power, thermal, or DSP-performance limit.
Recommended
Legacy Embedded System Maintenance
EP2A40F1020C8N is most valuable in legacy embedded-system maintenance where the original APEX II architecture, package, and board footprint must remain stable. The 1,020-ball BGA, 735 user I/Os, 1.5 V nominal supply, and 33 mm by 33 mm package description provide a useful identity set for inventory and replacement investigations. A maintenance team can use the family documentation to preserve configuration flow, differential I/O choices, and board timing assumptions. Because no verified cross-brand drop-in alternative is available, replacement planning should include date-code review, counterfeit-risk controls, formal equivalence testing, and a possible PCB redesign if an obsolete-source component cannot be secured.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40F1020C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40F1020C8 | EP2A40F1020C7N | EP2A40F1020C7 | EP2A40F1020C6N | EP2A40F1020C6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FC-FBGA, BGA-1020 | FC-FBGA, BGA-1020 | FC-FBGA, BGA-1020 | FC-FBGA, BGA-1020 | FC-FBGA, BGA-1020 | FC-FBGA, BGA-1020 |
| Product Type | FPGA | FPGA | FPGA | FPGA | FPGA | FPGA |
| Logic Gates | 1.5 million | 1.5 million | 1.5 million | 1.5 million | 1.5 million | 1.5 million |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Nominal Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| User I/Os | 735 | 735 | 735 | 735 | 735 | 735 |
| Reported Frequency | 376 MHz; alternative source reports 562 MHz | 376 MHz; alternative source reports 562 MHz | 376 MHz; alternative source reports 562 MHz | 376 MHz; alternative source reports 562 MHz | 376 MHz; alternative source reports 562 MHz | 376 MHz; alternative source reports 562 MHz |
| Reported Propagation Delay | 1.78 ns; alternative source reports 1.55 ns | 1.78 ns; alternative source reports 1.55 ns | 1.78 ns; alternative source reports 1.55 ns | 1.78 ns; alternative source reports 1.55 ns | 1.78 ns; alternative source reports 1.55 ns | 1.78 ns; alternative source reports 1.55 ns |
Key Differentiators
- High user-I/O density in a legacy 1,020-ball BGA (vs EP2A40F1020C7N)
- Established APEX II logic capacity (vs EP2A40F1020C6N)
- Nominal 1.5 V APEX II supply context (vs EP2A40F1020C7)
Design Notes
Design the 1.5 V core rail to stay within the reported 1.425 V to 1.575 V range under load, temperature, line variation, and load-step transients. Use the APEX II family power-connection and decoupling guidance, place local capacitors at the correct power balls, and provide a low-impedance return path. The supplied data does not provide maximum current or a power-dissipation value, so do not calculate a final thermal margin from an assumed current. Confirm regulator rating, capacitor derating, and FPGA power model before release.
Use the manufacturer’s 1,020-ball package drawing and ball map to generate the footprint, not a generic BGA library. The package is described as 33 mm by 33 mm with 1 mm pitch; verify land diameter, solder-mask opening, via-in-pad or dog-bone escape, and layer stack-up with the assembly house. Since 735 balls are available as user I/Os, reserve power, ground, clock, and configuration balls before assigning high-speed signals, and review simultaneous-switching and return-current paths.
For high-speed differential interfaces, start with the APEX II family documentation describing 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport capabilities, but treat those as family-level claims. Verify the selected I/O mode, bank voltage, differential-pair geometry, termination scheme, receiver requirements, and timing budget from the exact device documentation. The source data provides conflicting frequency and delay values, so do not use 376 MHz, 562 MHz, 1.55 ns, or 1.78 ns without resolving the intended condition and configuration.
The supplied data does not state thermal resistance, maximum junction temperature, or a maximum power figure for EP2A40F1020C8N. Therefore, a junction-temperature estimate would be fabricated unless the missing package and power data are obtained. After obtaining those values, estimate heat rise from power dissipation, ambient temperature, airflow, and the package thermal model; label the result as an estimate. The reported 0 °C to 85 °C operating range also requires system-level temperature verification, especially in enclosed industrial or communications equipment.
Do not treat the obsolete classification, conflicting timing numbers, or an alternative suffix as proof of interchangeability. EP2A40F1020C8N, EP2A40F1020C8, EP2A40F1020C7N, EP2A40F1020C7, EP2A40F1020C6N, and EP2A40F1020C6 are shown as same-family package candidates, but the provided data does not prove full electrical or functional equivalence. Before substitution, compare the complete ordering code, package drawing, ball map, supply limits, I/O modes, configuration interface, speed grade, and timing table. If those records do not match, treat the part as a redesign-level alternative.
Compliance Information
The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for EP2A40F1020C8N. Obtain the manufacturer declaration for the exact ordering code before relying on any compliance claim.
