EP2A40F672C6N vs EP2A40F672C8 Comparison
Detailed side-by-side comparison of EP2A40F672C6N by Intel and EP2A40F672C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A40F672C6N | EP2A40F672C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $165.00 | $68.00 |
| Family | APEX II | APEX II |
| Logic Elements | 40,000 | β |
| Maximum System Gates | 1,125,000 | β |
| Embedded RAM Bits | 442,368 | β |
| Embedded System Blocks (ESBs) | 160 | β |
| Maximum User I/O Pins | [DATA_NEEDED: maximum user I/O count] | β |
| Core Voltage | 1.5 V | β |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V | β |
| Package | 672-ball FineLine BGA | β |
| Operating Temperature | Commercial (0C to +85C) | 0 C to 85 C (commercial) |
| Speed Grade | C6 (per part number suffix) | β |
| Configuration Methods | Passive Serial, Passive Parallel, JTAG | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | β |
| Process Technology | SRAM-based, 0.18 um (per family datasheet) | 0.15-micron all-layer copper, up to 8 metal layers |
| PLL Count | [DATA_NEEDED: PLL count] | β |
| Logic Family | β | CMOS |
| Typical Logic Elements (LEs) | β | 40,000 |
| Embedded Memory | β | Up to 1.5 Mbits |
| User I/Os | β | 492 pins |
| Number of Pins | β | 672 |
| Package Type | β | FineLine BGA, 27 x 27 mm, 1.0 mm pitch |
| Propagation Delay (speed grade C8) | β | 1.55 ns |
| Phase-Locked Loops (PLLs) | β | 4 |
| LVDS Signaling Support | β | Up to 1 Gbps |
| Multipliers | β | Embedded multiplier blocks |
| I/O Standards | β | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS |