EP2A40F672C6N - APEX II FPGA 40K LE FBGA-672 | Intel
MPN: EP2A40F672C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $210 | $21,000.00 |
| 500 | $185 | $92,500.00 |
| 1,000 | $165 | $165,000.00 |
EP2A40F672C6N Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic through configuration of on-chip lookup tables, embedded memory blocks, and routing resources. APEX II sits in the hierarchy between low-density CPLDs and high-end SoC FPGAs, providing high logic density for data-path, DSP, and multi-protocol bridging applications. The EP2A40 is the largest member of the APEX II family, doubling the logic capacity of the EP2A25 while maintaining the same Quartus II design flow.
Key features include MultiVolt I/O support for direct interfacing to 1.8 V, 2.5 V, 3.3 V, and 5 V buses without level shifters, dedicated clock management with PLL-based clock tree synthesis, and high-bandwidth embedded memory suitable for FIFO, dual-port RAM, and content-addressable memory. The FastTrack interconnect provides predictable timing across the entire device, simplifying timing closure for wide data buses. The 672-ball FineLine BGA package exposes the maximum number of user I/O for the EP2A40 die, making it suitable for high-pin-count interface aggregation.
The APEX II architecture combines four-input look-up tables grouped into Logic Array Blocks (LABs), each LAB containing ten LEs plus local interconnect. ESBs (Embedded System Blocks) provide 2 Kbits of dual-port RAM each and can be cascaded to form wider or deeper memories. The device supports LVTTL, LVCMOS, PCI, GTL+, SSTL, and HSTL I/O standards, with per-pin slew-rate and drive-strength control. Configuration is supported via passive serial, passive parallel synchronous, passive parallel asynchronous, and JTAG modes.
Typical applications include high-speed data-path bridging, multi-channel protocol conversion (e.g., SPI to parallel), glue-logic aggregation in ASIC prototypes, telecom line-card backplane interfacing, and industrial imaging pre-processing. The large logic capacity supports soft-core processor implementations such as the Nios embedded processor within the Quartus II tool flow. The wide I/O count enables direct connection to DDR-style memory buses and parallel ADC/DAC interfaces.
Designers should verify availability before starting new designs because APEX II is an older-generation family that has been superseded by Cyclone, Arria, and Stratix families. Existing designs typically rely on the Quartus II v5.0 or earlier toolchain for synthesis, place-and-route, and timing analysis. Power estimation should include both static and dynamic components, with thermal management important at high toggle rates.
This page synthesizes distributor stock signals, drop-in same-package variants within the APEX II family, and practical design notes not found in a single manufacturer document.
Drop-in alternatives for EP2A40F672C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40F672C6N (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Operating Temperature, System Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40F672C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →EP2A40F672I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198 / Unit
View Datasheet →EP2A40F672C6
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EP2A40F1020C6N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP2A40F1020C7N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP2A40F1020I7N
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EP2A40F672C6N Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements | 40,000 |
| Maximum System Gates | 1,125,000 |
| Embedded RAM Bits | 442,368 |
| Embedded System Blocks (ESBs) | 160 |
| Core Voltage | 1.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL, 1.8V/2.5V/3.3V/5V |
| Package | 672-ball FineLine BGA |
| Operating Temperature | Commercial (0C to +85C) |
| Speed Grade | C6 (per part number suffix) |
| Configuration Methods | Passive Serial, Passive Parallel, JTAG |
| Mounting Type | Surface Mount |
| Process Technology | SRAM-based, 0.18 um (per family datasheet) |
EP2A40F672C6N 672-ball fineline bga Pin Configuration Guide
Pin configuration for EP2A40F672C6N (672-ball fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A40F672C6N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A40F672C6N is suitable for 6 applications: High-Density ASIC Prototyping, Multi-Protocol Bridge and Interface Aggregation, Telecom Line Card Backplane Interface, Industrial Imaging Pre-Processing Pipeline, Digital Signal Processing Pre-Processor, Legacy Avionics and Defense Retrofit.
High-Density ASIC Prototyping
The EP2A40F672C6N provides approximately 40,000 logic elements and 442 Kbits of embedded SRAM, making it suitable for prototyping complex ASIC designs before tape-out. Its APEX II architecture mirrors mid-range ASIC gate-array structures, allowing RTL to be validated on real hardware. The 672-ball FineLine BGA exposes enough user I/O to map wide ASIC buses, and the Quartus II flow supports incremental compilation for fast design iterations.
Recommended
Multi-Protocol Bridge and Interface Aggregation
With MultiVolt I/O supporting 1.8 V, 2.5 V, 3.3 V, and 5 V standards simultaneously and over 400 user I/O pins, the EP2A40F672C6N is ideal for bridging between legacy and modern buses in telecom and industrial systems. Engineers use it to aggregate SPI, I2C, UART, and parallel interfaces into a single high-speed link. The 160 embedded system blocks provide FIFO buffers for protocol conversion without external memory.
Recommended
Telecom Line Card Backplane Interface
The EP2A40F672C6N's high logic capacity and MultiVolt I/O make it well suited for telecom line cards that aggregate TDM, Ethernet, and serial RapidIO traffic across a backplane. Its HSTL and SSTL I/O support enables direct connection to high-speed memory buses used in packet buffering. The device's FastTrack interconnect provides deterministic timing required for backplane-grade signal integrity at rates up to 133 MHz.
Recommended
Industrial Imaging Pre-Processing Pipeline
Industrial camera and machine-vision systems benefit from the EP2A40F672C6N's combination of wide LVCMOS/LVTTL I/O for direct camera-sensor connection and embedded dual-port RAM for line-buffer storage. The 40,000 logic elements support real-time Bayer demosaicing, color-space conversion, and histogram equalization at pixel-clock rates up to 80 MHz. Its commercial temperature range suits factory-floor enclosures with controlled climate.
Recommended
Digital Signal Processing Pre-Processor
The EP2A40F672C6N integrates 442 Kbits of embedded SRAM and supports up to 160 ESBs which can implement multiplier arrays and shift-register FIR filters. With 40,000 logic elements it can host multi-channel audio DSP, software-defined radio baseband processing, or pre-DSP filtering before handing off to a dedicated DSP or ASIC. The high I/O count enables direct connection to parallel ADC and DAC devices.
Recommended
Legacy Avionics and Defense Retrofit
Many long-lifecycle avionics, defense, and industrial-automation platforms continue to require APEX II logic for spare-part and obsolescence-management reasons. The EP2A40F672C6N serves as a form-fit-function replacement for boards originally designed around APEX II in MIL-STD-1553, ARINC 429, and proprietary backplane systems. The 672-ball FineLine BGA matches existing PCB footprints, avoiding costly board respins.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40F672C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40F672C7N | EP2A40F672I7N | EP2A40F672C6 | EP2A40F1020C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FineLine BGA | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 1020-pin BGA - larger |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 |
| Speed Grade | C6 | C7 (faster) | I7 | C6 | C6 |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C |
| Embedded System Blocks | 160 | 160 | 160 | 160 | 160 |
| Embedded RAM | 442,368 bits | 442,368 bits | 442,368 bits | 442,368 bits | 442,368 bits |
| Lead-Free (N suffix) | Yes | Yes | Yes | No (lead-bearing) | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-package speed grade upgrade (vs EP2A40F672C7N)
- Industrial temperature option in same package (vs EP2A40F672I7N)
- Higher I/O count in larger package (vs EP2A40F1020C6N)
Design Notes
The EP2A40F672C6N core operates from a 1.5 V supply with separate VCCIO bank voltages for MultiVolt I/O. Per the APEX II datasheet, the I/O banks must each be decoupled with 0.1 uF and 10 uF capacitors placed within 5 mm of each bank-supply pin. The PLL analog supply (VCC_PLL) requires its own filtered 1.5 V rail to avoid jitter from core switching noise.
Estimated: at 100% toggle rate across all 40,000 logic elements with typical 25% switching activity, the EP2A40F672C6N dissipates approximately 3-5 W. The 672-ball FineLine BGA has a junction-to-ambient thermal resistance (theta_JA) of approximately 12-15 C/W on a 4-layer JEDEC test board. Designers should provide thermal vias under the BGA and at least a 2 oz copper pour on inner layers for reliable operation above 2 W.
Route all differential pairs (LVDS, GTL+) with 100 ohm differential impedance and matched lengths within 150 mil. Each ESB clock pin should be routed with controlled impedance and isolated from data signals by a ground guard trace. The configuration PROM (EPC16 or EPC8) should be placed within 2 inches of the FPGA DATA, DCLK, and nCONFIG pins to avoid configuration failures.
Do not mix 5 V and 3.3 V signals on the same I/O bank - each VCCIO bank must be tied to a single voltage level. Floating inputs can cause oscillation and excess Icc; all unused I/O pins must be set as outputs or tri-stated with the internal weak pull-up enabled. Configuration failures are commonly caused by missing or improperly sized pull-up resistors on nSTATUS, CONF_DONE, and nCONFIG pins.
Compliance Information
Lead-free status confirmed by 'N' suffix per Altera/Intel ordering code convention. RoHS, REACH, and halogen-free status not extracted from verified web data; consult the manufacturer declaration or distributor certificate of conformance for current compliance status.
