EP2A40F672C7N vs EP2A40F672C8N Comparison

Detailed side-by-side comparison of EP2A40F672C7N by Intel and EP2A40F672C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A40F672C7N EP2A40F672C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $198.00 $122.00
Family APEX II APEX II
Logic Elements / Cells 38,400 38,400
System Gates 1.5 M 1.5 M
Maximum User I/Os 492 β€”
Propagation Delay (tpd) 1.55 ns β€”
Internal Performance 562 MHz β€”
Process Technology 0.15 Β΅m CMOS, all-layer copper, up to 8 metal layers β€”
Core Voltage 1.5 V β€”
MultiVolt I/O Support 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V β€”
Logic Family CMOS CMOS
Package 672-ball FC-FBGA (FineLine BGA), S-PBGA-B672, 27 x 27 mm, 1.0 mm pitch β€”
Mounting Type Surface Mount β€”
Operating Temperature 0 Β°C to 85 Β°C (commercial, 'C' grade) β€”
Speed Grade 7 C8
Lead-Free / RoHS Yes (N suffix) β€”
Configuration Modes Passive Serial, Passive Parallel, JTAG β€”
Series β€” EP2A40
Maximum Operating Frequency β€” 376 MHz
Propagation Delay β€” 1.55 ns
Technology Node β€” 0.15 Β΅m
Process Feature β€” All-layer copper, up to 8 metal layers
Nominal Supply Voltage (VCCINT) β€” 1.5 V
Supply Voltage Range β€” 1.425 V to 1.575 V
User I/Os β€” 492
Number of Pins / Balls β€” 672
Package Type β€” FC-FBGA (FineLine BGA)
Package Dimensions β€” 27 x 27 mm
Ball Pitch β€” 1.0 mm
LVDS Data Rate β€” 1 Gbps
Embedded PLLs β€” 4
Programming Interface β€” JTAG (IEEE 1149.1)
Operating Temperature (Commercial) β€” 0 Β°C to 85 Β°C
RoHS Status β€” [DATA_NEEDED: RoHS status]

Datasheets & Resources

Browse All Products Create BOM Request Quote