EP2A40F672C7N - APEX II FPGA 1.5M Gates 672-BGA | Intel
MPN: EP2A40F672C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 250 | $220 | $55,000.00 |
| 500 | $198 | $99,000.00 |
EP2A40F672C7N Overview
What is a high-density FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hardware blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. APEX II sits in the high-density tier of the taxonomy: FPGA -> programmable logic device (PLD) -> programmable logic IC -> integrated circuit. APEX II was engineered for systems that combine glue logic, datapath arithmetic, on-chip memory, and high-speed serial I/O on a single silicon die, replacing multiple discrete ASICs and reducing BOM cost and board area.
Key features of the EP2A40F672C7N include 38,400 logic elements, 1.5 M system gates, 492 user I/Os, 1.55 ns propagation delay, 562 MHz internal performance, MultiVolt I/O support for interfacing with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic families, and a 0.15-µm copper CMOS process. The 'C7' speed grade denotes the commercial temperature range 0 °C to 85 °C with a specific timing closure. The 'N' suffix indicates a lead-free, RoHS-compliant FC-FBGA package. The device supports in-system configuration via passive serial, passive parallel, and JTAG modes, allowing rapid prototyping and field upgrades.
Typical applications for the EP2A40F672C7N include 1 Gbps+ networking line cards, custom datapath accelerators, telecommunications backplanes, broadband aggregation, DSP co-processing, and legacy ASIC replacement in telecommunications and storage infrastructure. The large gate count and abundant I/O make it well suited to designs that previously required multiple smaller FPGAs. The MultiVolt I/O simplifies interfacing with legacy 5 V ASICs, memory, and bus transceivers.
When designing with the EP2A40F672C7N, ensure the 672-ball FC-FBGA land pattern is matched exactly - this is a 27 x 27 mm, 1.0 mm pitch FineLine BGA that requires PCB microvia stackups and controlled-impedance routing. Decoupling must follow the manufacturer reference design, and unused I/O banks should be configured as outputs driving '0' or tied to defined logic levels. This page synthesizes distributor pricing, pin-compatible APEX II family drop-ins, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2A40F672C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A40F672C7N (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Operating Temperature, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A40F672C7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A40F672C7ES
✅ Drop-In✓ In Stock
$124.75 / Unit
View Datasheet →EP2A40F672C6N
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP2A40F672C6
✅ Drop-In✓ In Stock
$105 / Unit
View Datasheet →EP2A25F672C7N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP20K600CF672C7N
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EP2A40F672C7N Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements / Cells | 38,400 |
| System Gates | 1.5 M |
| Maximum User I/Os | 492 |
| Propagation Delay (tpd) | 1.55 ns |
| Internal Performance | 562 MHz |
| Process Technology | 0.15 µm CMOS, all-layer copper, up to 8 metal layers |
| Core Voltage | 1.5 V |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Logic Family | CMOS |
| Package | 672-ball FC-FBGA (FineLine BGA), S-PBGA-B672, 27 x 27 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to 85 °C (commercial, 'C' grade) |
| Speed Grade | 7 |
| Lead-Free / RoHS | Yes (N suffix) |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG |
EP2A40F672C7N Pin Configuration
| Pin A1 | I/O BANK 1 — User I/O, MultiVolt (1.5 V - 5.0 V); see datasheet ball map for exact signal |
| Pin A2 | I/O BANK 1 — User I/O, MultiVolt (1.5 V - 5.0 V) |
| Pin AB26 | GND — Ground reference |
| Pin AB25 | VCCINT — 1.5 V core supply |
| Pin AB1 | TCK — JTAG Test Clock |
| Pin AB2 | TMS — JTAG Test Mode Select |
| Pin B1 | TDI — JTAG Test Data In |
| Pin B2 | TDO — JTAG Test Data Out |
| Pin C1 | MSEL0 — Configuration mode select bit 0 |
| Pin C2 | MSEL1 — Configuration mode select bit 1 |
| Pin D1 | nCONFIG — Configuration start (active low) |
| Pin D2 | nSTATUS — Configuration status (active low) |
| Pin NC | NC — Not connected (per datasheet) |
| Pin TH1 | Thermal pad — Die thermal pad - solder to PCB thermal vias (per reference design) |
Typical Applications
EP2A40F672C7N is suitable for 6 applications: 1 Gbps+ Networking Line Card, Telecommunications Backplane Aggregation, DSP Co-Processor / Datapath Accelerator, Legacy ASIC Replacement, Industrial Storage Controller (RAID / SATA / FC), Broadband Aggregation / DSLAM Line Card.
1 Gbps+ Networking Line Card
The EP2A40F672C7N's 1.5 M system gates and 492 user I/Os make it well suited for 1 Gbps+ networking line cards where multiple SERDES channels, traffic managers, and lookup engines must coexist on a single FPGA. Per the APEX II datasheet, MultiVolt I/O banks support direct connection to 3.3 V and 5 V PHY devices, removing level shifters and reducing BOM cost. The 562 MHz internal performance provides margin for packet-processing pipelines at wire speed, while the 1.55 ns propagation delay supports tight timing closure on critical bus paths. In a typical line-card design, the EP2A40F672C7N sits between PHY/MAC devices and the switch fabric ASIC.
Recommended
Telecommunications Backplane Aggregation
Telecommunications backplane aggregation systems need high gate counts and abundant I/O to consolidate multiple tributary interfaces (E1/T1, DS3, OC-3/12) onto a single fabric. The EP2A40F672C7N delivers 1.5 M system gates sufficient to implement framer, mapper, and pointer-processing functions in one device, reducing board area and the inter-chip latency that arises when splitting logic across two FPGAs. The MultiVolt I/O support (1.5 V to 5.0 V) enables direct interface to legacy telecom ASICs and framers. Designers should plan thermal management carefully - the 672-ball FC-FBGA dissipates notable power under full I/O switching.
Recommended
DSP Co-Processor / Datapath Accelerator
DSP co-processing designs - such as custom FIR filters, FFT engines, and baseband processing - benefit from the EP2A40F672C7N's high logic density and dedicated routing resources. Per the APEX II datasheet, the device offers efficient hardware multipliers in its logic element structure and a routing fabric tuned for datapath arithmetic. At 562 MHz internal performance, multi-tap FIR filters can be realized with comfortable timing margin. The 492 user I/Os accommodate parallel data paths to host DSPs and ADCs/DACs. The 672-ball FC-FBGA package, while complex to assemble, provides the signal integrity required for high-speed parallel buses.
Recommended
Legacy ASIC Replacement
When an end-of-life ASIC must be replaced with a programmable equivalent, the EP2A40F672C7N is often selected because it provides gate-count and I/O-count headroom to absorb the legacy logic plus a margin of growth. The MultiVolt I/O (1.5 V to 5.0 V) preserves the ASIC's original bus levels, eliminating PCB rework. Designers can implement the original ASIC's register-transfer logic in Verilog or VHDL and synthesize into the APEX II using the Quartus II toolchain. The lead-free 'N' suffix variant supports EU-market products. Note: APEX II is in NRND status, so designers should plan a second-source migration to Cyclone IV/V for long-term supply.
Recommended
Industrial Storage Controller (RAID / SATA / FC)
Storage controllers - RAID engines, SATA multipliers, and Fibre Channel arbitrated loop controllers - require abundant parallel I/O and deterministic timing. The EP2A40F672C7N provides 492 user I/Os sufficient to interface multiple SATA PHYs or FC transceivers simultaneously, with 1.55 ns propagation delay supporting tight command-pipeline timing. The 1.5 V core reduces power dissipation versus older 2.5 V FPGAs, helping thermal budgets in dense storage chassis. The 27 x 27 mm FC-FBGA integrates well into standard storage controller card form factors. Designers must follow the manufacturer's reference layout for the FC-FBGA thermal pad.
Recommended
Broadband Aggregation / DSLAM Line Card
DSLAM and broadband aggregation line cards aggregate hundreds of subscriber lines and require high gate counts to implement channel processing, interleaving, and framing. The EP2A40F672C7N's 1.5 M system gates accommodate per-channel DSP plus aggregation fabric in a single device, reducing board complexity. The MultiVolt I/O (1.5 V to 5.0 V) interfaces cleanly with line-driver ASICs at 3.3 V and 5.0 V. The 672-ball FC-FBGA supports controlled-impedance routing required for high-speed upstream aggregation buses. Designers should plan for thermal dissipation - full gate utilization on a 27 x 27 mm FC-FBGA typically requires thermal vias and airflow.
Recommended
Recommended Products Summary
Engineering reference data for EP2A40F672C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A40F672C7 | EP2A40F672C7ES | EP2A40F672C6N | EP2A40F672C6 | EP2A25F672C7N | EP20K600CF672C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-ball FC-FBGA (S-PBGA-B672), 27 x 27 mm, 1.0 mm pitch | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.0 M | 1.0 M (APEX 20KE family) |
| Logic Cells / Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 24,160 | 24,320 |
| Maximum User I/Os | 492 | 492 | 492 | 492 | 492 | 492 | 488 |
| Propagation Delay (tpd) | 1.55 ns | 1.55 ns | 1.55 ns | 1.25 ns (faster grade) | 1.25 ns (faster grade) | 1.55 ns | 1.2 ns (APEX 20KE) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.8 V (APEX 20KE) |
| Speed Grade | 7 | 7 | 7 | 6 (faster) | 6 (faster) | 7 | 7 |
| Operating Temperature | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) |
| Lead-Free / RoHS | Yes (N suffix) | No (lead-bearing) | Yes | Yes | No | Yes | Yes |
Key Differentiators
- Highest logic density in APEX II 672-BGA family (vs EP2A25F672C7N)
- Lead-free / RoHS compliant (vs EP2A40F672C7)
- MultiVolt I/O supporting 5 V interface (vs EP20K600CF672C7N (APEX 20KE))
Design Notes
Estimated: at full I/O switching on a 27 x 27 mm FC-FBGA, the EP2A40F672C7N dissipates 3-5 W typical. The 672-ball FC-FBGA requires a thermal pad on the underside soldered to a PCB thermal via array (8-16 vias minimum). At 85 °C ambient commercial operation, junction temperature can approach 100 °C under worst-case utilization - follow the APEX II device handbook thermal management chapter and provide at least 4-layer PCB with internal ground/power planes.
The 672-ball FC-FBGA requires a 1.0 mm pitch land pattern with laser-drilled or mechanically drilled microvias in the BGA escape region. Per the APEX II device handbook, designers should use a 4-6 layer stackup with continuous ground planes beneath the device for controlled-impedance routing and return-path integrity. Decoupling: 0.1 µF ceramic + 10 µF bulk per VCCIO bank, plus 470 µF low-ESR bulk on VCCINT. Series termination on high-speed outputs (33 Ω to 50 Ω) is recommended per reference design.
Three common pitfalls on the EP2A40F672C7N: (1) Do not leave I/O pins floating - configure as outputs driving '0' or tie to defined logic level to avoid crowbar current. (2) MSELn pins must be set correctly for the chosen configuration mode - the '7' speed grade and MultiVolt I/O bank voltages must both match the application. (3) The N suffix denotes lead-free; substituting EP2A40F672C7 (lead-bearing) requires reflow profile adjustment above 220 °C peak. Failure to follow the APEX II configuration handbook leads to JTAG chain errors or incomplete configuration.
For MultiVolt I/O banks on the EP2A40F672C7N, group same-voltage I/O together and place bank VCCIO pins adjacent to their respective I/O signals. Per the device handbook, keep VCCIO and VCCINT power planes isolated with ferrite beads or short traces. High-speed differential pairs (LVDS, LVPECL) must maintain 100 Ω differential impedance with matched lengths within 150 mil. Place configuration EPROM (EPC2/EPC4) within 2 inches of nCONFIG/nSTATUS for reliable passive-serial configuration.
Signal integrity on the EP2A40F672C7N FC-FBGA is dominated by the FC-BGA escape routing and the power-plane cavity resonance around 200-400 MHz. Per APEX II signal-integrity guidelines, stitch the ground planes with 50-100 mil stitching vias around the BGA perimeter to suppress cavity modes. Use IBIS models (available from Intel/Altera legacy support) for SI simulation of 66 MHz and 100 MHz parallel buses. Series-damping resistors (10-22 Ω) on high-drive outputs reduce SSO ground bounce.
Compliance Information
RoHS compliant per 'N' suffix. AEC-Q100 not applicable for commercial-grade FPGA. Halogen-free and conflict-minerals status not explicitly stated in the verified web data - set to unknown.
