EP2A40F672C8N vs EP2A40F672C7N Comparison

Detailed side-by-side comparison of EP2A40F672C8N by Intel and EP2A40F672C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A40F672C8N EP2A40F672C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $122.00 $198.00
Family APEX II APEX II
Series EP2A40 β€”
Logic Family CMOS CMOS
System Gates 1.5 M 1.5 M
Logic Elements / Cells 38,400 38,400
Maximum Operating Frequency 376 MHz β€”
Propagation Delay 1.55 ns β€”
Technology Node 0.15 Β΅m β€”
Process Feature All-layer copper, up to 8 metal layers β€”
Nominal Supply Voltage (VCCINT) 1.5 V β€”
Supply Voltage Range 1.425 V to 1.575 V β€”
User I/Os 492 β€”
Number of Pins / Balls 672 β€”
Package Type FC-FBGA (FineLine BGA) β€”
Package Dimensions 27 x 27 mm β€”
Ball Pitch 1.0 mm β€”
LVDS Data Rate 1 Gbps β€”
Embedded PLLs 4 β€”
Programming Interface JTAG (IEEE 1149.1) β€”
Operating Temperature (Commercial) 0 Β°C to 85 Β°C β€”
Speed Grade C8 7
RoHS Status [DATA_NEEDED: RoHS status] β€”
Maximum User I/Os β€” 492
Propagation Delay (tpd) β€” 1.55 ns
Internal Performance β€” 562 MHz
Process Technology β€” 0.15 Β΅m CMOS, all-layer copper, up to 8 metal layers
Core Voltage β€” 1.5 V
MultiVolt I/O Support β€” 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V
Package β€” 672-ball FC-FBGA (FineLine BGA), S-PBGA-B672, 27 x 27 mm, 1.0 mm pitch
Mounting Type β€” Surface Mount
Operating Temperature β€” 0 Β°C to 85 Β°C (commercial, 'C' grade)
Lead-Free / RoHS β€” Yes (N suffix)
Configuration Modes β€” Passive Serial, Passive Parallel, JTAG

Datasheets & Resources

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