EP2A70B724C7N vs EP2A70B724I-8 Comparison

Detailed side-by-side comparison of EP2A70B724C7N by Altera and EP2A70B724I-8 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A70B724C7N EP2A70B724I-8
Brand Altera Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $188.00 $119.00
Family APEX II (EP2A70) APEX II
Device Type FPGA (Field Programmable Gate Array) β€”
Technology 0.15 Β΅m CMOS β€”
System Gates 3,000,000 3,000,000
Logic Cells / Logic Elements 67,200 β€”
Maximum Internal Frequency 420 MHz 281 MHz
Propagation Delay (typ.) 2.17 ns β€”
User I/O Pins 536 [DATA_NEEDED: user I/O pin count]
Macrocells (memory blocks reference) 16 β€”
Core Supply Voltage 1.5 V nominal 1.5 V
I/O Supply Voltage MultiVolt (1.5V / 1.8V / 2.5V / 3.3V / 5V tolerant) 3.3 V
Operating Temperature 0 Β°C to +85 Β°C (Commercial) -40 Β°C to +100 Β°C (Industrial)
Package 724-pin FCBGA (Flip-Chip BGA) β€”
Ball Pitch 1.27 mm β€”
Seated Height 3.5 mm β€”
Mounting Type Surface Mount Surface Mount
Configuration Method JTAG, Passive Serial (PS), Fast Passive Parallel (FPP) JTAG / Passive Serial / Passive Parallel
PLL Count [DATA_NEEDED: PLL count] β€”
Embedded Memory Embedded System Blocks (ESBs) - dual-port RAM / ROM / CAM β€”
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance]
Logic Elements / Cells β€” 67,200 cells
Process Technology β€” 0.15 Β΅m CMOS
Number of Pins β€” 724
Package Type β€” FCBGA (Flip-Chip Ball Grid Array)
Peak Reflow Temperature β€” 220 Β°C (per JEDEC J-STD-020)
User I/O Banks β€” [DATA_NEEDED: user I/O bank count]
Embedded System Blocks (ESBs) β€” [DATA_NEEDED: ESB count]
Embedded Array Blocks (EABs) β€” [DATA_NEEDED: EAB count]
Embedded RAM β€” [DATA_NEEDED: total bits]
PLLs β€” [DATA_NEEDED: PLL count]
MSL Level β€” [DATA_NEEDED: MSL level]

Datasheets & Resources

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