EP2A70B724I-8 - APEX II FPGA, 67.2K Cells, 724-BGA | Altera
MPN: EP2A70B724I-8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $148 | $14,800.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $119 | $119,000.00 |
EP2A70B724I-8 Overview
Key features of the APEX II architecture include MultiCore interconnect with embedded array blocks (EABs) for fast on-chip memory, a hierarchical Look-Up Table (LUT) fabric supporting 4-input LUTs, embedded multiplier support via dedicated DSP rows, and four phase-locked loops (PLLs) for clock multiplication and deskew. The family supports up to 281 MHz internal operation and is built around the LUT-based logic element combined with embedded system blocks, which combine SRAM and dedicated logic for efficient data-path implementation.
From a system-architecture perspective, FPGAs occupy a distinct tier in programmable logic: they sit above standard Complex Programmable Logic Devices (CPLDs) in capacity and below Application-Specific Integrated Circuits (ASICs) in per-unit cost, while offering parallel hardware fabrics that can be reconfigured after PCB assembly. The APEX II family targets high-density data-path applications such as telecommunications backplanes, parallel DSP, and high-speed bus bridging, where a designer needs ASIC-class throughput without NRE tooling costs.
Typical applications for the EP2A70B724I-8 include communications infrastructure (SONET/SDH framer ICs, ATM switching fabrics, 10/40 Gb Ethernet packet processors), high-performance DSP (FIR filters, FFT engines, baseband modem processing), and ASIC prototyping/emulation platforms. The 724-pin FCBGA package exposes roughly 380 user I/O pins, sufficient for wide parallel buses such as 64-bit SDRAM interfaces or multi-channel LVDS links.
When designing with this part, pay particular attention to multi-rail decoupling: the 1.5 V core, 3.3 V I/O bank supplies, and PLL analog supply must each be filtered with low-impedance ceramic capacitors placed within 5 mm of their respective pins. Configuration via JTAG or passive serial should be planned against the board's boot-time budget because the configuration image for a 70K-cell device typically exceeds 1 Mbit.
This page synthesizes distributor availability, same-family APEX II alternatives, and practical PCB design notes not found in a single Altera datasheet chapter. Engineers evaluating EP2A70B724I-8 for legacy or long-lifecycle programs should review the lifecycle status carefully before committing to new board designs.
Drop-in alternatives for EP2A70B724I-8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2A70B724I-8 (same form factor and footprint) — differing in Package, Process Technology, Configuration Method, System Gates, Maximum Internal Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2A70B724C9N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP2A70B724C9ES
✅ Drop-In✓ In Stock
$1250 / Unit
View Datasheet →EP2A70B724C9
✅ Drop-In✓ In Stock
$998.27 / Unit
View Datasheet →EP2A70B724C8N
✅ Drop-In✓ In Stock
$240 / Unit
View Datasheet →EP2A70B724C8
✅ Drop-In✓ In Stock
$1250 / Unit
View Datasheet →EP2A70B724C7N
✅ Drop-In✓ In Stock
$188 / Unit
View Datasheet →EP2A70B724C7ES
✅ Drop-In✓ In Stock
$2190 / Unit
View Datasheet →EP2A70B724I-8 Maximum Ratings & Electrical Characteristics
| Family | APEX II |
| Logic Elements / Cells | 67,200 cells |
| System Gates | 3,000,000 |
| Maximum Internal Frequency | 281 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Supply Voltage | 1.5 V |
| I/O Supply Voltage | 3.3 V |
| Number of Pins | 724 |
| Package Type | FCBGA (Flip-Chip Ball Grid Array) |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Peak Reflow Temperature | 220 °C (per JEDEC J-STD-020) |
| Configuration Method | JTAG / Passive Serial / Passive Parallel |
| Mounting Type | Surface Mount |
EP2A70B724I-8 fcbga (flip-chip ball grid array) Pin Configuration Guide
Pin configuration for EP2A70B724I-8 (fcbga (flip-chip ball grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2A70B724I-8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2A70B724I-8 is suitable for 6 applications: Telecommunications Backplane Bridging, High-Performance DSP / FFT Engine, ASIC Prototyping and Emulation, Industrial Control and Machine Vision, Legacy Avionics and Defense Systems, Test and Measurement Instrumentation.
Telecommunications Backplane Bridging
The EP2A70B724I-8's 67,200 logic cells and roughly 380 user I/O pins make it well suited to legacy telecommunications backplane bridging, where it can implement UTOPIA, POS-PHY, or proprietary parallel bus interfaces between line cards and a central switch fabric. Placed on the line card with 3.3 V I/O banks driving the backplane and 1.5 V core powering the internal logic, it provides up to 281 MHz internal operation to handle multi-gigabit serial-to-parallel conversion. The industrial temperature grade (-40 °C to +100 °C) ensures operation in temperature-controlled central-office racks without additional thermal conditioning.
Recommended
High-Performance DSP / FFT Engine
With 3 million system gates and dedicated embedded array blocks (EABs), the EP2A70B724I-8 can host multi-channel FIR filters, FFT/iFFT engines, or baseband modem pipelines on a single device. The internal 281 MHz performance combined with embedded multipliers supports real-time processing at baseband sample rates, while parallel DSP rows let multiple channels share the same fabric without throughput bottlenecks. Because APEX II is a mature family, mature reference designs from Altera's DSP Builder flow can be reused, reducing time-to-prototype.
Recommended
ASIC Prototyping and Emulation
The 67,200-cell density of the EP2A70B724I-8, combined with its 724-pin FCBGA exposing roughly 380 user I/Os, makes it a useful building block for ASIC prototyping platforms that need to map ASIC gate counts onto multiple FPGAs. Designers partition the ASIC netlist across several APEX II devices and use JTAG for in-system bring-up, leveraging the family's well-documented timing models. For emulation of multi-million-gate ASICs, multiple EP2A70B724I-8 devices can be stitched together through dedicated interconnect pins.
Recommended
Industrial Control and Machine Vision
The industrial temperature grade of the EP2A70B724I-8 allows it to be deployed in factory-floor machine-vision and motion-control systems where ambient temperature is not tightly regulated. The high I/O count supports parallel Camera Link or LVDS image-sensor interfaces, while embedded memory blocks buffer line-scan or area-scan pixel data before downstream processing. Combined with deterministic internal timing, the part enables synchronized multi-axis control loops with predictable cycle times.
Recommended
Legacy Avionics and Defense Systems
Many avionics and defense systems designed in the early 2000s adopted the APEX II family for its high density and deterministic timing, and the EP2A70B724I-8 continues to support these long-lifecycle programs via the secondary market. Its industrial temperature range and the FCBGA package's mechanical robustness suit ruggedized enclosures, while 1.5 V core operation keeps power dissipation manageable in conduction-cooled chassis. New defense designs are not advised due to the part's obsolete status; this application is targeted at sustaining legacy fielded systems.
Recommended
Test and Measurement Instrumentation
The EP2A70B724I-8 can serve as the timing-and-control fabric inside bench-top test equipment such as protocol analyzers, logic-analyzer acquisition cards, or arbitrary waveform generators, where its parallel I/O and embedded memory buffer high-speed sample streams. Up to 281 MHz internal operation allows direct synthesis of clock patterns without external PLLs, simplifying the bill of materials. Designers must budget for multi-rail decoupling and adequate cooling because the FCBGA package concentrates thermal dissipation into a small footprint.
Recommended
Recommended Products Summary
Engineering reference data for EP2A70B724I-8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2A70B724C9N | EP2A70B724C9ES | EP2A70B724C9 | EP2A70B724C8N | EP2A70B724C8 | EP2A70B724C7N | EP2A70B724C7ES |
|---|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 724-pin FCBGA | 724-pin FCBGA | 724-pin FCBGA | 724-pin FCBGA | 724-pin FCBGA | 724-pin FCBGA | 724-pin FCBGA | 724-pin FCBGA |
| Logic Cells | 67,200 cells | 67,200 cells (same die) | 67,200 cells (same die) | 67,200 cells (same die) | 67,200 cells (same die) | 67,200 cells (same die) | 67,200 cells (same die) | 67,200 cells (same die) |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Operating Temperature | -40 °C to +100 °C (Industrial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Speed Grade | 8 ns (-8) | 9 ns | 9 ns | 9 ns | 8 ns | 8 ns | 7 ns | 7 ns |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 0.15 µm CMOS | 0.15 µm CMOS (same die) | 0.15 µm CMOS (same die) | 0.15 µm CMOS (same die) | 0.15 µm CMOS (same die) | 0.15 µm CMOS (same die) | 0.15 µm CMOS (same die) | 0.15 µm CMOS (same die) |
Key Differentiators
- Industrial temperature grade within a 724-pin FCBGA package (vs EP2A70B724C9N)
- 8 ns speed grade - the fastest commercial/industrial bin available (vs EP2A70B724C9N)
- Highest-density APEX II member at 67,200 cells / 3 M system gates (vs EP2A40B724I-8)
Design Notes
The APEX II EP2A70B724I-8 requires three separate supply rails: VCCINT (1.5 V core), VCCIO (3.3 V I/O banks, with bank-specific voltage support), and VCC_PLL (1.5 V analog supply for the PLLs). Each rail should be filtered with a 10 µF bulk capacitor plus 0.1 µF and 0.01 µF ceramic capacitors placed within 5 mm of the relevant supply pins. The PLL analog supply must be isolated from digital switching noise via a ferrite bead; sharing VCCINT and VCC_PLL without filtering will couple core switching transients into PLL output jitter. Estimated: core current draw at 281 MHz with high utilization can exceed 1 A; verify against the APEX II family power calculator before sizing the regulator.
The 724-pin FCBGA package has a relatively high junction-to-ambient thermal resistance (theta-JA) because of the small exposed die area. At sustained high utilization and 281 MHz operation, junction temperature can approach 100 °C even at room ambient without airflow or thermal vias under the package. A 4-layer PCB with a continuous thermal-pour directly under the FCBGA and an array of 0.3 mm thermal vias to the inner ground plane is the recommended baseline. For chassis-mounted industrial applications, a 200 LFM minimum airflow budget is advisable; refer to the APEX II datasheet thermal characterization curves for theta-JA versus airflow.
The 724-pin FCBGA uses 1.0 mm ball pitch, requiring laser-drilled microvias or staggered via structures to fan out signals from the inner balls to breakout traces. Surface-mount pad finish should be ENIG (Electroless Nickel Immersion Gold) for reliable solder joint formation, and the PCB land-pattern must match the package datasheet exactly to avoid head-in-pillow defects. Keep all high-speed differential pairs (LVDS, clock) length-matched within 0.13 mm tolerance per the APEX II high-speed design guidelines; route them on the top microstrip layer directly above a continuous ground plane.
Do not assume the EP2A70B724I-8 is RoHS compliant - many APEX II lots pre-date RoHS conversion and use SnPb or lead-free finishes depending on the date code. Confirm the specific lot's compliance status with the seller before placing into a RoHS-mandated assembly. Also verify configuration mode strapping pins (MSEL) at board bring-up; an incorrectly strapped MSEL state will prevent the device from entering user mode and will appear as a logic-output high-impedance condition that can be mistaken for a silicon failure.
Compliance Information
Compliance data was not present in the verified web data; confirm RoHS, REACH, and lead-free status directly with the seller or via the lot's manufacturer certificate of conformance before use in regulated assemblies. APEX II devices pre-date widespread RoHS conversion and may be supplied as either SnPb or lead-free finishes depending on date code.
