EP2AGX125DF25I3G vs EP2AGX45DF25I3G Comparison

Detailed side-by-side comparison of EP2AGX125DF25I3G by Intel and EP2AGX45DF25I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGX125DF25I3G EP2AGX45DF25I3G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Active
Stock Status In Stock In Stock
Unit Price (USD) $895.00 $370.00
Series Arria II GX β€”
Logic Elements 118,143 β€”
Embedded Memory 8,315,904 bits β€”
Number of I/O 260 β€”
Package 572-BGA, FCBGA (Flip-Chip FineLine BGA) 572-ball FCBGA (HBGA)
Core Voltage 0.9 V β€”
Process Technology 40 nm β€”
Maximum Operating Frequency 500 MHz β€”
Transceivers Up to 12 (3.75 Gbps per channel) β€”
Operating Temperature -40C to +100C (Industrial) β€”
Mounting Type Surface Mount Surface Mount (BGA)
Supply Voltage 0.9 V core β€”
DSP Blocks 18x18 multipliers β€”
MSL Level [DATA_NEEDED: MSL Level] 3
RoHS Status Compliant Compliant
Family β€” Arria II GX
Logic Elements (LE) β€” 42,959
Adaptive Logic Modules (ALM) β€” 17,715
Embedded Memory Bits β€” 3,517,440 bits
Embedded Memory M9K Blocks β€” [DATA_NEEDED: M9K block count]
DSP Blocks (18x18 multipliers) β€” [DATA_NEEDED: DSP block count]
Maximum User I/O Pins β€” 252
Transceiver Channels β€” [DATA_NEEDED: MGT channel count]
Maximum Transceiver Data Rate β€” 6.375 Gbps
Package Dimensions β€” 25 mm x 25 mm
Operating Temperature Range β€” -40C to +100C (Industrial)
Speed Grade β€” I3
Process Node β€” 40 nm
Supply Voltage (Core) β€” [DATA_NEEDED: VCCINT]
Hard IP for PCIe β€” PCIe Gen1/Gen2 endpoints and root ports
Lead-Free β€” Yes

Datasheets & Resources

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