EP2AGX45DF25I3G - Arria II GX FPGA, 45K LE, 3.5Mb, 572-FCBGA
MPN: EP2AGX45DF25I3G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462.5 | $4,625.00 |
| 100 | $420 | $42,000.00 |
| 250 | $395 | $98,750.00 |
| 500 | $370 | $185,000.00 |
EP2AGX45DF25I3G Overview
Arria II GX FPGAs are programmable logic devices (PLDs) that occupy the mid-range of the FPGA hierarchy, sitting between the low-power Cyclone family and the high-performance Stratix family. Architecturally, an FPGA consists of an array of configurable logic blocks (CLBs) surrounded by programmable interconnect and surrounded by hard IP such as transceivers, memory blocks, DSP blocks, PLLs, and I/O serdes. This heterogeneous architecture allows designers to implement custom parallel logic, signal processing pipelines, and high-speed serial protocols on a single die, while programmable I/O standards (LVDS, LVTTL, LVPECL, HSTL, SSTL) enable direct interfacing to a wide range of external memories and ASICs.
Key features of the EP2AGX45DF25I3G include up to 6.375 Gbps transceiver data rate per channel, 8-input adaptive logic modules (ALMs), dedicated 18x18 multipliers for DSP, integrated PCI Express hard IP, and support for external memory interfaces such as DDR3, DDR2, QDRII+, and RLDRAM II. The 40nm process node reduces static and dynamic power relative to the prior-generation Arria GX family, while embedded signal integrity features such as transmit pre-emphasis, receive equalization, and PCSs (Physical Coding Sublayers) eliminate many of the analog design steps previously required at multi-gigabit speeds.
The transceiver architecture is the defining feature of this family. With multiple MGTs operating independently, designers can implement protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, SFI-5, XAUI, CPRI, and OBSAI without external PHY chips. Hard PCIe Gen1/Gen2 endpoints and root ports are embedded, simplifying system-level design and reducing BOM cost in telecom, broadcast, and industrial control applications.
Typical applications include wireless baseband processing, software-defined radio (SDR), video broadcasting infrastructure, test and measurement equipment with high-speed serial I/O, industrial imaging pipelines, and medical imaging systems. The combination of DSP blocks, embedded memory, and high-speed transceivers makes this device a frequent choice for 3G/4G remote radio heads, HD-SDI video routers, and PCIe-based adapter cards. The industrial temperature grade extends deployment to outdoor telecom and factory-floor equipment.
When designing with this FPGA, careful attention must be paid to transceiver channel placement, PCB stack-up, and power-supply decoupling. Each MGT draws significant current during data transmission, and the device's pin map must be reviewed against the Quartus II fitter reports to ensure the desired protocol pins are locked. Designers are advised to consult the Arria II GX Device Handbook for transceiver reference schematics and the pin-out description for signal-integrity guidelines.
This page synthesizes distributor pricing, drop-in alternatives from the same Arria II GX family, and design notes not typically covered in the manufacturer datasheet.
Drop-in alternatives for EP2AGX45DF25I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX45DF25I3G (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Transceivers, Logic Elements.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX45DF25I5G
✅ Drop-In✓ In Stock
$638.19 / Unit
View Datasheet →EP2AGX45DF25C6G
✅ Drop-In✓ In Stock
$128 / Unit
View Datasheet →EP2AGX45CU17I3G
✅ Drop-In✓ In Stock
$445 / Unit
View Datasheet →EP2AGX65DF25I5G
✅ Drop-In✓ In Stock
$378 / Unit
View Datasheet →EP2AGX125DF25I3G
✅ Drop-In✓ In Stock
$895 / Unit
View Datasheet →EP2AGX45DF25C6N
✅ Drop-In✓ In Stock
$263.5 / Unit
View Datasheet →EP2AGX45DF25I3G Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Logic Elements (LE) | 42,959 |
| Adaptive Logic Modules (ALM) | 17,715 |
| Embedded Memory Bits | 3,517,440 bits |
| Maximum User I/O Pins | 252 |
| Maximum Transceiver Data Rate | 6.375 Gbps |
| Package | 572-ball FCBGA (HBGA) |
| Package Dimensions | 25 mm x 25 mm |
| Operating Temperature Range | -40C to +100C (Industrial) |
| Speed Grade | I3 |
| Process Node | 40 nm |
| Hard IP for PCIe | PCIe Gen1/Gen2 endpoints and root ports |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP2AGX45DF25I3G 25 mm x 25 mm Pin Configuration Guide
Pin configuration for EP2AGX45DF25I3G (25 mm x 25 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX45DF25I3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX45DF25I3G is suitable for 7 applications: Wireless Baseband Processing, PCIe Adapter Card, Software-Defined Radio (SDR), Broadcast Video Infrastructure, Test and Measurement Equipment, Industrial Imaging Pipeline, Medical Imaging Systems.
Wireless Baseband Processing
The EP2AGX45DF25I3G is well suited to wireless baseband processing because it combines 42,959 logic elements, DSP multipliers, and 3.5 Mbit embedded memory on a single die. In a typical 3G/4G remote radio head (RRH) design, the FPGA implements channel filtering, crest factor reduction (CFR), and digital predistortion (DPD) algorithms alongside the transceiver chain, with 6.375 Gbps CPRI links carrying data to the baseband unit. The industrial temperature grade (-40C to +100C) supports outdoor telecom cabinet deployment. Use with companion DACs/ADCs such as DAC5682Z and AD9122.
Recommended
PCIe Adapter Card
With hard PCIe Gen1/Gen2 endpoints integrated, the EP2AGX45DF25I3G simplifies PCIe adapter card design by eliminating external PHY chips and reducing BOM. Designers can implement endpoint logic, DMA engines, and protocol stacks on the FPGA fabric while leveraging 6.375 Gbps transceivers for adjacent high-speed links. The 572-ball FCBGA package provides ample user I/O for board-level peripherals. Recommended companion parts include PCIe clock generators (CDCVF2505) and external SRAM/RLDRAM for buffering.
Recommended
Software-Defined Radio (SDR)
The Arria II GX's combination of DSP blocks, embedded memory, and multi-gigabit transceivers makes it a popular platform for software-defined radio. In SDR designs, the FPGA performs wideband digital down-conversion, channelization, and modulation/demodulation while streaming digitized RF data over serial links to a host processor. The 3.5 Mbit embedded memory provides ample buffering for intermediate samples, and the 40nm process delivers low power for portable and field-deployed SDR systems.
Recommended
Broadcast Video Infrastructure
Broadcast video routers, format converters, and HD-SDI transceivers benefit from the EP2AGX45DF25I3G's 6.375 Gbps serial transceivers, which exceed the 2.97 Gbps data rate required for 3G-SDI and approach the 5.95 Gbps needed for dual-link 3G-SDI. Designers can integrate video scaling, color-space conversion, and audio embedding in the FPGA fabric while using dedicated transceivers for SDI input/output. The 252 user I/O pins support multiple parallel video interfaces (BT.656, BT.1120, HDMI, DisplayPort).
Recommended
Test and Measurement Equipment
The EP2AGX45DF25I3G is well suited to test and measurement (T&M) equipment such as protocol analyzers, bit-error-rate testers (BERT), and high-speed oscilloscope acquisition boards. Multi-gigabit transceivers provide stimulus and capture capability for standards like XAUI, SFI-5, SATA, and PCIe at data rates up to 6.375 Gbps. The FPGA fabric implements pattern generation, error detection, and protocol decoding. Memory interfaces to DDR3 and QDRII+ provide deep capture buffering.
Recommended
Industrial Imaging Pipeline
For industrial machine vision and image processing, the EP2AGX45DF25I3G's 42,959 logic elements and DSP blocks accelerate Bayer demosaicing, color correction, image rescaling, and feature extraction in real time. Multiple Camera Link, CoaXPress, or GigE Vision inputs can be aggregated using the 6.375 Gbps transceivers. The industrial temperature grade (-40C to +100C) supports deployment in factory-floor environments where consumer-grade parts would fail. Companion image sensors and external DDR3 provide full pipeline support.
Recommended
Medical Imaging Systems
Medical imaging modalities such as ultrasound, endoscopy, and CT reconstruction use FPGAs like the EP2AGX45DF25I3G to perform beamforming, scan conversion, and image reconstruction in real time. The DSP blocks accelerate finite-impulse-response (FIR) filtering for ultrasound beamforming, while embedded memory buffers scan lines. Transceivers aggregate data from multiple analog front-end boards. Designers should validate the device for IEC 60601-1 medical safety standards and integrate appropriate isolation.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX45DF25I3G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX45DF25I5G | EP2AGX45DF25C6G | EP2AGX65DF25I5G | EP2AGX125DF25I3G |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel |
| Package | 572-ball FCBGA | 572-ball FCBGA - same | 572-ball FCBGA - same | 572-ball FCBGA - same | 572-ball FCBGA - same |
| Logic Elements | 42,959 | 42,959 | 42,959 | 56,400 | 118,500 |
| Embedded Memory Bits | 3,517,440 bits | 3,517,440 bits | 3,517,440 bits | 5,121,024 bits | 8,121,216 bits |
| User I/O Pins | 252 | 252 | 252 | 252 | 252 |
| Max Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I3 | I5 | C6 | I5 | I3 |
Key Differentiators
- Hard PCIe Gen1/Gen2 endpoint integrated on-die (vs EP2AGX65DF25I5G)
- Faster I3 speed grade for timing-critical designs (vs EP2AGX45DF25I5G)
- Lower cost and power than the larger Arria II GZ variants (vs EP2AGX45CU17I3G)
Design Notes
The 572-ball FCBGA package requires a high-density PCB stack-up with microvias and carefully controlled impedance for transceiver and memory interfaces. Per Intel's Arria II GX PCB design guidelines, use a 6-8 layer stack-up with dedicated ground planes adjacent to high-speed signal layers. Maintain 100 ohm differential impedance for MGT lanes and 50 ohm single-ended for GPIO. Length matching of 0.127 mm (5 mil) per PCIe lane is recommended. Power distribution should use a grid of decoupling capacitors (0.1 uF, 10 uF, and 22 uF values) placed within 5 mm of each BGA ball group.
Estimated: at full utilization with all MGTs active and 100% logic switching, the EP2AGX45DF25I3G can dissipate up to 8-10W. The FCBGA package typically has theta_JA around 15-25 C/W with proper PCB thermal via arrays under the package. Design with at least 4 thermal via arrays (9-12 vias each, 0.3 mm drill) under the center ball grid to conduct heat to inner copper planes. Industrial temperature operation up to +100C ambient requires junction temperature below 125C; verify thermal headroom via junction temperature monitoring in Quartus II.
Multi-gigabit transceivers operating at 6.375 Gbps require careful attention to signal integrity: use AC-coupled interconnects with 100 nF coupling caps on each TX output and RX input pair, maintain 100 ohm differential impedance with controlled skew within 0.15 mm per pair, and avoid right-angle bends on serial traces. Reference Intel's Arria II GX Transceiver User Guide for pre-emphasis and equalization settings, and validate compliance with protocol compliance patterns via BERT testing before deployment.
Common pitfalls with the EP2AGX45DF25I3G include: (1) selecting the wrong speed grade for transceiver-heavy designs where I3/I4 are required for timing closure, (2) confusing the DF25 package with the FF35 or EF29 variants which are not pin-compatible, (3) exceeding the maximum transceiver channel count when migrating from larger FPGA families, (4) ignoring MSL-3 moisture sensitivity requirements and not pre-baking the BGA before reflow, and (5) overlooking power-rail sequencing requirements during hot-swap or in-system programming events.
Compliance Information
RoHS and REACH compliant per the Altera/Intel product ordering information. AEC-Q100 qualification is not applicable to FPGAs (this is a discrete semiconductor IC, not an automotive discrete part).
