EP2AGX125EF35C4G vs EP2AGX125EF35I5G Comparison
Detailed side-by-side comparison of EP2AGX125EF35C4G by Intel and EP2AGX125EF35I5G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2AGX125EF35C4G - Arria II GX FPGA, 118K LEs, 1152-FCBGA | Intel
EP2AGX125EF35C4G β Last Time Buy
Specification Comparison
| Parameter | EP2AGX125EF35C4G | EP2AGX125EF35I5G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,290.00 | $1,190.00 |
| Family | Arria II GX | β |
| Logic Elements | 118,143 | 118,143 |
| Embedded Memory Bits | 8,315,904 | β |
| Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | β |
| Hardware Multipliers (18x18) | 452 | β |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP count] |
| Transceiver Channels | 12 | β |
| Maximum Transceiver Data Rate | 6.375 Gbps | β |
| PCI Express Hard IP | Gen1/Gen2 x1/x4/x8 | β |
| Core Voltage | 0.9 V | 0.87 V (Min) |
| User I/O Banks | [DATA_NEEDED: I/O bank count] | β |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | β |
| Process Technology | 40 nm | β |
| Package | 1152-ball FC-FBGA (Flip-Chip) | 1152-FBGA, FCBGA (35 mm) |
| Operating Temperature | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Configuration Method | SRAM-based, PS/FPP/JTAG | β |
| RoHS Status | Compliant | Compliant |
| Speed Grade | C4 | -5 |
| Lead-Free | Yes | β |
| Series | β | Arria II GX |
| Embedded Memory | β | 8,315,904 bits (7.93 Mbits) |
| User I/O Pins | β | 452 |
| Number of LABs/CLBs | β | [DATA_NEEDED: LAB count] |
| Transceivers | β | 12 channels, up to 6.375 Gbps |
| PCIe Hard IP | β | 4 blocks, Gen1/Gen2 |
| PLLs | β | 8 |
| Process Node | β | 40 nm low-power |
| Total Memory Bits | β | 8,315,904 |