EP2AGX125EF35I5G - Arria II GX FPGA 118K LE | Intel | 1152-FBGA
MPN: EP2AGX125EF35I5G ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1495 | $149,500.00 |
| 500 | $1295 | $647,500.00 |
| 1,000 | $1190 | $1,190,000.00 |
EP2AGX125EF35I5G Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic IC that allows hardware designers to implement custom digital circuits after manufacturing. FPGAs sit within the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs provide reconfigurable logic blocks (LEs), programmable interconnect, and on-die memory/MLAB blocks, making them ideal for prototyping, low-volume production, and applications where standards evolve. The Arria II GX family specifically targets transceiver-based mid-range designs that need transceivers without the cost of high-end Stratix devices.
Key features include 12 full-duplex transceiver channels supporting data rates from 600 Mbps up to 6.375 Gbps, integrated PCIe Gen1/Gen2 hard IP blocks, up to 8.3 Mbits of embedded memory, 4 PCI Express hard IP blocks, 8 PLLs, and dynamic reconfiguration support. The 1152-FBGA package supports 452 user I/O pins across 16 I/O banks with multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) and per-pin dynamic termination control.
Architecturally, the EP2AGX125EF35I5G uses a 40-nm low-power process with adaptive logic modules (ALMs), 8-input fracturable look-up tables (LUTs), MLAB and M9K memory blocks, and DSP blocks capable of up to 156 GMACs of fixed-point performance. Hard IP blocks for PCIe Gen2 and 10-Gbps-capable transceivers reduce logic utilization and power for serial protocols.
Typical applications include high-definition video broadcasting equipment, PCI Express endpoint cards, telecommunications line cards, wireless baseband processing, software-defined radio (SDR) platforms, and test & measurement instrumentation requiring transceiver connectivity.
When designing with this device, plan for the 1152-ball FBGA land pattern (1.0 mm pitch typical), 0.87 V core with multiple GND/VCC rails, and multi-rail power sequencing. JTAG configuration with Quartus II or Quartus Prime is required; the I5 grade indicates industrial temperature and -5 speed grade. Use Intel's Transceiver Toolkit for link training and the Signal Tap logic analyzer for hardware debug.
This page synthesizes distributor pricing, drop-in alternative part numbers from the Arria II GX family, and practical FPGA design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2AGX125EF35I5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX125EF35I5G (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Embedded Memory, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGX125EF35I5N
✅ Drop-In✓ In Stock
$1390 / Unit
View Datasheet →EP2AGX125EF35I3G
✅ Drop-In✓ In Stock
$410.39 / Unit
View Datasheet →EP2AGX125EF35C6G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →EP2AGX125EF35C5G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →EP2AGX125EF35C4G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1290 / Unit
View Datasheet →EP2AGX125EF35I3G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$410.39 / Unit
View Datasheet →EP2AGX125EF35I5G Maximum Ratings & Electrical Characteristics
| Series | Arria II GX |
| Logic Elements | 118,143 |
| Embedded Memory | 8,315,904 bits (7.93 Mbits) |
| User I/O Pins | 452 |
| Package | 1152-FBGA, FCBGA (35 mm) |
| Operating Temperature | -40C to +100C (Industrial) |
| Core Voltage | 0.87 V (Min) |
| Transceivers | 12 channels, up to 6.375 Gbps |
| PCIe Hard IP | 4 blocks, Gen1/Gen2 |
| PLLs | 8 |
| Process Node | 40 nm low-power |
| Speed Grade | -5 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Total Memory Bits | 8,315,904 |
EP2AGX125EF35I5G 1152-fbga, fcbga (35 mm) Pin Configuration Guide
Pin configuration for EP2AGX125EF35I5G (1152-fbga, fcbga (35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX125EF35I5G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX125EF35I5G is suitable for 7 applications: PCI Express Endpoint Card, Telecommunications Line Card, High-Definition Video Broadcasting, Wireless Baseband Processing, Software Defined Radio (SDR) Platform, Test & Measurement Instrumentation, Industrial Automation Controller.
PCI Express Endpoint Card
The EP2AGX125EF35I5G's 4 integrated PCIe Gen1/Gen2 hard IP blocks make it ideal for PCIe endpoint cards on industrial and embedded motherboards. With 118,143 logic elements and 8.3 Mbits of embedded memory, the FPGA can implement protocol logic, DMA engines, and application accelerators on a single chip. The 12 integrated transceivers at 6.375 Gbps support PCIe x4 Gen2 at full 5 Gbps line rate. Engineers typically pair the FPGA with a 100 MHz PCIe reference clock and route the four transceiver channels to a standard PCIe edge connector. The 1152-FBGA package exposes 452 user I/Os for parallel board-level connectivity, while the industrial -40C to +100C temperature range suits server-room and outdoor deployment. For boot configuration, the JTAG header or active serial flash is used to load the bitstream.
Recommended
Telecommunications Line Card
Telecom line cards benefit from the EP2AGX125EF35I5G's combination of high logic density and integrated transceivers supporting CPRI, OBSAI, and Ethernet protocols. The 118,143 LEs handle baseband DSP, packet processing, and framer logic while the 12 transceivers connect to SFP+/SFP cages for optical backhaul or fronthaul links. With 8.3 Mbits of embedded memory, the device buffers traffic at line rate without external SRAM for many line card configurations. The industrial temperature range supports outdoor cabinet and central-office deployments. A typical design routes 8 transceiver pairs to a quad SFP cage and dedicates 4 transceivers to backplane SERDES. SyncE and IEEE 1588 hardware timestamping use the on-die PLLs and dedicated clock networks. Compared with ASIC line card solutions, the FPGA provides programmable protocol adaptation, reducing NRE for variant SKUs.
Recommended
High-Definition Video Broadcasting
Broadcast video applications such as SDI routers, format converters, and studio switchers leverage the EP2AGX125EF35I5G's 12 transceivers for multi-rate SDI (SMPTE 259M/292M/424M/425M) signal processing at rates up to 6.375 Gbps per channel. The 118,143 LEs implement color space conversion, scaling, frame buffering, and audio embedding in real time. The 8.3 Mbits embedded memory provides line buffers and lookup tables for gamma correction, while the 452 user I/Os support LVDS-based parallel video buses. Engineers typically pair the FPGA with HDMI/SDI serializer/deserializer companion chips for I/O flexibility. The industrial temperature range suits outside broadcast trucks and stadium installations. Hardware reference designs from the Intel/Altera Broadcast library accelerate typical 3G-SDI/HD-SDI flow development.
Recommended
Wireless Baseband Processing
Wireless baseband and radio unit (RU) designs map efficiently onto the EP2AGX125EF35I5G's DSP blocks and transceiver channels. The 12 transceivers operating at 6.375 Gbps interface directly to AD9361 / AD9363 / AD9371 RF transceivers for multi-band radio. The 118,143 LEs and dedicated DSP blocks implement channelization, FFT/iFFT, crest factor reduction, and digital pre-distortion (DPD). The 8.3 Mbits embedded memory handles chip-rate buffering and HARQ process memory. The -40C to +100C industrial temperature supports outdoor macro base station and small-cell deployments. Designers typically instantiate 2-3 transceivers per antenna path, with the FPGA aggregating multiple radio chains into a Common Public Radio Interface (CPRI) link. Power consumption is moderate due to the 40-nm process; appropriate thermal vias under the BGA package are required for high-utilization designs.
Recommended
Software Defined Radio (SDR) Platform
The EP2AGX125EF35I5G is a strong SDR platform candidate due to its high logic count (118K LEs), 8.3 Mbits of embedded memory, and 12 transceivers supporting ADC/DAC sample rates beyond 200 MSPS on each I/Q channel. The FPGA fabric can implement wideband downconversion, channelization, modulation/demodulation, and protocol stacks (LTE, Wi-Fi, custom waveforms). The 452 user I/Os provide ample board-level connectivity to DDR3 memory controllers, FMC connectors (VITA 57.1), and digital front-end converters. The industrial temperature range enables portable/field-deployable SDR equipment. Software tools such as MATLAB/Simulink HDL Coder and the OpenCL SDK target this FPGA's DSP blocks and embedded memory blocks. Compared with GPUs, the FPGA offers deterministic latency, lower power per MAC, and real-time processing for latency-sensitive waveform applications.
Recommended
Test & Measurement Instrumentation
Test and measurement instruments - logic analyzers, protocol analyzers, BERT testers - leverage the EP2AGX125EF35I5G's high-density fabric, fast transceivers, and abundant I/O for capture, pattern generation, and protocol decoding. The 12 transceivers operating at 6.375 Gbps enable multi-channel pattern capture and generation at rates up to 6 Gbps per lane. The 118,143 LEs implement protocol state machines, error insertion, and real-time analytics. The 8.3 Mbits embedded memory captures deep trace buffers for protocol compliance testing. Engineers typically pair the FPGA with high-speed ADCs, DDR3 memory, and a host processor over PCIe. The industrial temperature range suits lab and field test equipment. Quartus II's Signal Tap logic analyzer and Transceiver Toolkit are commonly used to debug prototype builds during T&M development.
Recommended
Industrial Automation Controller
Industrial automation systems (PLC controllers, motion controllers, machine vision) benefit from the EP2AGX125EF35I5G's combination of high logic capacity, robust transceivers, and industrial -40C to +100C temperature range. The 118,143 LEs implement EtherCAT, PROFINET, EtherNet/IP master/slave stacks, motion control loops, and machine vision pre-processing in a single device. The 12 transceivers connect to industrial Ethernet PHYs, encoder interfaces, and high-speed camera links (CoaXPress, GigE Vision). The 452 user I/Os support TTL/CMOS sensor I/O, motor driver PWM signals, and operator panel HMI interfaces. The 8.3 Mbits embedded memory buffers process images and motion trajectories on-die. Compared with microcontroller-based PLCs, the FPGA provides deterministic sub-microsecond response times for high-speed motion control and machine vision trigger applications.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX125EF35I5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX125EF35I5N | EP2AGX125EF35I3G | EP2AGX125EF35C6G | EP2AGX125EF35C5G | EP2AGX125EF35C4G | EP2AGX125EF35I3 |
|---|---|---|---|---|---|---|---|
| Package | 1152-FBGA | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 118,143 | 118,143 | 118,143 | 118,143 | 118,143 | 118,143 | 118,143 |
| Embedded Memory (bits) | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 |
| User I/O Pins | 452 | 452 | 452 | 452 | 452 | 452 | 452 |
| Transceiver Channels | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | -5 | -5 | -3 | -6 (faster) | -5 | -4 (slower) | -3 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Same-package, same-die drop-in alternatives across temperature/speed grade combinations (vs EP2AGX125EF35I3G)
- Commercial temperature variants available for indoor products (vs EP2AGX125EF35C6G)
- High transceiver count (12 channels) at low cost vs higher-end Stratix family (vs Stratix IV GT (higher-end Intel FPGA))
Design Notes
The 1152-FBGA package of the EP2AGX125EF35I5G requires careful thermal management. Estimated power dissipation at full utilization (100K LE, 12 transceivers at 6.375 Gbps, 100% IO toggle) is approximately 8-12 W. The 40-nm process node produces moderate heat; the bottom-side thermal pad must be soldered to a thermal land with at least 9 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to internal copper ground planes. Without thermal vias, junction temperature can rise 25-35C above ambient under heavy load, reducing reliability.
The 1152-FBGA uses 1.0 mm ball pitch, which is compatible with standard PCB manufacturing but requires HDI (High-Density Interconnect) stack-up for fanout. Per Intel's Arria II GX board design guidelines, use a 1-6-1 or 1-8-1 PCB stack-up with microvia-in-pad for the inner rows. All high-speed transceiver channels require matched-length routing within 0.127 mm (5 mil) tolerance for the differential pair. Keep DC-bias, AC-coupling, and 100-ohm differential impedance lanes under 4 inches. Place 0402-sized AC coupling capacitors at the FPGA transmitter output, with one capacitor per transmit pair.
The EP2AGX125EF35I5G requires multiple supply rails: VCC (0.87 V core), VCC_PLL (PLL analog), VCCPD (I/O pre-driver), VCCIO (per bank I/O), VCCAUX (auxiliary), VCCR/VCCT (transceiver), and VCCBAT (battery-backed key). Per Intel's power design guide, a sequencing circuit is mandatory: VCC must rise before VCCPD/VCCAUX, and VCCIO must settle before configuration begins. Decoupling uses 0402 ceramic capacitors within 100 mils of each VCC pin, plus bulk polymer/tantalum capacitors at the board level. Estimated total decoupling capacitance is 200-300 uF across the supply rails.
Common pitfalls when designing with the EP2AGX125EF35I5G include: (1) using non-fabrication-compliant PCB land patterns - always use the Intel-recommended land pattern from the package specification document; (2) omitting MSL3 moisture handling during PCB assembly - the FBGA package is moisture-sensitive and requires dry-pack storage and pre-bake before reflow; (3) failing to read MSEL configuration pins correctly before configuration - they determine Active Serial (AS), Passive Serial (PS), JTAG, or Fast Passive Parallel (FPP) configuration modes; (4) ignoring PLL reference clock jitter requirements - the transceivers require < 1 ps RMS jitter for 6.375 Gbps operation; (5) not implementing proper reset sequencing for PCIe hard IP blocks, leading to link-up failures.
Layout best practices for the EP2AGX125EF35I5G: (1) group high-speed transceiver channels on the same board edge with matched-length routing; (2) place the JTAG header near the FPGA with 4-wire TMS/TCK/TDO/TDI pulled to known states via 10K resistors; (3) isolate analog PLL/VCCA rails with a ferrite bead from noisy digital rails; (4) keep the global clock network free from high-speed data signals; (5) implement a solid ground reference plane underneath all high-speed lanes; (6) use Intel's Quartus II Pin Planner to verify I/O assignment before PCB layout finalization to avoid late-stage rework.
Compliance Information
RoHS compliant per Intel/Altera product page (G suffix denotes lead-free). Not AEC-Q100 qualified - automotive designers should look to AEC-Q100 qualified Cyclone IV/V variants. REACH compliance status confirmed via authorized distributor documentation.
