EP2AGX45DF29I3N vs EP2AGX45DF29I3NAD Comparison
Detailed side-by-side comparison of EP2AGX45DF29I3N by Intel and EP2AGX45DF29I3NAD by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGX45DF29I3N | EP2AGX45DF29I3NAD |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $215.00 | $285.10 |
| Family | Arria II GX | Arria II GX |
| Series | EP2AGX45 | β |
| Number of Logic Elements | 42,959 | β |
| Number of LABs/CLBs | 1,805 | β |
| Total RAM Bits | 3,517,440 | β |
| Number of User I/O | 364 | β |
| Operating Temperature | -40 C to +100 C (industrial) | β |
| Speed Grade | I3 | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Process Technology | 40 nm | β |
| Core Voltage | 0.9 V | [DATA_NEEDED: VCCINT typical value] |
| Transceivers | Up to 8 channels, 3.125 Gbps | Multi-gigabit transceivers integrated |
| Hard PCIe Controller | PCIe Gen1/Gen2 x1/x4 | β |
| Package | 780-ball FC-FBGA (DF29) | 780-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount (flip-chip BGA) | Surface Mount |
| Maximum User I/O Frequency | 500 MHz Fmax | β |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | β |
| External Memory Support | DDR2, DDR3, QDRII+, RLDRAM II | β |
| RoHS Status | Compliant | [DATA_NEEDED: rohs status] |
| Logic Elements | β | 42,959 |
| Logic Array Blocks (LABs) | β | 1,805 |
| Embedded RAM Bits | β | 3,517,440 |
| User I/Os | β | 364 |
| Process Node | β | 40 nm |
| Transceiver Data Rate | β | 600 Mbps to 6.375 Gbps |
| Multipliers (18x18) | β | 156 (typical) |
| Temperature Grade | β | Industrial (I) |