EP2AGX45DF29I3N - Arria II GX FPGA 42K LE 364 I/O | Intel
MPN: EP2AGX45DF29I3N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262.5 | $2,625.00 |
| 100 | $245 | $24,500.00 |
| 500 | $228 | $114,000.00 |
| 1,000 | $215 | $215,000.00 |
EP2AGX45DF29I3N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded memory and DSP resources. Within the broader product hierarchy, an FPGA sits between a microcontroller and an ASIC: it offers far higher logic density than any MCU, yet unlike a fixed-function ASIC it can be re-programmed in the field through SRAM-based configuration. The Arria II GX family specifically targets mid-bandwidth, transceiver-rich applications that exceed the capability of Cyclone IV/V devices but do not justify the cost of high-end Stratix families.
Key features of the EP2AGX45DF29I3N include 364 user I/O pins, support for DDR2/DDR3/QDRII+ external memory interfaces, dedicated DSP blocks for high-speed fixed-point and floating-point arithmetic, and industrial temperature-grade operation from -40 C to +100 C. The -I3 speed grade corresponds to the slowest industrial speed bin, optimized for lower dynamic power rather than maximum Fmax, which makes it well suited to thermally constrained enclosures.
Architecture-wise, the device combines a sea-of-LABs fabric, true dual-port M9K memory blocks, MLAB blocks for distributed RAM, and multiplier-accumulators inside the DSP array. The transceiver blocks (GX) support protocols such as PCIe Gen2 x1/x4, XAUI, Serial RapidIO, CPRI, and OBSAI, while the hard PCIe IP controller reduces soft-logic overhead and latency.
Typical applications for this part include software-defined radio (SDR) baseband processing, video capture and display pipelines (SDI / DisplayPort bridging), industrial control backplanes with deterministic low-latency serial links, test and measurement equipment that streams aggregated data over PCIe, and radar front-end pre-processing where transceiver density and on-chip memory matter more than absolute logic capacity.
When designing with this part, use the Quartus II design suite (13.0sp1 or later is recommended for Arria II GX support) and validate signal-integrity with the IBIS-AMI models published in the device datasheet. The FC-FBGA package requires a multi-layer PCB with controlled-impedance routing; expect 6-8 routing layers for full 364 I/O breakout at production yield.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2AGX45DF29I3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGX45DF29I3N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGX45DF29I3G
β Drop-Inβ In Stock
$690 / Unit
View Datasheet βEP2AGX45DF29C6N
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$175 / Unit
View Datasheet βEP2AGX45DF29C5N
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$510 / Unit
View Datasheet βEP2AGX45DF29C4N
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$335.45 / Unit
View Datasheet βEP2AGX45DF29C3N
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$178 / Unit
View Datasheet βEP2AGX45DF29C6G
β Drop-Inβ In Stock
$121.75 / Unit
View Datasheet βEP2AGX45DF29C5G
β Drop-Inβ In Stock
$335 / Unit
View Datasheet βEP2AGX45DF29C4G
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$430 / Unit
View Datasheet βEP2AGX45DF29I3N Maximum Ratings & Electrical Characteristics
| Family | Arria II GX |
| Series | EP2AGX45 |
| Number of Logic Elements | 42,959 |
| Number of LABs/CLBs | 1,805 |
| Total RAM Bits | 3,517,440 |
| Number of User I/O | 364 |
| Operating Temperature | -40 C to +100 C (industrial) |
| Speed Grade | I3 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Transceivers | Up to 8 channels, 3.125 Gbps |
| Hard PCIe Controller | PCIe Gen1/Gen2 x1/x4 |
| Package | 780-ball FC-FBGA (DF29) |
| Mounting Type | Surface Mount (flip-chip BGA) |
| Maximum User I/O Frequency | 500 MHz Fmax |
| External Memory Support | DDR2, DDR3, QDRII+, RLDRAM II |
| RoHS Status | Compliant |
EP2AGX45DF29I3N 780-ball fc-fbga (df29) Pin Configuration Guide
Pin configuration for EP2AGX45DF29I3N (780-ball fc-fbga (df29) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGX45DF29I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGX45DF29I3N is suitable for 6 applications: Software Defined Radio (SDR) Baseband, Industrial PCIe Vision Systems, Broadcast Video Processing (SDI / DisplayPort), Test and Measurement Equipment, Radar Front-End Pre-Processing, Medical Imaging (Ultrasound / CT Backend).
Software Defined Radio (SDR) Baseband
The EP2AGX45DF29I3N is well suited to SDR baseband processing where the integrated 8-channel 3.125 Gbps transceiver array can interface directly to ADC/DAC daughterboards via XAUI or CPRI links. Its 3,517,440 bits of embedded RAM (organized as M9K + MLAB) provide ample buffering for FFT windows and channelization filters without external memory pressure, while the 364 user I/O allow parallel LVDS connections to RF front-end daughtercards. Industrial temperature grade enables deployment in outdoor base-station enclosures. The I3 speed grade runs DSP blocks at ~380 MHz, sufficient for LTE 20 MHz channelization. A reference design from Intel pairs this FPGA with the AD9361 RF transceiver for sub-6 GHz prototyping.
Recommended
Industrial PCIe Vision Systems
The hard PCIe Gen2 x4 controller in the EP2AGX45DF29I3N enables direct low-latency image transfer to host PCs at 2 GB/s peak, matching the requirements of high-speed machine vision pipelines. Its 42,959 logic elements can implement preprocessing kernels (bayer demosaicing, edge detection, FFT-based defect detection) in parallel while a separate DMA engine streams pixel data to the host through PCIe. The 780-ball FC-FBGA package accommodates the multi-lane SERDES breakout plus 16-bit DDR3 memory interface for frame buffering. Industrial -40 to +100 C screening allows installation on the factory floor near motors and actuators without additional thermal protection.
Recommended
Broadcast Video Processing (SDI / DisplayPort)
The EP2AGX45DF29I3N integrates up to eight transceivers capable of 3G-SDI, HD-SDI, and DisplayPort 1.1a, eliminating external reclockers for typical broadcast pipelines. Its DSP blocks accelerate color-space conversion (YUV422 to RGB) and chroma resampling in real time at 1080p60, while 364 user I/O support multi-stream ingest from camera sensors. The I3 speed grade balances dynamic power against Fmax, important for fanless broadcast chassis. Long-term availability concerns make this part appropriate for broadcast infrastructure with multi-year deployment cycles; designers should also evaluate the Arria V GX 5AGXBB1D31F31N as a future migration target.
Recommended
Test and Measurement Equipment
Test equipment such as protocol analyzers, logic analyzers, and arbitrary waveform generators benefit from the EP2AGX45DF29I3N's combination of transceivers, embedded memory, and PCIe Gen2 host interface. The 8 SERDES channels aggregate data from multiple probe pods, while the 3,517,440 bits of on-chip RAM buffer deep capture records before PCIe DMA to the host controller. Industrial temperature rating and the I3 power-optimized speed grade suit portable benchtop instruments with limited cooling. The Quartus II MegaWizard IP library provides pre-verified PCIe Gen2 x4, XAUI, and DDR3 controllers, accelerating time-to-market for new instrument designs targeting Ethernet, USB 3.0, or SATA analysis.
Recommended
Radar Front-End Pre-Processing
Phased-array radar systems use the EP2AGX45DF29I3N as a digital beamforming pre-processor, where the 8 transceiver channels digitize antenna element outputs and the FPGA fabric performs FFT-based Doppler filtering and angle-of-arrival estimation. The 3.5 Mbit embedded RAM provides ample buffering for chirp sequences, while the 364 user I/O interface to LVDS ADC banks. Industrial -40 to +100 C operation supports outdoor radar installations including weather surveillance and air traffic control. The I3 speed grade is adequate for typical pulse repetition frequencies up to 10 kHz; higher PRF designs benefit from the faster C6 speed grade of the EP2AGX45DF29C6N.
Recommended
Medical Imaging (Ultrasound / CT Backend)
Ultrasound and CT scanners use the EP2AGX45DF29I3N for receive-channel beamforming and image reconstruction, where the 364 user I/O accept LVDS data from multi-channel ADC banks and the embedded DSP blocks implement finite-impulse-response filtering for time-gain compensation. The hard PCIe Gen2 controller streams reconstructed images to the host CPU for display and archiving. Industrial temperature screening enables installation in the same chassis as the analog front-end. While the I3 speed grade is the slowest industrial bin, it remains adequate for typical clinical imaging frame rates; faster EP2AGX45 speed grades provide headroom for elastography or 4D imaging modes.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGX45DF29I3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGX45DF29I3G | EP2AGX45DF29C6N | EP2AGX45DF29C5N | EP2AGX45DF29C4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA (DF29) | 780-ball FC-FBGA (DF29) - same | 780-ball FC-FBGA (DF29) - same | 780-ball FC-FBGA (DF29) - same | 780-ball FC-FBGA (DF29) - same |
| Temperature Grade | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) |
| Speed Grade | I3 (slowest industrial) | I3 (identical) | C6 (fastest commercial) | C5 (mid commercial) | C4 (slow commercial) |
| Lead-Free Finish | N (Pb-free) | G (RoHS-compliant Pb-free) | N (identical) | N (identical) | N (identical) |
| Logic Elements | 42,959 | 42,959 (identical) | 42,959 (identical) | 42,959 (identical) | 42,959 (identical) |
| Transceivers | 8 x 3.125 Gbps | 8 x 3.125 Gbps (identical) | 8 x 3.125 Gbps (identical) | 8 x 3.125 Gbps (identical) | 8 x 3.125 Gbps (identical) |
| Hard PCIe Controller | PCIe Gen2 x1/x4 | PCIe Gen2 x1/x4 (identical) | PCIe Gen2 x1/x4 (identical) | PCIe Gen2 x1/x4 (identical) | PCIe Gen2 x1/x4 (identical) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
| Qty-1 Price (USD, as of 2026-09-08) | 285.00 | 285.00 (identical) | 260.00 | 255.00 | 250.00 |
Key Differentiators
- Drop-in lead-free finish compatibility (vs EP2AGX45DF29I3G)
- Faster Fmax in commercial grade alternatives (vs EP2AGX45DF29C6N)
- Industrial temperature screening (vs EP2AGX45DF29C5N)
Design Notes
The 780-ball FC-FBGA DF29 package requires a minimum PCB of 6 layers with 1.0 mm BGA pitch, including dedicated ground planes adjacent to the BGA signal breakout. Use a 50-ohm controlled-impedance stackup with 4 mil dielectric between signal layers and ground. Recommended stackup from Intel AN-585: top + ground + signal1 + power + signal2 + bottom, with via-in-pad micro-vias (8 mil pad / 4 mil drill) for the inner BGA rows. Decoupling must include 0402 0.1 uF X7R ceramics within 100 mil of every power ball, plus bulk 10 uF X5R on each supply rail (VCCINT 0.9 V, VCCD_PLL 1.2 V, VCCIO 1.5/1.8/2.5/3.3 V).
Estimated thermal dissipation at typical utilization (50% LE, 50% RAM, 50% DSP, 4 active transceivers at 3.125 Gbps) is approximately 4-5 W with the I3 speed grade. The FC-FBGA package has a theta_JA of approximately 12 C/W with a standard 4-layer JEDEC test board, yielding junction temperature rise of ~48-60 C above ambient. Industrial designs with 70 C ambient should deploy a heatsink (e.g. Wakefield 681-25-PP, ~5 C/W) or design the PCB with at least 4 square inches of inner copper flood on both ground planes under the BGA. Without active cooling, the device can operate at full I3 utilization up to approximately 85 C ambient.
The transceiver channels support up to 8.5 Gbps (C6 speed grade) or 6.375 Gbps (I3) with on-chip termination. Use IBIS-AMI models from the Arria II GX device datasheet for pre-layout channel simulation, and target an insertion-loss budget of 12 dB at Nyquist (4.25 GHz for 8.5 Gbps). AC-coupling capacitors of 100 nF X7R 0201 must be placed within 200 mil of each differential pair transmitter. The reference clock input (REFCLK) requires a jitter-cleaner PLL (e.g. SiLabs Si5326) with RMS jitter below 1 ps to meet PCIe Gen2 jitter compliance. For SDI applications, add a LMH0340 reclocker between the FPGA and the BNC connector to recover the eye diagram.
Do not assume industrial Arria II GX devices support Quartus Prime - the supported toolchain is Quartus II 13.0sp1 to 13.1 only. New designs should plan for migration to Arria V GX (5AGXBB1D31F31N) or Cyclone V GT (5CGTFD7D5F31I7N), which require PCB rework because the BGA footprint differs. Configuration mode (MSEL pins) must be set correctly for AS (active serial, EPCS64) or JTAG; misconfiguration causes nSTATUS to hang low. The CFG_DONE pin requires a 4.7 kohm pull-up to VCCIO. Finally, do not exceed the VCCIO ramp time of 100 ms or the POR circuit may not initialize reliably - use a power sequencer (e.g. LTC2923) for multi-rail systems.
Compliance Information
N suffix indicates Pb-free termination finish per Intel/Altera product marking convention. RoHS and REACH compliance per Altera material declaration datasheet. Not AEC-Q100 qualified - choose AEC-Q100-qualified automotive parts such as Cyclone V GT 5CGTFD7D5F31I7N for automotive applications.
