EP2AGX45DF29I3NAD vs EP2AGX45DF29I3N Comparison

Detailed side-by-side comparison of EP2AGX45DF29I3NAD by Intel and EP2AGX45DF29I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2AGX45DF29I3NAD EP2AGX45DF29I3NAD - 42K LE Arria II GX FPGA 780-FBGA | Intel

EP2AGX45DF29I3NAD - 42K LE Arria II GX FPGA 780-FBGA | Intel

EP2AGX45DF29I3NAD βœ“ Active
Intel
EP2AGX45DF29I3N EP2AGX45DF29I3N - Arria II GX FPGA 42K LE 364 I/O | Intel

EP2AGX45DF29I3N - Arria II GX FPGA 42K LE 364 I/O | Intel

EP2AGX45DF29I3N ⚠ Last Time Buy

Specification Comparison

Parameter EP2AGX45DF29I3NAD EP2AGX45DF29I3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $285.10 $215.00
Family Arria II GX Arria II GX
Logic Elements 42,959 β€”
Logic Array Blocks (LABs) 1,805 β€”
Embedded RAM Bits 3,517,440 β€”
User I/Os 364 β€”
Package 780-ball FBGA (FineLine BGA) 780-ball FC-FBGA (DF29)
Process Node 40 nm β€”
Transceivers Multi-gigabit transceivers integrated Up to 8 channels, 3.125 Gbps
Transceiver Data Rate 600 Mbps to 6.375 Gbps β€”
Multipliers (18x18) 156 (typical) β€”
Speed Grade I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) I3
Temperature Grade Industrial (I) β€”
RoHS Status [DATA_NEEDED: rohs status] Compliant
Mounting Type Surface Mount Surface Mount (flip-chip BGA)
Core Voltage [DATA_NEEDED: VCCINT typical value] 0.9 V
Series β€” EP2AGX45
Number of Logic Elements β€” 42,959
Number of LABs/CLBs β€” 1,805
Total RAM Bits β€” 3,517,440
Number of User I/O β€” 364
Operating Temperature β€” -40 C to +100 C (industrial)
Process Technology β€” 40 nm
Hard PCIe Controller β€” PCIe Gen1/Gen2 x1/x4
Maximum User I/O Frequency β€” 500 MHz Fmax
Embedded Multipliers β€” [DATA_NEEDED: 18x18 multiplier count]
External Memory Support β€” DDR2, DDR3, QDRII+, RLDRAM II

Datasheets & Resources

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