EP2AGZ300FF35C3G vs EP2AGZ300FF35C4N Comparison

Detailed side-by-side comparison of EP2AGZ300FF35C3G by Intel and EP2AGZ300FF35C4N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGZ300FF35C3G EP2AGZ300FF35C4N
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,395.00 $1,350.00
Series Arria II GZ Arria II GZ
Logic Elements 300,000 298,000
Adaptive Logic Modules (ALMs) 119,088 β€”
Embedded Memory 17,133 Kbit β€”
DSP Blocks 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes [DATA_NEEDED: number of DSP blocks]
Transceivers 16 channels, up to 6.375 Gbps Multi-gigabit transceivers integrated
Hard PCIe Controllers Up to 12 (Gen2 endpoint/root-port) β€”
User I/Os 1,288 β€”
I/O Banks 12 β€”
Process Technology 40 nm TSMC 40 nm
Package FCBGA-1152 (35 mm) β€”
Package Family BGA (Flip-Chip) β€”
Temperature Grade Commercial (0 C to 85 C junction) β€”
Speed Grade 3 (mid-performance) β€”
Configuration Method Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel β€”
Hard Memory Controller DDR3 up to 800 MHz, DDR2, QDR II+ β€”
RoHS Status Compliant Compliant (per Besenchips / DigiKey listing)
Logic Array Blocks (LABs) β€” 11,920
Embedded Memory (bits) β€” 18,854,912 (~17.9 Mbit)
User I/O Count β€” 554
Number of I/O Banks β€” [DATA_NEEDED: number of I/O banks]
Core Voltage β€” 0.9 V
Package Type β€” 1152-BBGA, FCBGA (flip-chip)
Terminal Form β€” Ball
Package Code (JEDEC) β€” HBGA
Operating Temperature Grade β€” Commercial (C4 = 0C to +85C)
Configuration Memory β€” SRAM-based (volatile, requires boot device)
PLLs β€” [DATA_NEEDED: PLL count]
Lead-Free Status β€” Lead free (per Besenchips listing)
Mounting Type β€” Surface Mount
Maximum Operating Frequency β€” 500 MHz

Datasheets & Resources

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