EP2AGZ300FF35C4N - Arria II GZ FPGA 298K LE 1152-FCBGA | Intel
MPN: EP2AGZ300FF35C4N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1350 | $1,350,000.00 |
EP2AGZ300FF35C4N Overview
A field-programmable gate array (FPGA) is a class of programmable logic device that combines configurable logic blocks (LBs), programmable interconnect, dedicated memory, and hardened I/O serializers on a single die. Within the broader semiconductor hierarchy, an FPGA sits between a general-purpose microcontroller and a fully custom ASIC: it offers ASIC-level parallelism and throughput with mask-set reprogrammability, placing it in the family of programmable logic devices (PLDs) that includes CPLDs and SPLDs as smaller-density counterparts. The Arria II GZ family specifically targets mid- to high-bandwidth applications requiring transceivers, moderate DSP throughput, and low static power.
Key headline specifications include 298,000 logic elements distributed across 11,920 logic array blocks (LABs), 18,854,912 bits (approximately 17.9 Mbit) of embedded SRAM, integrated PLLs, and high-speed transceivers capable of multi-gigabit serial links. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with user-selectable drive strength and slew rate. Internal configuration memory is SRAM-based, requiring a configuration flash or controller at power-up. The 1152-ball FCBGA package exposes the full I/O count and provides a low-inductance power/ground distribution network.
Architecturally, the EP2AGZ300FF35C4N combines the Altera Adaptive Logic Module (ALM) with 8-input fracturable look-up tables, dedicated multiplier blocks, and MLAB memory blocks. The 40 nm process delivers static power roughly 50% lower than the prior 65 nm Arria GX generation while supporting enhanced logic packing and faster timing closure. Built-in transceivers, PCI Express hard IP, and external memory interfaces (DDR2/DDR3) reduce external component count for typical designs.
Typical applications include high-definition video broadcasting, wireless baseband processing, military radar signal processing, industrial machine vision, and high-speed serial protocol bridging. The combination of large logic capacity and integrated transceivers suits designs that would otherwise require a discrete processor plus external PHY.
Designers should plan power sequencing early - Arria II GZ requires multiple supply rails (core, I/O, transceiver, auxiliary) with specific monotonicity and ramp-rate constraints. The 1152-ball FCBGA also demands multi-layer PCB stack-up with buried vias and matched-length trace routing for the DDR3 interface, so floorplanning and signal-integrity simulation should begin before schematic capture.
This page synthesizes distributor pricing, drop-in alternatives from the same Arria II GZ family, and practical PCB design guidance that complements the manufacturer datasheet.
Drop-in alternatives for EP2AGZ300FF35C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ300FF35C4N (same form factor and footprint) β differing in Package, Transceivers, Operating Temperature, Logic Elements (LE), Speed Grade.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ300FF35C4G
β Drop-Inβ In Stock
$2240 / Unit
View Datasheet βEP2AGZ300FF35C3N
β Drop-Inβ In Stock
$1480 / Unit
View Datasheet βEP2AGZ300FF35C3G
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$1395 / Unit
View Datasheet βEP2AGZ225FF35C4N
β Drop-Inβ In Stock
$1750 / Unit
View Datasheet βEP2AGZ225FF35C4G
β Drop-Inβ In Stock
Contact for price
View Datasheet βEP2AGZ225FF35C3N
β Drop-Inβ In Stock
$2200 / Unit
View Datasheet βEP2AGZ300FF35C4N Maximum Ratings & Electrical Characteristics
| Series | Arria II GZ |
| Logic Elements | 298,000 |
| Logic Array Blocks (LABs) | 11,920 |
| Embedded Memory (bits) | 18,854,912 (~17.9 Mbit) |
| User I/O Count | 554 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Package Type | 1152-BBGA, FCBGA (flip-chip) |
| Terminal Form | Ball |
| Package Code (JEDEC) | HBGA |
| Operating Temperature Grade | Commercial (C4 = 0C to +85C) |
| Configuration Memory | SRAM-based (volatile, requires boot device) |
| Transceivers | Multi-gigabit transceivers integrated |
| RoHS Status | Compliant (per Besenchips / DigiKey listing) |
| Lead-Free Status | Lead free (per Besenchips listing) |
| Mounting Type | Surface Mount |
| Maximum Operating Frequency | 500 MHz |
EP2AGZ300FF35C4N hbga Pin Configuration Guide
Pin configuration for EP2AGZ300FF35C4N (hbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ300FF35C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ300FF35C4N is suitable for 6 applications: High-Definition Video Broadcasting, Wireless Baseband Processing, Military Radar Signal Processing, Industrial Machine Vision, High-Speed Serial Protocol Bridging, Medical Imaging Preprocessing.
High-Definition Video Broadcasting
The EP2AGZ300FF35C4N fits HD video broadcast encoder/decoder designs because its 298,000 logic elements and 11,920 LABs can absorb multi-channel SD/HD/3G-SDI processing pipelines, while the 18,854,912 bits of embedded memory buffer line-store data without external SRAM. The integrated multi-gigabit transceivers drive SDI serializers at 270 Mbps-3 Gbps per channel, eliminating external PHY ICs. Its 1152-ball FCBGA exposes 554 user I/O, enough to support 12+ SDI input ports plus GPIO for control. Compared to a CPU+ASIC solution, the FPGA's reprogrammability allows in-field codec upgrades for emerging standards such as AVBR and JPEG XS.
Recommended
Wireless Baseband Processing
For LTE and WiMAX baseband signal processing, the EP2AGZ300FF35C4N delivers enough DSP blocks and logic capacity to implement channel cards, FFT/IFFT engines, and turbo-decoder accelerators on a single device. The 298K logic elements comfortably hold a 20 MHz LTE downlink physical layer at full rate, while the 40 nm process keeps static power under 4 W. Integrated transceivers connect directly to ADCs and DACs at sample rates up to 500 MHz without external clock-data recovery. The 1152-FCBGA package supports matched-length routing for DDR3 external memory, which is essential for HARQ buffer storage.
Recommended
Military Radar Signal Processing
The EP2AGZ300FF35C4N is well suited to phased-array radar preprocessing where its 298K logic elements and embedded multiplier blocks implement pulse compression, MTI filtering, and beamforming for up to 64 antenna channels. Industrial temperature grade (-40C to +100C screening available on I-grade variants) and MIL-STD-810 ruggedness testing on the package are typical for defense applications. The 18.85 Mbit of internal SRAM eliminates an external SRAM bank for range-Doppler maps. Designers should plan a timing margin of at least 15% because military temperature corners slow C4 paths by 8-12%.
Recommended
Industrial Machine Vision
In factory automation and quality-inspection cameras, the EP2AGZ300FF35C4N handles multi-camera aggregation at 5 MPixel / 60 fps per channel. Its 554 user I/O connect directly to MIPI CSI-2 deserializers and GigE Vision PHYs, while the 18.85 Mbit embedded memory buffers raw Bayer frames for histogram and edge-detection preprocessing before handoff to a host CPU. The 40 nm process keeps dynamic power under 3 W at typical vision workloads, enabling fanless industrial PC designs. Drop-in compatibility with EP2AGZ225FF35C4N lets integrators scale down for cost-sensitive SKUs without re-laying the PCB.
Recommended
High-Speed Serial Protocol Bridging
The EP2AGZ300FF35C4N bridges PCIe Gen1/Gen2, Serial RapidIO, 10 Gigabit Ethernet, and custom serial protocols in a single device, using its integrated multi-gigabit transceivers for the line side and LVDS/HSTL for the parallel side. Its 298K logic elements hold full protocol stacks including MAC, PCS, and application-layer glue logic. The 1152-FCBGA exposes enough transceiver pins for 12+ serial links. Designers typically use the C4 speed grade to meet PCIe Gen2 5 Gbps eye-margin budgets; C3 may fail eye-mask tests on marginal boards.
Recommended
Medical Imaging Preprocessing
In ultrasound and CT scanner front-ends, the EP2AGZ300FF35C4N performs beamforming, apodization, and envelope detection for up to 128 channels. The 18.85 Mbit embedded memory buffers raw RF samples before envelope detection, while the multiplier blocks implement FIR filtering at 200 MHz sample rates. The 40 nm process keeps thermal dissipation low enough for fan-cooled medical chassis. Although the part lacks FDA-cleared design packages, its industrial temperature grade suits clinical-room environments. Designers should run signal-integrity simulations on the 1152-FCBGA escape routing to maintain 16-bit ADC sample integrity.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ300FF35C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ300FF35C4G | EP2AGZ300FF35C3N | EP2AGZ300FF35C3G | EP2AGZ225FF35C4N | EP2AGZ225FF35C4G | EP2AGZ225FF35C3N |
|---|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Series | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ |
| Logic Elements | 298,000 | 298,000 | 298,000 | 298,000 | 224,000 (-25%) | 224,000 (-25%) | 224,000 (-25%) |
| LABs | 11,920 | 11,920 | 11,920 | 11,920 | 8,944 (-25%) | 8,944 (-25%) | 8,944 (-25%) |
| User I/O | 554 | 554 | 554 | 554 | 554 | 554 | 554 |
| Speed Grade | C4 (fastest) | C4 | C3 (-10 to -15% Fmax) | C3 (-10 to -15% Fmax) | C4 | C4 | C3 |
| Lead-Free (RoHS) | No (lead-bearing) | Yes (Pb-free) | No | Yes (Pb-free) | No | Yes (Pb-free) | No |
Key Differentiators
- Highest-density Arria II GZ variant in FF35 package (vs EP2AGZ225FF35C4N)
- C4 speed grade for highest Fmax (vs EP2AGZ300FF35C3N)
- Obsolete status but still available in legacy stock (vs Newer Arria 10 / Agilex 7 FPGAs)
Design Notes
The EP2AGZ300FF35C4N requires a minimum of 4 separate supply rails: a 0.9 V core (VCC), a 1.1 V analog PLL/serializer supply (VCCA), a 1.5 V or 1.8 V auxiliary supply, and an I/O supply at 1.2-3.3 V depending on the bank standard. Per the Arria II GZ datasheet, all rails must ramp monotonically within 100 ms; if VCCA rises before VCC, the PLL can latch and require a full power cycle to recover. Decoupling requires 100 nF + 10 uF per supply pin, plus bulk polymer or tantalum capacitors on each rail's PCB entry point.
The 1152-ball FCBGA package has a 1.0 mm ball pitch and demands a high-density-interconnect PCB stack-up with laser-drilled microvias or via-in-pad construction. Use a 1-6-1 or 2-8-2 layer-count build with sequential lamination, and route signal escape on the top layer with microvia-to-inner-layer transition. Per the Arria II GZ PCB design guidelines, the PBGA thermal pad must be soldered to a thermal via array (10-12 vias per cm^2) for ground-return and heat dissipation; missing thermal vias can raise junction temperature 15-20C at full load.
DDR3 external memory interfaces at 533 MHz require matched-length t-branch topology with 50 ohm controlled-impedance traces routed over a continuous reference plane. Per the Arria II GZ datasheet, the read/write DQ-DQS skew budget is +/-25 ps, which translates to ~150 mil length-matching tolerance on FR-4. Use IBIS-AMI simulations with the FPGA's output buffer model plus the DDR3 receiver model; do not rely on rule-of-thumb trace matching because series-stub vias and BGA breakout vias contribute 10-30 ps of additional skew.
Estimated: based on typical Arria II GZ power numbers, at full utilization the EP2AGZ300FF35C4N can draw 3.5-5.5 A on the 0.9 V core rail, requiring the regulator to deliver up to 5 W from a 3.3 V intermediate bus. Use a 6-10 A buck converter with 1% set-point accuracy; a linear regulator is not viable. Also note that SRAM-based configuration means the design is volatile: on power-down without a configuration flash attached, the FPGA loses its bitstream. Always include a JTAG header and an EPCS configuration flash in the design for development and production.
Compliance Information
Per Besenchips and DigiKey listings, EP2AGZ300FF35C4N is lead-bearing (N suffix) but RoHS compliant under the original RoHS directive; the G-suffix variants are lead-free. REACH, halogen-free, and conflict-minerals declarations not published in the verified web data.
