EP2AGZ300FF35I3G vs EP2AGZ300FF35C3G Comparison

Detailed side-by-side comparison of EP2AGZ300FF35I3G by Intel and EP2AGZ300FF35C3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGZ300FF35I3G EP2AGZ300FF35C3G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1,230.00 $1,395.00
Family Arria II GZ β€”
Logic Elements (LE) 300000 β€”
Number of User I/O 554 (maximum) β€”
Number of Transceivers 8 β€”
Transceiver Data Rate Up to 6.375 Gbps β€”
Process Node 40 nm β€”
Operating Temperature -40C to +100 C (I3 industrial) β€”
Package 1152-ball FBGA (FF35) FCBGA-1152 (35 mm)
Mounting Type Surface Mount β€”
Supply Voltage [DATA_NEEDED: core and I/O supply voltage values] β€”
Embedded Memory (Mbits) 16.4 β€”
DSP Blocks [DATA_NEEDED: number of DSP blocks] 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes
PLLs [DATA_NEEDED: number of PLLs] β€”
Memory Interfaces DDR3, QDRII+, RLDRAM II β€”
Configuration Method Serial, Parallel, JTAG Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel
RoHS Status Compliant Compliant
MSL Level 3 (168 hours) β€”
Lead-Free Yes β€”
Series β€” Arria II GZ
Logic Elements β€” 300,000
Adaptive Logic Modules (ALMs) β€” 119,088
Embedded Memory β€” 17,133 Kbit
Transceivers β€” 16 channels, up to 6.375 Gbps
Hard PCIe Controllers β€” Up to 12 (Gen2 endpoint/root-port)
User I/Os β€” 1,288
I/O Banks β€” 12
Process Technology β€” 40 nm TSMC
Package Family β€” BGA (Flip-Chip)
Temperature Grade β€” Commercial (0 C to 85 C junction)
Speed Grade β€” 3 (mid-performance)
Hard Memory Controller β€” DDR3 up to 800 MHz, DDR2, QDR II+

Datasheets & Resources

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