EP2AGZ300FF35I3G - 300K LE Arria II GZ FPGA 1152-FBGA | Intel
MPN: EP2AGZ300FF35I3G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1380 | $13,800.00 |
| 25 | $1325 | $33,125.00 |
| 50 | $1280 | $64,000.00 |
| 100 | $1230 | $123,000.00 |
EP2AGZ300FF35I3G Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) belonging to the larger integrated circuit family. FPGAs sit alongside ASICs and CPLDs in the digital logic hierarchy and consist of an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, on-chip memory (BRAM), and high-speed serial transceivers. The Arria II GZ family is positioned in Intel's mid-to-high-end portfolio between Cyclone (low-power, low-cost) and Stratix (highest performance), offering a balance of density, transceiver speed, and price.
Key features include up to 8 transceivers supporting data rates up to 6.375 Gbps, 16.4 Mbits of embedded memory, dedicated hardware DSP blocks for high-throughput arithmetic, support for external memory interfaces including DDR3, QDRII+, and RLDRAM II, and a wide operating frequency range. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) and offers a PLL-per-region architecture for precise clock management.
The Arria II GZ architecture integrates dedicated hardware multipliers, variable-precision DSP blocks, and TriMatrix memory blocks for efficient implementation of signal processing pipelines. Its transceiver blocks support PCIe Gen1/Gen2, XAUI, CEI-6G, and serial RapidIO protocols. Designers can configure the device via Intel Quartus II design software, which supports Verilog, VHDL, and SystemVerilog through a synthesis-based flow.
Typical applications include high-definition video processing and bridging, telecommunications infrastructure (baseband and backhaul), test and measurement equipment, medical imaging systems, and high-performance computing accelerators. The combination of high logic density and multi-gigabit transceivers makes it well suited for designs requiring both heavy parallel processing and chip-to-chip serial connectivity.
When designing with this device, pay close attention to PCB layout for BGA breakout routing and power distribution network (PDN) design. The 1152-ball FBGA package requires multi-layer PCB stack-up (typically 12+ layers) with controlled-impedance traces for the 6.375 Gbps transceiver channels. Decoupling capacitors must be placed directly under the BGA balls to maintain signal integrity.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, package-specific design considerations, and a structured FAQ not found in the manufacturer datasheet alone, all verified against Intel's official EP2AGZ300 family datasheet and current distributor inventory as of 2026-09-08.
Drop-in alternatives for EP2AGZ300FF35I3G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ300FF35I3G (same form factor and footprint) β differing in Package, Transceivers, Operating Temperature, Logic Elements, Logic Elements (LE).
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2AGZ300FF35I4N
β Drop-Inβ In Stock
$1925 / Unit
View Datasheet βEP2AGZ300FF35C3G
β Drop-Inβ In Stock
$1395 / Unit
View Datasheet βEP2AGZ300FF35C4N
β Drop-Inβ In Stock
$1350 / Unit
View Datasheet βEP2AGZ260FF35I3G
β Drop-Inπ Reference alternative (not in catalog)
EP2AGZ225FF35I3G
β Drop-Inβ In Stock
$4400 / Unit
View Datasheet βEP2AGX260FF35I3G
β Drop-Inβ In Stock
$1985 / Unit
View Datasheet βEP2AGX190FF35I3G
β Drop-Inβ In Stock
$1840 / Unit
View Datasheet βEP2AGZ300FF35I3G Maximum Ratings & Electrical Characteristics
| Family | Arria II GZ |
| Logic Elements (LE) | 300000 |
| Number of User I/O | 554 (maximum) |
| Number of Transceivers | 8 |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Process Node | 40 nm |
| Operating Temperature | -40C to +100 C (I3 industrial) |
| Package | 1152-ball FBGA (FF35) |
| Mounting Type | Surface Mount |
| Embedded Memory (Mbits) | 16.4 |
| Memory Interfaces | DDR3, QDRII+, RLDRAM II |
| Configuration Method | Serial, Parallel, JTAG |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
| Lead-Free | Yes |
EP2AGZ300FF35I3G 1152-ball fbga (ff35) Pin Configuration Guide
Pin configuration for EP2AGZ300FF35I3G (1152-ball fbga (ff35) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ300FF35I3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ300FF35I3G is suitable for 6 applications: High-Definition Video Processing and Bridging, Telecommunications Infrastructure (Baseband and Backhaul), Test and Measurement Equipment, Medical Imaging Systems, Industrial Automation and Machine Vision, High-Performance Computing Acceleration.
High-Definition Video Processing and Bridging
The EP2AGZ300FF35I3G fits HD video processing with 300K logic elements supporting multi-channel video pipelines, scaling, and color-space conversion simultaneously. Its 8 transceivers at 6.375 Gbps provide sufficient bandwidth for uncompressed HD-SDI, 3G-SDI, and DisplayPort interfaces. The DSP blocks accelerate real-time video codecs such as H.264 baseline encode/decode. The 554 user I/Os support wide parallel video buses (24-bit or 30-bit RGB) at 150 MHz pixel clock. Designers typically use this device in broadcast studio equipment, video conferencing systems, and medical imaging displays where both real-time processing and high-bandwidth I/O are required. The 40 nm process keeps power consumption manageable for rack-mounted broadcast systems.
Recommended
Telecommunications Infrastructure (Baseband and Backhaul)
The EP2AGZ300FF35I3G suits telecom baseband processing and backhaul aggregation, where the 300K LE capacity implements multiple CPRI/OBSAI framer instances, MAC-layer processing, and packet classification. The 8 transceivers support multiple SFP+ links at 6.375 Gbps for fiber backhaul, while the 16.4 Mbits of embedded memory buffer packet bursts. Dedicated hardware DSP blocks accelerate Turbo decoding and Viterbi decoding for wireless fronthaul aggregation. Industrial temperature rating enables outdoor cabinet deployment. The 1152-ball FBGA package fits the line-card form factor typical of ATCA and microTCA platforms. Quartus II supports CPRI IP cores with deterministic latency for LTE and 5G small-cell applications.
Recommended
Test and Measurement Equipment
The EP2AGZ300FF35I3G fits high-end test and measurement instruments where 300K LE provides logic capacity for protocol-aware pattern generation, real-time signal processing, and high-speed data acquisition. Its 8 transceivers capture and generate multi-lane protocols such as PCIe Gen2, USB 3.0 (PIPE interface), and SATA at 6 Gbps. The dedicated DSP blocks accelerate FFT computation for spectrum analysis and oscilloscope functionality. With 554 user I/Os, the device supports parallel ADCs and DACs up to 16-bit resolution at 250 MSPS. Designers use this FPGA in protocol analyzers, BERT testers, and arbitrary waveform generators where flexible reconfigurability is essential. The industrial temperature range supports lab and field test environments.
Recommended
Medical Imaging Systems
The EP2AGZ300FF35I3G fits medical imaging systems including ultrasound, CT, and MRI signal processing front-ends. Its 300K logic elements implement real-time beamforming for ultrasound arrays, where each of 128 channels requires parallel I/Q demodulation and envelope detection. The 8 transceivers stream raw ADC data to host processors via multi-gigabit serial links. With 16.4 Mbits of embedded memory, the device buffers line-scan ultrasound frames before host transfer. Hardware DSP blocks accelerate FFT for Doppler processing. The 40 nm process keeps power within thermal limits for compact portable ultrasound carts. Industrial temperature rating supports clinical and field-deployed imaging equipment. Quartus II medical IP cores support DICOM-compliant data tagging.
Recommended
Industrial Automation and Machine Vision
The EP2AGZ300FF35I3G fits industrial machine vision systems where multiple camera inputs require real-time preprocessing, defect detection, and conveyor synchronization. Its 300K LE supports simultaneous processing of 4 to 8 GigE Vision or CoaXPress camera inputs. The 8 transceivers provide high-bandwidth uplink to industrial PCs. Hardware DSP blocks accelerate convolution kernels used in edge detection and pattern matching. With 554 user I/Os, the device interfaces directly with industrial sensors, encoders, and GPIO-controlled actuators. Industrial temperature range (-40C to +100 C) supports factory floor and outdoor deployment. The 1152-ball FBGA package provides the thermal mass required for continuous operation in enclosed cabinets.
Recommended
High-Performance Computing Acceleration
The EP2AGZ300FF35I3G serves as a co-processor in high-performance computing systems, where it accelerates compute-intensive kernels such as FFT, FIR filtering, and matrix multiplication via its dedicated DSP blocks. The 8 transceivers at 6.375 Gbps provide high-bandwidth host links via PCIe Gen2 x4 or x8. With 300K logic elements, the device implements custom SIMD engines and pipelined arithmetic units. The 16.4 Mbits of embedded memory acts as a software-managed cache, reducing external memory latency for streaming workloads. Industrial temperature rating enables deployment in server rooms and edge compute appliances. Quartus II supports OpenCL for FPGA programming, accelerating HPC porting from CPU/GPU codebases.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ300FF35I3G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ300FF35I4N | EP2AGZ300FF35C3G | EP2AGZ300FF35C4N | EP2AGZ260FF35I3G | EP2AGZ225FF35I3G | EP2AGX260FF35I3G | EP2AGX190FF35I3G |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FBGA (FF35) | 1152-ball FBGA (FF35) - same | 1152-ball FBGA (FF35) - same | 1152-ball FBGA (FF35) - same | 1152-ball FBGA (FF35) - same | 1152-ball FBGA (FF35) - same | 1152-ball FBGA (FF35) - same | 1152-ball FBGA (FF35) - same |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GX | Arria II GX |
| Logic Elements | 300K | 300K | 300K | 300K | 260K | 225K | 260K | 190K |
| Transceiver Data Rate | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps |
| Operating Temperature | -40C to +100 C (Industrial) | -40C to +100 C (Industrial) | 0C to +85 C (Commercial) | 0C to +85 C (Commercial) | -40C to +100 C (Industrial) | -40C to +100 C (Industrial) | -40C to +100 C (Industrial) | -40C to +100 C (Industrial) |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
Key Differentiators
- Highest-density Arria II GZ member in the FF35 package (vs EP2AGZ225FF35I3G)
- Industrial temperature range with full transceiver support (vs EP2AGZ300FF35C3G)
- 8 transceivers at 6.375 Gbps versus 4 in lower-cost families (vs EP2AGX190FF35I3G)
Design Notes
The 1152-ball FBGA (FF35) package requires a high-layer-count PCB stack-up (12+ layers) with controlled-impedance routing for the 6.375 Gbps transceiver channels. Use 100-ohm differential pairs for transceiver lanes and 50-ohm single-ended for general-purpose I/O. Via-in-pad with filled and plated-over vias is recommended for the BGA breakout to maximize routable area. Maintain at least 4 ground-return vias per high-speed signal transition to control impedance discontinuities.
Decoupling capacitors must be placed directly under the BGA balls. Use a mix of 10 uF bulk ceramic, 1 uF mid-frequency, and 0.1 uF high-frequency capacitors distributed across the device footprint. Estimated: at 300K LE utilization with active transceivers, total power consumption can exceed 15 W, requiring a multi-rail PDN with separate analog and digital supplies. Place ferrite beads between analog and digital supply domains to isolate PLL noise.
Do not assume EP2AGZ300FF35I3G and EP2AGZ225FF35I3G are interchangeable in any design that fully utilizes the 300K LE - the lower-density variant will fail fitting. Verify the worst-case LE utilization report from Quartus II compilation before selecting a drop-in replacement. Additionally, the I3/I4/C3/C4 speed grade differences affect Fmax; migrating from I3 to C3 (commercial) does NOT degrade speed but migrating to C4 (slower grade) reduces Fmax by approximately 15 percent.
The 1152-ball FBGA package dissipates heat primarily through the PCB. Without thermal vias under the central BGA balls, junction temperature can exceed 100 C under industrial ambient conditions. Estimated: thermal resistance theta_JA is approximately 8 C/W with 16 thermal vias (each 0.3 mm drill). Design the PCB with at least 16 thermal vias connecting the BGA ground/thermal balls to internal ground planes to maintain safe junction temperature.
6.375 Gbps transceiver signals require pre-emphasis and equalization settings tuned per channel. Use Quartus II's Transceiver Toolkit for signal integrity analysis. Keep transceiver traces under 8 inches, avoid layer transitions, and maintain continuous reference planes beneath high-speed differential pairs. Series AC-coupling capacitors (typically 100 nF) must be placed near the transmitter side as per PCIe/CPRI specifications.
Compliance Information
RoHS compliance confirmed by 'G' suffix in orderable part number. AEC-Q100 not applicable for FPGA logic devices. REACH compliance per Intel product declarations.
