EP2AGZ300FH29I3G vs EP2AGZ300FH29I4G Comparison
Detailed side-by-side comparison of EP2AGZ300FH29I3G by Intel and EP2AGZ300FH29I4G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGZ300FH29I3G | EP2AGZ300FH29I4G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,340.00 | $1,350.00 |
| Product Type | Field Programmable Gate Array (FPGA) | β |
| Family | Arria II GZ | Arria II GZ (AGZ) |
| Logic Elements (LE) | 300,000 | 300,000 (approx., per family member) |
| Embedded Memory | 18,520 Kbits | β |
| DSP Blocks (18x18 multipliers) | 720 | β |
| Maximum Transceiver Data Rate | 6.375 Gbps | β |
| Number of Transceivers | 24 | β |
| Process Node | 40 nm TSMC | 40 nm TSMC |
| Package | 780-pin FineLine BGA (FH29), 29x29 mm | β |
| Speed Grade | -3 | I4 |
| Temperature Grade | Industrial (-40C to +100C) | β |
| Operating Voltage (Core) | 0.9 V | β |
| External Memory Interface | DDR3 up to 800 MHz | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS Status | Compliant | Compliant |
| Number of I/O | β | 281 |
| Package Type | β | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | β | FH29 (29x29 mm) |
| Operating Temperature Range | β | -40C to +100C (industrial, I-grade) |
| Supply Voltage (Core) | β | 0.9 V (typical) |
| Configuration Method | β | JTAG / Passive Serial / Fast Passive Parallel |
| Transceivers | β | Embedded multi-gigabit transceivers (per family) |
| DSP Blocks | β | Yes (variable-precision, per family) |
| Block RAM | β | Embedded M9K / M144K blocks |
| MSL Level | β | [DATA_NEEDED: MSL rating] |
| Lead-Free | β | Yes (per RoHS) |