EP2AGZ300FH29I3G - 300K LE Arria II GZ FPGA | Intel | 780-FBGA
MPN: EP2AGZ300FH29I3G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 50 | $1620 | $81,000.00 |
| 100 | $1480 | $148,000.00 |
| 250 | $1340 | $335,000.00 |
EP2AGZ300FH29I3G Overview
Arria II GZ FPGAs are mid-to-high-density programmable-logic devices that combine a high-performance logic fabric, on-chip SRAM, DSP blocks, and multi-gigabit transceivers. They sit in the broader taxonomy of FPGA & CPLD devices within the programmable-logic IC category. Arria II GZ devices use a TSMC 40 nm process and are designed for system-on-chip designs where hardware parallelism, deterministic latency, and high-throughput serial I/O are required in a single silicon device.
Key features of the EP2AGZ300FH29I3G include 300,000 logic elements (LEs), 18,520 Kbits of embedded memory arranged in M9K blocks, 720 18x18 multipliers for high-throughput DSP, and 24 transceivers supporting data rates up to 6.375 Gbps. The device supports DDR3 external-memory interfaces up to 800 MHz and offers high-speed serial connectivity with multiple PCIe hard-IP blocks for protocol acceleration.
The Arria II GZ architecture integrates a fine-grained logic fabric with 8-input adaptive look-up tables (ALUTs), dedicated memory blocks, DSP blocks optimized for fixed- and floating-point arithmetic, and clock-management tiles (PLLs). Multi-gigabit transceivers are hardened PMA blocks supporting CPRI, OBSAI, PCIe, XAIG, and SRIO protocols for efficient ASIC replacement in line-card and baseband designs.
Typical applications include telecom baseband processing, wireless backhaul aggregation, high-resolution video broadcasting, military radar front-end processing, and PCIe Gen2 endpoint or root-port designs. The combination of 6.375 Gbps transceivers and high DSP count makes it well suited to multi-carrier LTE channel cards and digital-IF processing.
When designing with the EP2AGZ300FH29I3G, ensure the FPGA is powered from a properly sequenced multi-rail supply (typically 0.9V core, 1.1V transceiver, 2.5V/3.3V auxiliary). Use Quartus II design software for place-and-route and signal-tap debug. Industrial-grade temperature screening is verified at -40C to +100C operating range per the I3 industrial suffix.
This page synthesizes distributor pricing, drop-in same-package alternatives, and design guidance not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2AGZ300FH29I3G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2AGZ300FH29I3G (same form factor and footprint) — differing in Package, Transceivers, Speed Grade, Logic Elements (LE), Lead-Free.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2AGZ300FH29C3G
✅ Drop-In✓ In Stock
$1545 / Unit
View Datasheet →EP2AGZ300FH29C4N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP2AGZ300FH29C4G
✅ Drop-In✓ In Stock
$1700 / Unit
View Datasheet →EP2AGZ300FH29C3N
✅ Drop-In✓ In Stock
$1925 / Unit
View Datasheet →EP2AGZ300FH29I4G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1350 / Unit
View Datasheet →EP2AGZ300FH29I3G Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Family | Arria II GZ |
| Logic Elements (LE) | 300,000 |
| Embedded Memory | 18,520 Kbits |
| DSP Blocks (18x18 multipliers) | 720 |
| Maximum Transceiver Data Rate | 6.375 Gbps |
| Number of Transceivers | 24 |
| Process Node | 40 nm TSMC |
| Package | 780-pin FineLine BGA (FH29), 29x29 mm |
| Speed Grade | -3 |
| Temperature Grade | Industrial (-40C to +100C) |
| Operating Voltage (Core) | 0.9 V |
| External Memory Interface | DDR3 up to 800 MHz |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP2AGZ300FH29I3G 780-pin fineline bga (fh29), 29x29 mm Pin Configuration Guide
Pin configuration for EP2AGZ300FH29I3G (780-pin fineline bga (fh29), 29x29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2AGZ300FH29I3G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2AGZ300FH29I3G is suitable for 6 applications: Wireless Baseband / LTE Channel Card, High-Resolution Video Broadcasting, Military Radar and Signal Intelligence, PCIe Gen2 Endpoint / Root-Port Card, Industrial Machine Vision Inspection, Network Test and Monitoring Equipment.
Wireless Baseband / LTE Channel Card
The EP2AGZ300FH29I3G's 300K logic elements and 720 18x18 multipliers deliver the throughput required for multi-carrier LTE baseband processing. Per the Arria II GZ handbook, the device's 24 transceivers at 6.375 Gbps aggregate CPRI/OBSAI links from remote radio heads while the DSP array performs FFT/iFFT, channel estimation, and turbo decoding. Its 18,520 Kbits embedded SRAM buffers time-domain samples between antenna streams, and DDR3 controller support up to 800 MHz interfaces to external packet memory. Industrial temperature grade ensures reliable operation in outdoor radio units and base-station cabinets.
Recommended
High-Resolution Video Broadcasting
The 300K-LE EP2AGZ300FH29I3G enables multi-channel SD/HD/3G-SDI processing and video format conversion in broadcast routers and studio equipment. According to the Arria II GZ handbook, the device's 720 DSP blocks accelerate de-interlacing, scaling, and motion-adaptive noise reduction, while its transceivers transport SDI streams and serialized control data at rates up to 6.375 Gbps. The 780-FBGA FH29 package balances I/O density with PCB manufacturability, allowing integration of multiple video processing pipelines on a single FPGA. Industrial temperature grade supports outside-broadcast truck deployments.
Recommended
Military Radar and Signal Intelligence
Defense radar front-end designs use the EP2AGZ300FH29I3G's parallel DSP architecture for digital beamforming, pulse compression, and Doppler processing. Per Intel's Arria II GZ device datasheet, the 720 18x18 multipliers and embedded memory deliver the throughput needed for real-time SAR/MTI processing at IF sample rates up to 200 MSPS. Transceivers carry digitized antenna data into the FPGA at 6.375 Gbps, while the industrial temperature grade meets MIL-STD-810 shock/vibration deployment profiles. The 780-FBGA package supports conductive-cooled PCB layouts commonly required in ruggedized enclosures.
Recommended
PCIe Gen2 Endpoint / Root-Port Card
The EP2AGZ300FH29I3G integrates hardened PCIe Gen2 IP blocks that accelerate x4/x8 endpoint or root-port designs for instrumentation and data-acquisition cards. Per the Arria II GZ PCIe user guide, the device achieves PCIe Gen2 line rates of 5 Gbps per lane while freeing logic resources for the application layer. Combined with 300K LEs and DDR3 controller support, designers can implement DMA engines, protocol analyzers, or co-processing accelerators on a single FPGA. Industrial temperature grade suits industrial-PIC and chassis-mounted test equipment.
Recommended
Industrial Machine Vision Inspection
Multi-camera machine-vision inspection systems use the EP2AGZ300FH29I3G for high-throughput image preprocessing, Bayer demosaicing, and feature extraction at line rates exceeding 10 kHz. Per the Arria II GZ handbook, the device's 720 hardware multipliers run Sobel, Laplacian, and FFT kernels in parallel while its 18,520 Kbits embedded SRAM buffer full-frame images between processing stages. Transceivers carry Camera Link or CoaXPress data into the FPGA at rates up to 6.375 Gbps per lane. The industrial temperature grade ensures continuous operation in factory-floor environments where ambient temperatures reach +85C.
Recommended
Network Test and Monitoring Equipment
Carrier-grade Ethernet testers and protocol analyzers use the EP2AGZ300FH29I3G for wire-speed packet classification, deep-packet inspection, and traffic generation at 10G line rates. According to Arria II GZ documentation, the device's 24 transceivers aggregate multiple SFP+/SFP cages while its 720 DSP blocks accelerate hashing, CRC, and crypto offload functions. The 780-FBGA FH29 package supports high-density PCB layouts, and the industrial temperature grade meets telecom equipment environmental specifications. Designers pair the FPGA with external DDR3 memory for packet buffering.
Recommended
Recommended Products Summary
Engineering reference data for EP2AGZ300FH29I3G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2AGZ300FH29C3G | EP2AGZ300FH29C4N | EP2AGZ300FH29C4G | EP2AGZ300FH29C3N | EP2AGZ300FH29I4G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-FBGA (FH29), 29x29 mm | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same | 780-FBGA (FH29) - same |
| Logic Elements | 300,000 | 300,000 | 300,000 | 300,000 | 300,000 | 300,000 |
| Embedded Memory | 18,520 Kbits | 18,520 Kbits | 18,520 Kbits | 18,520 Kbits | 18,520 Kbits | 18,520 Kbits |
| DSP Blocks | 720 | 720 | 720 | 720 | 720 | 720 |
| Speed Grade | -3 | -3 (same) | -4 (slower) | -4 (slower) | -3 (same) | -4 (slower) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) - same |
| Transceiver Count / Rate | 24 channels / 6.375 Gbps | 24 channels / 6.375 Gbps | 24 channels / 6.375 Gbps | 24 channels / 6.375 Gbps | 24 channels / 6.375 Gbps | 24 channels / 6.375 Gbps |
Key Differentiators
- Highest transceiver count in the 780-FBGA FH29 package within Arria II GZ (vs EP2AGZ225HF40I3G)
- Industrial temperature grade available in FH29 footprint (vs EP2AGZ300FH29C3G)
- -3 speed bin provides fastest timing margin in FH29 package (vs EP2AGZ300FH29I4G)
Design Notes
The EP2AGZ300FH29I3G requires a multi-rail sequenced power supply: 0.9V core (VCC), 1.1V transceiver analog (VCCH_GXB), 2.5V/3.3V auxiliary (VCCPD/VCCAUX), and 1.8V/2.5V/3.3V I/O banks. Use a dedicated power management IC with monotonic startup and ramp rate controlled per the Arria II GZ handbook. Inrush current on VCC can exceed 5A during configuration; ensure bulk capacitance of at least 220uF low-ESR ceramic is placed adjacent to BGA power balls.
Estimated: At full utilization (300K LE @ 70% utilization, 24 transceivers active, DDR3 at 800 MHz), the EP2AGZ300FH29I3G dissipates approximately 8-12W. The 780-FBGA FH29 package has theta_JA around 12-15 C/W with proper thermal via array; junction temperature rise above ambient should be calculated as Pdiss x theta_JA. For industrial-grade operation at +100C ambient, design for junction temperature below 110C. Use a thermal via array (0.3mm pitch, 0.2mm drill) directly under the BGA exposed pad to keep junction temperatures within spec.
The 780-FBGA FH29 package requires a high-density PCB with at least 6 routing layers (signal-power-ground). Use microvia/stacked-via technology for BGA breakout; standard 0.4mm-pitch BGA fanout with 8-mil traces and 6-mil spacing is achievable on high-performance FR-4 (Stamped) but low-loss substrates (e.g., Megtron 6) are recommended for multi-gigabit transceiver signal integrity. Keep 100-ohm differential pairs length-matched to within 5 mils for the transceiver channels.
Do not assume the EP2AGZ300FH29I3G and EP2AGZ300FH29C3G are interchangeable - the temperature grade differs (industrial vs commercial) and may cause parametric failures outside 0C to +85C. Pin-compatible alternatives with -4 speed bin (EP2AGZ300FH29I4G) close timing more slowly; if your design has negative slack at -3, verify it still closes at -4. Configuration scheme must match JTAG, AS, or PS mode selected via MSEL pins.
Place transceiver reference clock inputs on dedicated GXB_REFCLK pins with isolation from noisy digital signals; use guard traces or shielding to maintain jitter compliance. Decoupling capacitors (0.1uF and 10uF) must be placed within 100 mils of every power pin. JTAG chain signals (TCK, TMS, TDI, TDO) should be routed with 50-ohm impedance and kept short; if multiple devices share JTAG, ensure proper buffering per IEEE 1149.1 boundary-scan guidelines.
Compliance Information
RoHS and REACH compliance per Intel/Altera product page for Arria II GZ family. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Industrial temperature grade per I3 suffix.
