EP2AGZ300FH29I3G vs EP2AGZ350FH29I3G Comparison
Detailed side-by-side comparison of EP2AGZ300FH29I3G by Intel and EP2AGZ350FH29I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGZ300FH29I3G | EP2AGZ350FH29I3G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,340.00 | $1,450.00 |
| Product Type | Field Programmable Gate Array (FPGA) | β |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 300,000 | 350000 (approximately) |
| Embedded Memory | 18,520 Kbits | β |
| DSP Blocks (18x18 multipliers) | 720 | β |
| Maximum Transceiver Data Rate | 6.375 Gbps | β |
| Number of Transceivers | 24 | β |
| Process Node | 40 nm TSMC | 40 nm |
| Package | 780-pin FineLine BGA (FH29), 29x29 mm | 780-FBGA (FineLine BGA, FH29) |
| Speed Grade | -3 | β |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Operating Voltage (Core) | 0.9 V | β |
| External Memory Interface | DDR3 up to 800 MHz | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant |
| User I/O Count | β | 281 |
| Operating Temperature Range | β | -40C to +100C |
| Supply Voltage Core | β | [DATA_NEEDED: VCC core voltage] |
| Transceivers | β | Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet) |
| Memory Interface | β | DDR3 with read/write leveling support (family feature) |
| Embedded Multipliers | β | 18x18 hardware multipliers (family feature) |
| Configuration Method | β | Serial or parallel via Quartus II (family feature) |
| MSL Level | β | 3 (per BGA package handling guidelines) |
| Lead Free | β | Yes |
| Halogen Free | β | [DATA_NEEDED: halogen free status] |