EP2AGZ300FH29I4G vs EP2AGZ300FH29I3G Comparison

Detailed side-by-side comparison of EP2AGZ300FH29I4G by Intel and EP2AGZ300FH29I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGZ300FH29I4G EP2AGZ300FH29I3G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1,350.00 $1,340.00
Family Arria II GZ (AGZ) Arria II GZ
Logic Elements (LE) 300,000 (approx., per family member) 300,000
Number of I/O 281 β€”
Package Type 780-ball Flip-Chip BGA (FineLine) β€”
Package Code FH29 (29x29 mm) β€”
Operating Temperature Range -40C to +100C (industrial, I-grade) β€”
Speed Grade I4 -3
Process Node 40 nm TSMC 40 nm TSMC
Supply Voltage (Core) 0.9 V (typical) β€”
Configuration Method JTAG / Passive Serial / Fast Passive Parallel β€”
Transceivers Embedded multi-gigabit transceivers (per family) β€”
DSP Blocks Yes (variable-precision, per family) β€”
Block RAM Embedded M9K / M144K blocks β€”
RoHS Status Compliant Compliant
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
MSL Level [DATA_NEEDED: MSL rating] β€”
Lead-Free Yes (per RoHS) β€”
Product Type β€” Field Programmable Gate Array (FPGA)
Embedded Memory β€” 18,520 Kbits
DSP Blocks (18x18 multipliers) β€” 720
Maximum Transceiver Data Rate β€” 6.375 Gbps
Number of Transceivers β€” 24
Package β€” 780-pin FineLine BGA (FH29), 29x29 mm
Temperature Grade β€” Industrial (-40C to +100C)
Operating Voltage (Core) β€” 0.9 V
External Memory Interface β€” DDR3 up to 800 MHz

Datasheets & Resources

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