EP2C8F256I8 vs EP2C8F256I8N Comparison

Detailed side-by-side comparison of EP2C8F256I8 by Intel and EP2C8F256I8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2C8F256I8 EP2C8F256I8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $36.53 $21.95
Series Cyclone II Cyclone II
Logic Elements 8,256 β€”
Total RAM Bits 165,888 165,888
Number of User I/O 182 β€”
Number of LABs / CLBs 516 β€”
Package 256-LBGA (FBGA-256) β€”
Number of Terminals / Balls 256 β€”
Package Shape Square β€”
Temperature Grade Industrial (suffix 'I') β€”
Speed Grade 8 (per suffix) β€”
Core Supply Voltage [DATA_NEEDED: VCCINT voltage] 1.2 V
I/O Standard Support [DATA_NEEDED: Supported I/O standards] β€”
Number of PLLs [DATA_NEEDED: Number of PLLs] β€”
Configuration Methods [DATA_NEEDED: AS / PS / JTAG support details] β€”
RoHS Status Unknown - no N suffix; verify in distributor data Compliant (Pb-free, lead-free reflow compatible)
Logic Elements (LEs) β€” 8,256
Embedded Memory Bits β€” 165,888 bits
Logic Blocks / Logic Cells β€” 540 (Logic Cells)
User I/O Pins β€” 182
Number of LABs/CLBs β€” [DATA_NEEDED: LAB count]
Embedded 18x18 Multipliers β€” Up to 36
PLLs β€” 2
Global Clock Networks β€” 16
I/O Supply Voltage β€” 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent)
Process Technology β€” 90 nm CMOS (SRAM-based)
Package Type β€” 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
Operating Temperature β€” -40C to +85C (industrial)
Configuration Method β€” SRAM, loaded from external EPCS flash at power-up
Mounting Type β€” Surface Mount (BGA)

Datasheets & Resources

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