EP2C8F256I8N - Cyclone II FPGA, 8K LEs, 256-FBGA | Intel / Altera
MPN: EP2C8F256I8N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.45 | $32.45 |
| 10 | $29.5 | $295.00 |
| 100 | $26.8 | $2,680.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $21.95 | $21,950.00 |
EP2C8F256I8N Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable routing, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. The Cyclone II family is positioned in the low-cost, high-volume tier of the Intel FPGA portfolio (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), targeting applications where designers need the flexibility of hardware programmability without the NRE of an ASIC.
Key features of the EP2C8F256I8N include two general-purpose PLLs for clock synthesis and skew management, up to 36 embedded 18x18 multipliers for DSP operations, and True-LVDS support on selected I/O pins. The device supports the Nios II embedded processor for soft-core CPU integration, allowing complete SoC implementation on a single chip with custom peripherals, memory controllers, and DMA engines.
Architecturally, the Cyclone II device uses an SRAM-based configuration cell that must be loaded from an external configuration flash (EPCS) at every power-up. The 256-FBGA (17 mm x 17 mm body, 1.0 mm ball pitch) offers a denser pin-out than TQFP equivalents and exposes more user I/O at the cost of standard SMT assembly processes.
Typical applications include industrial machine vision, motor control, video processing, low-cost DSP front-ends, and embedded control systems. Designers also deploy this part as a bridge between legacy parallel buses (PCI, ISA) and modern high-speed serial interfaces where pre-built IP cores accelerate development.
A critical design consideration: verify PCB routing rules for the 1.0 mm pitch FBGA, including microvia stack-up and matched-length DDR traces if DDR/DDR2 memory is used. The "I8N" suffix denotes the industrial temperature grade (-40C to +85C) with lead-free (Pb-free) reflow compatibility.
This page synthesizes distributor pricing, drop-in Cyclone II alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2C8F256I8N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C8F256I8N (same form factor and footprint) β differing in Package, RoHS Status, Process Technology, Speed Grade, Operating Temperature.
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EP2C8F256C8N
β Drop-Inβ In Stock
Contact for price
View Datasheet βEP2C8F256I8
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$36.53 / Unit
View Datasheet βEP2C8F256I6N
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$22.85 / Unit
View Datasheet βEP2C8AF256I8N
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$21.4 / Unit
View Datasheet βEP2C8F256CXNAA
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$11.05 / Unit
View Datasheet βEP2C8F256CX1VAA
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$56.8 / Unit
View Datasheet βEP2C8F256I8N Maximum Ratings & Electrical Characteristics
| Series | Cyclone II |
| Logic Elements (LEs) | 8,256 |
| Embedded Memory Bits | 165,888 bits |
| Total RAM Bits | 165,888 |
| Logic Blocks / Logic Cells | 540 (Logic Cells) |
| User I/O Pins | 182 |
| Embedded 18x18 Multipliers | Up to 36 |
| PLLs | 2 |
| Global Clock Networks | 16 |
| Core Supply Voltage | 1.2 V |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Process Technology | 90 nm CMOS (SRAM-based) |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch |
| Operating Temperature | -40C to +85C (industrial) |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up |
| RoHS Status | Compliant (Pb-free, lead-free reflow compatible) |
| Mounting Type | Surface Mount (BGA) |
EP2C8F256I8N Pin Configuration
| Pin A1 | I/O β User I/O (bank 1) |
| Pin A2 | I/O β User I/O (bank 1) |
| Pin A3 | VCCIO1 β I/O supply for bank 1 |
| Pin A4 | I/O β User I/O (bank 1) |
| Pin A5 | GND β Ground |
| Pin A6 | I/O β User I/O (bank 2) |
| Pin A7 | I/O β User I/O (bank 2) |
| Pin A8 | VCCIO2 β I/O supply for bank 2 |
| Pin A9 | I/O β User I/O (bank 2) |
| Pin A10 | GND β Ground |
| Pin A11 | I/O β User I/O (bank 3) |
| Pin A12 | VCCIO3 β I/O supply for bank 3 |
| Pin A13 | I/O β User I/O (bank 3) |
| Pin A14 | I/O β User I/O (bank 3) |
| Pin A15 | GND β Ground |
| Pin A16 | I/O β User I/O (bank 4) |
Typical Applications
EP2C8F256I8N is suitable for 6 applications: Industrial Machine Vision, Motor Control and Drive Systems, Legacy Bus Bridging (PCI/ISA to PCIe/USB), Low-Cost DSP Front-End, Video Processing and Display Controllers, Embedded Control Systems with Nios II Soft Processor.
Industrial Machine Vision
The EP2C8F256I8N's 8,256 logic elements, 36 embedded 18x18 multipliers, and 182 user I/O pins make it well-suited for industrial machine vision pre-processing. Designers can implement Bayer demosaic, Sobel edge detection, and histogram equalization pipelines in programmable logic, achieving frame rates above 60 fps for VGA-resolution cameras. The industrial -40C to +85C temperature range supports factory floor deployments. The 165 Kbits of embedded RAM provides line buffers for up to 720p processing, and the two PLLs simplify camera link clocking. Unlike fixed-function image processors, this FPGA allows design iteration post-deployment via JTAG reconfiguration.
Recommended
Motor Control and Drive Systems
Industrial servo and stepper motor control leverages the EP2C8F256I8N's deterministic parallel processing and PWM generation capabilities. With 36 embedded multipliers, the device executes field-oriented control (FOC) algorithms at switching frequencies above 50 kHz while leaving margin for current-loop PI controllers and encoder interfaces. The two PLLs generate precisely phased clocks for multi-axis coordination, and the 182 user I/O pins accommodate multiple encoder inputs, Hall sensors, and gate-driver interfaces. Industrial temperature qualification and surface-mount FBGA packaging suit PCB integration inside sealed drive enclosures.
Recommended
Legacy Bus Bridging (PCI/ISA to PCIe/USB)
The EP2C8F256I8N bridges legacy parallel buses such as PCI, ISA, and VME to modern high-speed interfaces using pre-built IP cores from the Quartus II MegaWizard library. The 8,256 logic elements are sufficient to instantiate a 32-bit PCI target interface alongside a serial protocol engine, while the 182 user I/O pins accommodate wide parallel data buses. Industrial temperature range and lead-free reflow compatibility simplify integration into long-lifecycle industrial PCs and test equipment. Designers leverage the device's configuration flexibility to support multiple legacy protocols with a single hardware platform.
Recommended
Low-Cost DSP Front-End
Audio and baseband DSP pre-processing on the EP2C8F256I8N uses its 36 embedded 18x18 multipliers for FIR filters, FFT butterflies, and digital down-conversion. The device sustains 72 GMACS of DSP throughput, suitable for narrowband radio and ultrasonic transducer signal chains. With 165 Kbits of embedded RAM and external SDRAM controller IP, designers implement sample buffers and overlap-add convolution buffers without external logic. The Cyclone II architecture is software-compatible with the Nios II soft-core processor, allowing system-on-chip integration of the DSP pipeline with control-plane code.
Recommended
Video Processing and Display Controllers
The EP2C8F256I8N drives video processing pipelines for industrial displays, medical imaging preview screens, and legacy video format conversion. The device supports DVI/HDMI input via external TMDS receivers and drives LVDS panels using the True-LVDS capable I/O pins. The 182 user I/O accommodate 24-bit RGB buses plus control signals, and the embedded RAM stores at least one full VGA frame for scaling and blending operations. Industrial temperature grade supports outdoor digital signage and medical cart displays where commercial-grade FPGAs would be unreliable.
Recommended
Embedded Control Systems with Nios II Soft Processor
The EP2C8F256I8N supports a Nios II embedded soft-core processor at up to 100 MHz, enabling complete SoC integration of an embedded CPU, custom peripherals, and external memory controllers. Designers implement custom DMA engines, interrupt controllers, and communication peripherals tailored to their application. The industrial temperature range and surface-mount 256-FBGA suit PCB integration in industrial controllers, building automation, and renewable energy inverters. Per the verified distributor data, this part remains in stock, supporting long-lifecycle industrial deployments through 2026 and beyond.
Recommended
Recommended Products Summary
Engineering reference data for EP2C8F256I8N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C8F256C8N | EP2C8F256I8 | EP2C8F256I6N | EP2C8AF256I8N |
|---|---|---|---|---|---|
| Package | 256-LBGA (17x17 mm, 1.0 mm pitch) | 256-LBGA (17x17 mm, 1.0 mm pitch) | 256-LBGA (17x17 mm, 1.0 mm pitch) | 256-LBGA (17x17 mm, 1.0 mm pitch) | 256-LBGA (17x17 mm, 1.0 mm pitch) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 8,256 LEs | 8,256 LEs | 8,256 LEs | 8,256 LEs | 8,256 LEs |
| User I/O Pins | 182 | 182 | 182 | 182 | 182 |
| Embedded Memory | 165,888 bits | 165,888 bits | 165,888 bits | 165,888 bits | 165,888 bits |
| Operating Temperature | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (automotive AEC-Q100) |
| Speed Grade | 8 (slower corner) | 8 | 8 | 6 (faster) | 8 |
| Lead-Free / Pb-Free | Yes (Pb-free) | Yes (Pb-free) | No (SnPb) | Yes (Pb-free) | Yes (Pb-free) |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active |
Key Differentiators
- Industrial temperature range (-40C to +85C) with Pb-free reflow (vs EP2C8F256C8N)
- Higher density than EP2C5 family (vs EP2C5F256I8N)
- Cyclone II architecture proven in long-lifecycle industrial deployments (vs EP2C8AF256I8N)
Design Notes
The 256-FBGA package uses a 1.0 mm ball pitch on a 17x17 mm body. Per Intel's Cyclone II layout guidelines, use a microvia PCB stack-up with at least 4-6 routing layers and matched 50 ohm impedance for LVDS and DDR traces. Power decoupling requires 0.1 uF X7R ceramics within 5 mm of every VCCINT, VCCIO, and PLL ball, plus bulk 100 uF tantalum capacitors. Decoupling is critical because the Cyclone II in-rush current during configuration can exceed 1 A peak.
When using DDR or DDR2 memory interfaces, follow the Cyclone II External Memory Interfaces Handbook for read/write leveling and deskew procedures. Match DQ and DQS trace lengths to within +/- 25 mils and route signals on inner layers with continuous ground reference planes. The two PLLs on the EP2C8F256I8N must be configured with proper feedback modes (source-synchronous for DDR) to compensate for I/O buffer propagation delay.
Do not confuse the EP2C8F256I8N (industrial, Pb-free, speed grade 8) with the EP2C8F256I8 (industrial, SnPb, speed grade 8) or EP2C8F256I6N (industrial, Pb-free, speed grade 6). The 'I6' speed grade is approximately 30% faster in Fmax but shares the same pinout. Ensure the configuration flash (EPCS4, EPCS16, or EPCS64) is sized appropriately for the bitstream - the EP2C8F256I8N bitstream is approximately 1.6 Mbits, well within EPCS4 capacity with margin.
At 100% resource utilization with 36 multipliers operating at full clock rate, the EP2C8F256I8N can dissipate up to 0.9 W in the 256-FBGA package. The thermal resistance theta_JA is approximately 23 C/W on a standard JEDEC 4-layer test board. Most designs run below 60% utilization and dissipate 0.3-0.5 W, requiring only minimal thermal management. For enclosed enclosures with limited airflow, consider adding thermal vias beneath the exposed die paddle.
Compliance Information
RoHS compliant per verified distributor data. Pb-free per 'N' suffix in part number. Not AEC-Q100 qualified - choose EP2C8AF256I8N for automotive. Halogen-free status not explicitly stated in verified data.
