EP2S180F1020I4 vs EP2S60F1020I4 Comparison
Detailed side-by-side comparison of EP2S180F1020I4 by Intel and EP2S60F1020I4 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2S180F1020I4 | EP2S60F1020I4 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $11,250.00 | $1,454.92 |
| Series | Stratix II | Stratix II |
| Family | Stratix II (EP2S180) | β |
| Logic Elements | 179,400 | β |
| Number of LABs/CLBs | 8,970 | 3022 |
| Total RAM Bits | 9,383,040 (8,979,840 per alternate sources) | β |
| Number of I/O | 742 | β |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count per Stratix II EP2S180 datasheet - typically 12] | β |
| Number of PLLs | [DATA_NEEDED: PLL count per EP2S180 datasheet] | 12 |
| Core Voltage (VCCINT) | 1.2 V | β |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Maximum Operating Frequency | 711.24 MHz | β |
| Operating Temperature | -40C to +100C (Industrial grade, "I4" suffix) | β |
| Package | 1020-BBGA, FC-FBGA (Flip-Chip FineLine BGA) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL rating from Altera packaging spec] | β |
| RoHS Status | Compliant | Non-compliant (contains lead per legacy Altera package) |
| Lead-Free | Yes | β |
| Configuration Method | Passive serial, Active serial, Fast passive parallel, JTAG | Passive Serial / Fast Passive Parallel / JTAG |
| Configuration Memory Type | SRAM (volatile; requires external configuration device) | β |
| Supplier Device Package | 1020-FBGA | β |
| Base Part Number | EP2S180 | β |
| Manufacturer | β | Intel / Altera |
| Logic Elements (LEs) | β | 60,440 |
| Embedded Memory (bits) | β | 2,544,192 |
| Number of CLBs | β | 24176 |
| Maximum User I/O | β | 718 |
| Number of I/O Banks | β | [DATA_NEEDED: number of I/O banks] |
| Operating Voltage (Core) | β | 1.2 V |
| Temperature Grade | β | Industrial (-40C to +100C TJ) |
| Package Type | β | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Package Dimensions | β | 33 mm x 33 mm |
| Ball Pitch | β | 1.0 mm |
| Global Clock Networks | β | 16 |
| Embedded Multipliers (18x18) | β | 36 |
| Transceiver Count | β | 0 (no embedded transceivers) |
| Maximum Embedded Memory Bandwidth | β | [DATA_NEEDED: memory bandwidth spec] |