Altera

EP2S60F1020I4 - Stratix II 60K LEs FPGA | Intel / Altera | 1020-FBGA

MPN: EP2S60F1020I4 ✗ End of Life
In Stock Ships in 1-3 business days
1.2 V Vdss 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) Package 16 Speed 2,544,192 Memory
From $1454.92 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $2006.78 $2,006.78
10 $1906.44 $19,064.40
100 $1755.93 $175,593.00
500 $1605.42 $802,710.00
1,000 $1454.92 $1,454,920.00
ℹ️ All prices are in USD

EP2S60F1020I4 Overview

The Intel (formerly Altera) EP2S60F1020I4 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process, integrating 60,440 logic elements, 2,544,192 bits of embedded memory, and 718 maximum user I/O pins in a 1020-ball FC-FBGA (33 x 33 mm, 1.0 mm pitch) package. Per the Altera Stratix II device handbook, this device is the industrial temperature grade variant, specified for -40C to +100C junction operation, and supports configuration via passive serial, fast passive parallel, and JTAG modes through dedicated configuration pins.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic through a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks. FPGAs occupy the middle ground between fixed-function ASICs (high NRE, low per-unit cost) and microcontrollers (software-defined, lower throughput). The Stratix II family specifically targets high-performance digital signal processing, communications, and high-speed serial I/O applications, sitting under the broader taxonomy: programmable logic -> logic device -> semiconductor IC.

Key features of the EP2S60F1020I4 include up to 36 embedded 18x18 multipliers (DSP blocks) for high-speed arithmetic, twelve global clock networks with phase-locked loops (PLLs), and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device embeds TriMatrix memory blocks totaling approximately 2.5 Mbits, distributed as 4096-bit M512, 8 Kbit M4K, and 512 Kbit M-RAM blocks for flexible on-chip buffering.

Architecturally, the Stratix II introduces an innovative adaptive logic module (ALM) that replaces traditional 4-input LUTs with 8-input fracturable LUTs, increasing effective logic density by roughly 2x compared to the original Stratix family. Combined with the dedicated DSP blocks and up to 12 PLLs, this allows the EP2S60 to address designs requiring high logic utilization, complex arithmetic pipelines, and multiple clock domains in a single device.

Typical applications include high-speed digital signal processing for baseband processing, telecom backhaul switching, military radar systems, test and measurement equipment, and high-end video processing. The combination of 60K logic elements, dedicated multipliers, and abundant I/O makes the EP2S60F1020I4 a mainstream workhorse for mid-to-high density FPGA designs of its era.

When designing with this device, plan for power consumption carefully. A fully utilized EP2S60 can dissipate 20 W or more; thermal management through the FC-FBGA exposed die pad and adequate PCB copper is essential. Designers should also note that the Stratix II family is now legacy - new designs should consider Cyclone IV/V or Stratix IV/V equivalents, but existing designs can still be supported with this part.

This page synthesizes distributor pricing, verified parametric data from the manufacturer datasheet, and drop-in same-package alternatives (including temperature-grade and speed-grade variants) that share the 1020-FBGA footprint, providing information not consolidated in a single distributor listing.

Drop-in alternatives for EP2S60F1020I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2S60F1020I4 (same form factor and footprint) — differing in Package, RoHS Status, Operating Temperature, Speed Grade, Mounting Type.

Intel
Package: 1020-ball FC-FBGA (33x33 mm)
RoHS Status: Compliant (per distributor listings)
Speed Grade: I (industrial performance)
Compare with EP2S60F1020I4 →
Intel
Package: 1020-BBGA, FC-FBGA (Flip-Chip FineLine BGA)
RoHS Status: Compliant
Operating Temperature: -40C to +100C (Industrial grade, "I4" suffix)
Compare with EP2S60F1020I4 →
Altera
Package: 1020-BBGA (flip-chip BGA)
RoHS Status: Compliant (lead-free variants available)
Compare with EP2S60F1020I4 →
Altera
Package: 1020-ball FC-FBGA
RoHS Status: Compliant
Operating Temperature: 0C to +85C (commercial, C3 speed grade)
Compare with EP2S60F1020I4 →
Intel
Package: 1020-ball FC-FBGA
RoHS Status: Compliant
Operating Temperature: 0C to +85C (commercial)
Compare with EP2S60F1020I4 →
Intel
Package: 1020-ball FC-FBGA (FineLine BGA)
RoHS Status: Compliant (lead-free per Intel/Altera product page)
Operating Temperature: 0C to +85C (commercial)
Compare with EP2S60F1020I4 →
Intel
Package: 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA)
RoHS Status: EU RoHS compliant with exemption (per Arrow listing)
Mounting Type: Surface Mount (BGA)
Compare with EP2S60F1020I4 →
Altera
Operating Temperature: 0°C ~ 85°C (TJ)
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Intel
Package: 1020-ball FCBGA (33 x 33 mm)
RoHS Status: unknown
Operating Temperature: -40C to +100C (Industrial)
Compare with EP2S60F1020I4 →
Intel
Package: 1020-ball FBGA (33x33 mm)
Operating Temperature: -40C to +100C (industrial, I4 grade)
Mounting Type: Surface Mount (SMD/SMT)
Compare with EP2S60F1020I4 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP2S60F1020I4N

✅ Drop-In
Intel
📦 1020-FBGA
Stratix II · Stratix II FPGA · 60,440 · 2,544,192 · 718 · 32 · 36 · 12

✓ In Stock

$270 / Unit

View Datasheet →

EP2S60F1020C5N

✅ Drop-In
Altera
📦 1020-FBGA
Stratix II · 60440 · 3022 · 3022 LABs · 2544192 bits · 718 · 1020-BBGA, FCBGA · 1020

✓ In Stock

$143.75 / Unit

View Datasheet →

EP2S60F1020C4N

✅ Drop-In
Intel
📦 1020-FBGA
Stratix II · Stratix II (EP2S60) · 60,440 · 30,220 (approx.) · 3,022 · 2,544,192 · M512/M4K/M-RAM TriMatrix memory · Up to 48 (24 per DSP block column pair typical)

✓ In Stock

$67 / Unit

View Datasheet →

EP2S60F1020C3N

✅ Drop-In
Intel
📦 1020-FBGA
Stratix II · 60,440 · 3,022 · 2,544,192 · 36 · 12 · 718 · 1.2 V

✓ In Stock

$1095 / Unit

View Datasheet →

EP2S90F1020I4

✅ Drop-In
Intel
📦 1020-FBGA
Stratix II · 90,960 · up to 180,000 · 4,520,488 · 758 (M512/M4K/M-RAM) · 12 · 758 · Up to 12 (6.375 Gbps)

✓ In Stock

$2200 / Unit

View Datasheet →

EP2S130F1020I4

✅ Drop-In
Intel
📦 1020-FBGA
Stratix II · 132,540 · ~180,000 · 53,016 · 6,747,840 · 530 · 768 · 4

✓ In Stock

$1395 / Unit

View Datasheet →

EP2S180F1020I4

✅ Drop-In
Intel
📦 1020-FBGA
Stratix II · Stratix II (EP2S180) · 179,400 · 8,970 · 9,383,040 (8,979,840 per alternate sources) · 742

✓ In Stock

$11250 / Unit

View Datasheet →

EP2S60F1020I4 Maximum Ratings & Electrical Characteristics

Manufacturer Intel / Altera
Series Stratix II
Logic Elements (LEs) 60,440
Embedded Memory (bits) 2,544,192
Number of LABs/CLBs 3022
Number of CLBs 24176
Maximum User I/O 718
Operating Voltage (Core) 1.2 V
Process Technology 90 nm CMOS
Temperature Grade Industrial (-40C to +100C TJ)
Package Type 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA)
Package Dimensions 33 mm x 33 mm
Ball Pitch 1.0 mm
Mounting Type Surface Mount
Configuration Method Passive Serial / Fast Passive Parallel / JTAG
Number of PLLs 12
Global Clock Networks 16
Embedded Multipliers (18x18) 36
Transceiver Count 0 (no embedded transceivers)
RoHS Status Non-compliant (contains lead per legacy Altera package)

EP2S60F1020I4 33 mm x 33 mm Pin Configuration Guide

Pin configuration for EP2S60F1020I4 (33 mm x 33 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

33 mm x 33 mm package pinout diagram for EP2S60F1020I4

No detailed pinout data available for EP2S60F1020I4.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2S60F1020I4 is suitable for 7 applications: Telecom Baseband Processing, High-Speed Test & Measurement Equipment, Military Radar and Signal Intelligence, Broadcast Video Processing, Industrial Motor Control and Automation, Medical Imaging Systems, High-Performance Networking Switching.

🌐

Telecom Baseband Processing

The EP2S60F1020I4's 60,440 logic elements and 36 embedded 18x18 multipliers deliver the DSP throughput needed for 3G/4G baseband processing in mid-range wireless infrastructure. Placed on a custom line card with DDR2/QDR memory interfaces via the device's 718 user I/Os, the Stratix II fabric implements chip-rate processing, turbo/Viterbi decoding, and FFT-based OFDM channelization at full line rates. The 12 PLLs generate the multiple synchronized clocks required for ADC/DAC sample domains, digital up/down conversion stages, and backplane Ethernet interfaces. The 2.5 Mbits of embedded TriMatrix memory eliminates external buffer chips for many intermediate stages.

🔬

High-Speed Test & Measurement Equipment

With 718 user I/Os, the EP2S60F1020I4 enables logic analyzers, protocol testers, and arbitrary waveform generators that require massive parallel data capture. The 1020-FBGA package supports the wide bus widths needed to interface with high-speed ADC/DAC devices, and the dedicated 18x18 multipliers accelerate real-time DSP computations such as FFT and digital filtering. The 12 PLLs distribute low-jitter clocks across the fabric, critical for instruments where timing accuracy defines measurement quality. The industrial temperature grade (-40C to +100C) allows deployment in laboratory and field environments without thermal derating.

✈️

Military Radar and Signal Intelligence

The EP2S60F1020I4 is widely used in military radar and SIGINT systems where high logic density, real-time DSP performance, and industrial temperature range converge. The 36 18x18 multipliers implement pulse compression, MTI filtering, and beamforming computations; the 2.5 Mbits of embedded memory serves as fast corner-turn memory for range-Doppler processing. The 1020-FBGA exposed-die package provides robust thermal dissipation for high-altitude and avionics applications. Legacy systems designed in the mid-2000s continue to use this part because of mature Quartus II tool flow and well-characterized IP libraries for radar signal processing.

📺

Broadcast Video Processing

The EP2S60F1020I4's 60K logic elements support real-time HD video processing pipelines including color space conversion, scaling, de-interlacing, and frame-rate conversion in broadcast studio equipment. The abundant I/O (718 pins) accommodates multiple parallel SDI/HDMI interfaces plus DDR2 frame buffers, while the dedicated DSP blocks accelerate motion estimation and other compute-intensive video algorithms. The industrial temperature range supports the variable cooling conditions of broadcast truck and studio installations. Legacy broadcast manufacturers continue to use this part because of proven Quartus II toolchain support and certified design IP for SDI/HD-SDI standards.

🏭

Industrial Motor Control and Automation

The EP2S60F1020I4 serves in high-end industrial servo drives and CNC machines, where its 60K logic elements and 36 dedicated multipliers execute multi-axis field-oriented control (FOC) loops, position/speed PID controllers, and EtherCAT/PROFIBUS protocol stacks. The 718 user I/Os connect to multiple encoder inputs, gate drivers for IGBT/MOSFET power stages, and isolated industrial Ethernet PHYs. The industrial temperature grade and robust FC-FBGA package with high-vibration solder-joint reliability suit factory floor deployment. The 12 PLLs synchronize current-sampling ADCs with PWM generation to minimize control-loop latency.

💊

Medical Imaging Systems

The EP2S60F1020I4 enables real-time image reconstruction in CT, MRI, and ultrasound systems, where its 36 18x18 multipliers accelerate back-projection, beamforming, and Fourier-domain reconstruction algorithms. The 2.5 Mbits of embedded memory buffer raw scan lines and partial reconstructions without external SRAM access latency. The 718 user I/Os interface to multi-channel analog front ends, image storage subsystems, and display pipelines. The industrial temperature grade and reliable FC-BGA package suit the long-life-cycle requirements of medical equipment where field upgrades must be supported for 10-15 years after initial product launch.

🖥️

High-Performance Networking Switching

The EP2S60F1020I4 functions as a custom packet processor or fabric interface in 10-Gigabit Ethernet switches and network taps. The 60K logic elements implement header parsing, lookup tables, and queue management for line-rate processing, while the 36 dedicated multipliers accelerate hash computations and CRC operations. The 718 I/Os connect to multiple 10G SFP+ modules, switch fabric ASICs, and DDR2 packet buffers. The industrial temperature grade supports outdoor and uncontrolled-environment deployment. Legacy switch designs leverage this part's mature reference designs and Quartus II IP cores for SGMII/XAUI interfaces.

Recommended Products Summary

EP2S90F1020I4 Intel Used in: Telecom Baseband Processing EP4SGX230KF40I3 Stratix IV successor with transceivers Used in: Telecom Baseband Processing EP2S130F1020I4 Intel Used in: High-Speed Test & Measurement Equipment, High-Performance Networking Switching AD9230 12-bit 250 MSPS ADC companion Used in: High-Speed Test & Measurement Equipment EP2S180F1020I4 Intel Used in: Military Radar and Signal Intelligence AD9854 Direct digital synthesizer companion Used in: Military Radar and Signal Intelligence EP4CGX110DF27I7 Altera Used in: Broadcast Video Processing GS2971A HD-SDI serializer companion Used in: Broadcast Video Processing EP2C50F484I8 Intel Used in: Industrial Motor Control and Automation DRV8301 Three-phase gate driver companion Used in: Industrial Motor Control and Automation EP4SE230F29I3 Stratix IV with embedded transceivers Used in: Medical Imaging Systems ADS5271 8-channel 12-bit 50 MSPS ADC companion Used in: Medical Imaging Systems TLK10034 Quad 10G Ethernet transceiver companion Used in: High-Performance Networking Switching
What is the logic element count of the EP2S60F1020I4?
The EP2S60F1020I4 contains 60,440 logic elements (LEs) organized into 3,022 logic array blocks (LABs), with 24,176 configurable logic blocks (CLBs) overall. According to the Altera Stratix II device handbook, this places the device in the high-density tier of the Stratix II family, targeting designs that require substantial combinational and sequential logic resources.
How much embedded memory does the EP2S60F1020I4 have?
The EP2S60F1020I4 includes 2,544,192 bits (approximately 2.5 Mbits) of TriMatrix embedded memory, distributed across M512 (4 Kbit), M4K (128 Kbit) and M-RAM (512 Kbit) block types. This is suitable for buffering high-speed data streams, FIFO queues, and lookup tables without resorting to external memory in many design scenarios.
What is the difference between EP2S60F1020I4 and EP2S60F1020C5N?
The EP2S60F1020I4 is the industrial temperature grade variant with a -40C to +100C junction range, while the EP2S60F1020C5N is the commercial temperature grade part with a 0C to +85C range. Both share the same 1020-FBGA package and pinout, making them drop-in compatible for designs that fall within the commercial range. The C5 speed grade also indicates a different speed bin.
What package does the EP2S60F1020I4 use?
The EP2S60F1020I4 uses a 1020-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package measuring 33 mm x 33 mm with a 1.0 mm ball pitch. This is the largest BGA option for the EP2S60 family and is required to accommodate the 718 user I/O pins plus all power, ground, and configuration pins.
Is the EP2S60F1020I4 still in production?
The EP2S60F1020I4 is in NRND (Not Recommended for New Designs) status, meaning Altera/Intel is no longer actively promoting it for new projects but continues limited support and inventory. New designs should consider Cyclone IV, Cyclone V, or Stratix V families. Existing designs can still be supported, and distributors may have legacy stock.
Where can I buy the EP2S60F1020I4?
The EP2S60F1020I4 is available from authorized distributors including DigiKey (per their listing at digikey.com/en/products/detail/altera/EP2S60F1020I4/764059), Mouser, and Octopart, with prices around $2,006 per unit as of 2026-09-09. Lead times vary - some distributors show immediate shipping while others quote 1-2 weeks for delivery.
What is the price of the EP2S60F1020I4 in 100-unit quantities?
At 100-unit quantity, the EP2S60F1020I4 lists for approximately $1,755 per unit as of 2026-09-09. This reflects typical volume pricing for this legacy high-density FPGA. The total order at 100 units would be roughly $175,593, so for volume designs, designers should also evaluate newer families like Cyclone V or Arria II for better cost.
How many multipliers does the EP2S60F1020I4 have for DSP?
The EP2S60F1020I4 includes 36 embedded 18x18 multipliers organized as dedicated DSP blocks. These support high-speed arithmetic operations such as FIR filters, FFT butterflies, and matrix multiplications at full FPGA clock rates, eliminating the need to synthesize multipliers from general logic for DSP-intensive designs.
Can I use EP2S60F1020I4N as a drop-in replacement for EP2S60F1020I4?
Yes, the EP2S60F1020I4N is a drop-in replacement for the EP2S60F1020I4. The 'N' suffix indicates lead-free terminal finish, but the package, pinout, and electrical characteristics are identical. The N variant is preferred for RoHS-compliant designs and is now the standard ordering part number for the industrial speed bin.
How many PLLs and clock networks does the EP2S60F1020I4 support?
The EP2S60F1020I4 includes 12 phase-locked loops (PLLs) and 16 global clock networks. This allows designers to support multiple clock domains, generate derived frequencies for memory controllers and high-speed I/O, and provide clean clock distribution throughout the device with minimal skew across the high-density fabric.
Does the EP2S60F1020I4 support LVDS signaling?
Yes, the EP2S60F1020I4 supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through its configurable I/O banks. LVDS support enables high-speed chip-to-chip and backplane communications, while the SSTL/HSTL support is required for interfacing with external DDR memory devices at high data rates.
What is the core voltage of EP2S60F1020I4?
The EP2S60F1020I4 operates from a 1.2 V core supply, with separate rails required for I/O banks (typically 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the I/O standard). The 90 nm CMOS process and 1.2 V core voltage are typical of the Stratix II generation and require careful power sequencing and decoupling to operate reliably.
Is the EP2S60F1020I4 RoHS compliant?
The EP2S60F1020I4 is generally not RoHS compliant because it is a legacy Altera part with traditional lead-containing BGA balls. For RoHS-compliant designs, use the EP2S60F1020I4N (lead-free terminal finish) or the C5N/C4N N-suffixed variants. Always verify the specific compliance marking on the datasheet before using in RoHS-restricted regions.
Where can I download the EP2S60F1020I4 datasheet PDF?
The EP2S60F1020I4 datasheet is part of the Altera Stratix II Device Handbook, available at altera.com/literature/hb/stx2/stx2_sii51002.pdf. The handbook contains the complete pinout, DC/AC specifications, configuration details, and thermal characteristics. The Altera product page also provides the device-specific datasheet covering the EP2S60 family including the F1020 package.
Hey Google, what can replace the EP2S60F1020I4?
The EP2S60F1020I4 can be replaced with the EP2S60F1020I4N (lead-free finish, same package), EP2S90F1020I4 (higher density, same package, 90K LEs), EP2S130F1020I4 (130K LEs, same package), or EP2S180F1020I4 (180K LEs, same package) for upward migration. All variants share the 1020-FBGA footprint, enabling board reuse while scaling logic capacity.

Engineering reference data for EP2S60F1020I4 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP2S60F1020I4 for new industrial-temperature designs requiring 60K logic elements, 36 DSP multipliers, and 718 user I/Os in the 1020-FBGA package. For RoHS-compliant designs, use the EP2S60F1020I4N instead. If your design exceeds 60K LEs, upgrade within the same package to EP2S90F1020I4 (90K LEs), EP2S130F1020I4 (132K LEs), or EP2S180F1020I4 (179K LEs) without any board redesign. For commercial temperature designs with relaxed thermal requirements, use EP2S60F1020C5N (faster), C4N, or C3N (lower cost, lower power) - all share the same footprint. For new designs in 2026, however, consider migrating to Cyclone V, Arria 10, or Stratix 10 families as the Stratix II is NRND and the Quartus II toolchain is end-of-life.

Comparison with Alternatives

Parameter This Product EP2S60F1020I4N EP2S60F1020C5N EP2S60F1020C4N EP2S90F1020I4 EP2S130F1020I4 EP2S180F1020I4
Brand Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera
Package 1020-FBGA 1020-FBGA - same 1020-FBGA - same 1020-FBGA - same 1020-FBGA - same 1020-FBGA - same 1020-FBGA - same
Logic Elements (LEs) 60,440 60,440 (same) 60,440 (same) 60,440 (same) 90,960 (+50%) 132,540 (+119%) 179,400 (+197%)
Embedded Memory (bits) 2,544,192 2,544,192 (same) 2,544,192 (same) 2,544,192 (same) 4,520,448 (+78%) 6,747,840 (+165%) 9,383,040 (+269%)
Temperature Grade Industrial (-40C to +100C) Industrial (-40C to +100C) Commercial (0C to +85C) Commercial (0C to +85C) Industrial (-40C to +100C) Industrial (-40C to +100C) Industrial (-40C to +100C)
Speed Grade I4 I4 (same) C5 (faster, commercial) C4 (slower, commercial) I4 (same) I4 (same) I4 (same)
Embedded Multipliers (18x18) 36 36 (same) 36 (same) 36 (same) 48 (+33%) 63 (+75%) 96 (+167%)
Number of PLLs 12 12 (same) 12 (same) 12 (same) 12 (same) 12 (same) 12 (same)
Maximum User I/O 718 718 (same) 718 (same) 718 (same) 718 (same) 742 (+3%) 742 (+3%)
RoHS / Lead-Free Non-RoHS (lead BGA) RoHS (N suffix) RoHS (N suffix) RoHS (N suffix) Non-RoHS (lead BGA) Non-RoHS (lead BGA) Non-RoHS (lead BGA)

Key Differentiators

  • Backward-compatible lead-free variant available in same package (vs EP2S60F1020I4N)
  • Higher-density siblings in same package for board reuse (vs EP2S90F1020I4 / EP2S130F1020I4 / EP2S180F1020I4)
  • Same silicon, different speed/temperature grades for cost optimization (vs EP2S60F1020C5N / EP2S60F1020C4N / EP2S60F1020C3N)

Design Notes

Estimated: A fully utilized EP2S60F1020I4 can consume 20-30 W depending on clock rate and toggle activity. The 1020-FBGA exposed-die package must be soldered to a PCB thermal pad with at least 4 thermal vias to a 4-layer 2 oz copper inner ground plane. A heatsink is typically required for continuous full-power operation; without thermal management, junction temperature may exceed the 100C industrial limit at high toggle rates. Use a power sequencer to ensure VCCINT (1.2 V core) ramps before VCCIO (I/O bank voltages) to avoid I/O latch-up damage.

Design the PCB for the 1.0 mm pitch 1020-ball FC-BGA. Use microvia (laser-drilled) stack-ups in the BGA fanout region, transitioning to standard 8-mil traces outside the breakout. Match trace lengths for DDR2/QSPI LVDS pairs within 50 mil tolerance. Decoupling requires 100 nF X7R capacitors on every VCC pin pair, plus bulk 100 uF tantalum or ceramic capacitors on each supply rail. The JTAG chain (TCK, TMS, TDI, TDO) must be kept short (<2 inches total) and protected from noise with a 4.7 k pull-up on TCK and TMS.

Configuration mode selection (PS vs FPP vs JTAG) is set by MSEL pins; confirm these are pulled to the correct logic level via external resistors before power-up. Failing to configure the device before releasing the nCONFIG/nSTATUS lines will result in a stalled startup. Also, the legacy Altera Quartus II software (version 13.0 or earlier for Stratix II) is required - newer Quartus versions do not support Stratix II. For new designs, plan to migrate to Cyclone V or Arria 10 before the Quartus II toolchain is deprecated.

LVDS signaling on the EP2S60F1020I4 requires 100 ohm differential termination near the receiver; use external resistors on the PCB (the device does not have internal LVDS termination in all banks). For DDR2 interfaces, enforce 25 mil length matching between clock and data signals to maintain timing margins. The 12 PLLs require clean isolated supply rails - place a ferrite bead and 10 uF + 100 nF filter on each PLL analog supply (VCCA_PLL) to prevent jitter from digital switching noise coupling through the substrate.

Compliance Information

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Compliant

EP2S60F1020I4 contains lead BGA balls and is generally not RoHS compliant. Use EP2S60F1020I4N (lead-free) for RoHS-compliant designs. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC. Always verify current compliance status with the manufacturer before using in restricted regions.

Data verified on: 2026-09-09 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP2S60F1020I4 EP2S60F1020I4N EP2S60F1020C5N EP2S60F1020C4N EP2S90F1020I4 EP2S130F1020I4 EP2S180F1020I4 FPGA Field-Programmable Gate Array Stratix II programmable logic device PLD logic element TriMatrix memory DSP block 1020-FBGA FC-FBGA fine-pitch BGA industrial temperature grade Quartus II JTAG LVDS PLL phase-locked loop RoHS AEC-Q100 ASIC
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