EP2SGX30DF780C7 vs EP2SGX30DF780C4 Comparison

Detailed side-by-side comparison of EP2SGX30DF780C7 by Intel and EP2SGX30DF780C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2SGX30DF780C4 EP2SGX30DF780C4 - Stratix II GX FPGA 33.8K LE FBGA-780 | Intel

EP2SGX30DF780C4 - Stratix II GX FPGA 33.8K LE FBGA-780 | Intel

EP2SGX30DF780C4 βœ— End of Life

Specification Comparison

Parameter EP2SGX30DF780C7 EP2SGX30DF780C4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Eol
Stock Status In Stock In Stock
Unit Price (USD) $125.40 $112.00
Family Stratix II GX Stratix II GX
Series Stratix II GX β€”
Logic Elements (LE) 33,880 β€”
Embedded Memory (bits) 1,369,728 β€”
Memory Blocks 482 (M512/M4K/M-RAM) β€”
DSP Blocks 24 β€”
18x18 Multipliers 192 β€”
Maximum User I/O 361 β€”
Speed Grade -7 β€”
Package 780-Ball FBGA (DF780), 1.0 mm pitch FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch)
Operating Temperature 0C to +85C (Commercial) β€”
Process Node 90 nm β€”
Core Voltage (VCCINT) 1.2 V (typ) β€”
Configuration PS / FPP / JTAG β€”
Transceiver Data Rate [DATA_NEEDED: SERDES data rate] β€”
RoHS Status [DATA_NEEDED: RoHS status] Compliant (per manufacturer product page)
Logic Elements β€” 33,880
Logic Cells β€” 33,880
Number of LABs / CLBs β€” 1,694
Total Number of I/Os β€” 361
Maximum Operating Frequency β€” 717 MHz
Number of Transceivers β€” 20 (embedded multi-gigabit)
Core Voltage β€” 1.2 V
Mounting Type β€” Surface Mount
Process Technology β€” 90 nm CMOS
Operating Temperature Grade β€” Commercial (C4)
Programmable Terminals β€” BGA ball grid (780 terminals)
Package Code β€” BGA
Package Shape β€” Square
MSL Level β€” [DATA_NEEDED: MSL level]
Lead-Free β€” Yes

Datasheets & Resources

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