EP2SGX30DF780C7 - Stratix II GX FPGA 33.7K LE | Intel (Altera) | 780-BGA
MPN: EP2SGX30DF780C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138.75 | $69,375.00 |
| 1,000 | $125.4 | $125,400.00 |
EP2SGX30DF780C7 Overview
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor that combines programmable logic blocks, programmable interconnect, and I/O cells on a single die. FPGAs belong to the broader hierarchy of programmable logic devices (PLD), within the taxonomy of logic ICs > integrated circuits > semiconductors. The Stratix II GX family extends the Stratix II architecture with up to 20 multi-gigabit transceivers (channel data rates to 6.375 Gbps), making the series targeted at high-speed serial I/O, DSP, and embedded processing applications.
Key features of the EP2SGX30DF780C7 include 33,880 logic elements (LE), 1,369,728 RAM bits organized as 482 M512/M4K/M-RAM blocks, 24 DSP blocks implementing 192 18x18 multipliers, an FPGA speed grade of -7 (faster than -8), and a commercial operating temperature range of 0C to +85C. The -C7 speed grade denotes a faster timing closure option that allows higher Fmax on internal logic paths than the C5/C6 grades.
The EP2SGX30DF780C7 uses a 90 nm process node with a 1.2 V core supply, an embedded transceiver serializer/deserializer (SERDES) tile that supports PCI Express, Serial RapidIO, XAUI, and CEI-6G physical layers, and a fine-pitch 780-ball BGA package with a 1.0 mm ball pitch. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and Joint Test Action Group (JTAG) modes with optional encryption via the EPC configuration device family.
Typical applications of the EP2SGX30DF780C7 include high-speed serial interface bridging (PCI Express Gen1/Gen2 endpoints), digital signal processing cards in communications infrastructure, baseband processing in wireless base stations, ASIC prototyping, broadcast video processing, and software-defined radio front-ends. The 6.375 Gbps SERDES capability and abundant DSP blocks make it suitable for data plane packet processing.
When designing with this FPGA, pay attention to transceiver reference clock jitter, PCB layer stack-up for BGA breakout, and the need for proper decoupling on every VCC rail. Quartus II software (version 9.0 and later) is the design environment, and the device requires a configuration flash memory if FPP/PS modes are used. This page synthesizes distributor pricing, same-brand Stratix II GX speed-grade alternatives, and PCB/thermal design guidance not found in the standalone datasheet.
Drop-in alternatives for EP2SGX30DF780C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30DF780C7 (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, RoHS Status, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX30DF780C6
✅ Drop-In✓ In Stock
$132.5 / Unit
View Datasheet →EP2SGX30DF780C5N
✅ Drop-In✓ In Stock
$1050 / Unit
View Datasheet →EP2SGX30DF780C5
✅ Drop-In✓ In Stock
$384.62 / Unit
View Datasheet →EP2SGX30DF780C4N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2SGX30DF780C4
✅ Drop-In✓ In Stock
$112 / Unit
View Datasheet →EP2SGX30DF780C3N
✅ Drop-In✓ In Stock
$95.5 / Unit
View Datasheet →EP2SGX30DF780C3
✅ Drop-In✓ In Stock
$797.98 / Unit
View Datasheet →EP2SGX30DF780C7 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Series | Stratix II GX |
| Logic Elements (LE) | 33,880 |
| Embedded Memory (bits) | 1,369,728 |
| Memory Blocks | 482 (M512/M4K/M-RAM) |
| DSP Blocks | 24 |
| 18x18 Multipliers | 192 |
| Maximum User I/O | 361 |
| Speed Grade | -7 |
| Package | 780-Ball FBGA (DF780), 1.0 mm pitch |
| Operating Temperature | 0C to +85C (Commercial) |
| Process Node | 90 nm |
| Core Voltage (VCCINT) | 1.2 V (typ) |
| Configuration | PS / FPP / JTAG |
EP2SGX30DF780C7 780-ball fbga (df780), 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX30DF780C7 (780-ball fbga (df780), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30DF780C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30DF780C7 is suitable for 6 applications: PCI Express Gen1/Gen2 Endpoint Card, Wireless Baseband Processing, ASIC Prototyping, Broadcast Video Processing, Software Defined Radio Front-End, Industrial Control and Networking Backplane.
PCI Express Gen1/Gen2 Endpoint Card
The EP2SGX30DF780C7 fits PCI Express endpoint designs because its integrated multi-gigabit transceivers natively support the PCIe PHY at 2.5 and 5.0 Gbps, eliminating external PHY silicon. The 33,880 LEs and 192 18x18 multipliers provide the logic and DSP for transaction layer, data path, and minimal protocol-stack workloads. With up to 361 user I/Os, the part supports multiple PCIe lanes plus sideband GPIO for LEDs, JTAG, and EEPROM. Designers place a 100 MHz reference clock into the transceiver refclk pin and add a 1.2 V core regulator plus a 2.5 V/3.3 V I/O rail; the part's 1.0 mm BGA pitch allows routing on standard 8-layer PCBs.
Recommended
Wireless Baseband Processing
The EP2SGX30DF780C7 suits wireless baseband DSP cards because its 192 18x18 multipliers (24 DSP blocks) deliver roughly 50 GMACs at 270 MHz, sufficient for UMTS turbo decoder, LTE uplink pre-encoder, or custom OFDM front-end blocks. The 1.37 Mbit of embedded RAM accommodates multi-symbol sample buffers and HARQ state, while 361 user I/Os expose dual ADC/DAC buses, antenna-switch controls, and CPRI/OBSAI fronthaul. The 6.375 Gbps SERDES channels link to a baseband SoC over CPRI. Designers should decouple every VCC rail with 100 nF plus 10 uF bulk, and pay attention to PLL jitter on the transceiver reference clock.
Recommended
ASIC Prototyping
The EP2SGX30DF780C7 acts as an ASIC prototyping vehicle for moderate-complexity ASICs (roughly 1-2M gates) because its 33,880 LEs, abundant block RAM, and flexible I/O count map cleanly to most mid-density ASIC RTL. The 780-BGA package exposes all user I/Os on a perimeter-plus-array pattern, easing chip-on-board validation, and Quartus II 13.1 supports TimeQuest timing analysis for ASIC-style SDC constraints. Designers partition large ASICs across multiple EP2SGX30 devices in a multi-FPGA board; the 1.0 mm BGA pitch enables 4+ layer boards with manual or chip-on-board assembly.
Recommended
Broadcast Video Processing
The EP2SGX30DF780C7 fits broadcast video processing cards because its block RAM and DSP blocks support SD/HD/3G-SDI crosspoint switching, color-space conversion, and frame-rate conversion in real time. The 361 user I/Os accommodate 4-8 SDI inputs plus HDMI/DVI parallel interfaces, while the SERDES channels provide high-speed expansion links between multiple video cards. Quartus II video IP and Altera's video reference designs target this device family. A heat-spreader or heatsink is recommended for sustained operation because internal logic utilization above 70% can drive junction temperatures into the 90-100C range.
Recommended
Software Defined Radio Front-End
The EP2SGX30DF780C7 supports SDR front-end cards because its SERDES channels interface directly to high-speed ADCs and DACs (e.g., 14-bit 250 MSPS converters) without intermediate logic. The 192 18x18 multipliers execute channelization, DDC/DUC, and crest-factor reduction (CFR) blocks in real time, and the 1.37 Mbit block RAM holds tuning tables and coefficient banks. The 780-BGA package supports integration with multi-board RF front-ends over the SERDES expansion bus, and Altera's DSP Builder tool accelerates MATLAB-to-FPGA flow. Designers must enforce strict power-supply sequencing (1.2 V core before 2.5 V/3.3 V I/O) to avoid latch-up.
Recommended
Industrial Control and Networking Backplane
The EP2SGX30DF780C7 fits industrial control backplanes because its 361 user I/Os support multi-protocol bridging (EtherCAT, PROFINET, SERCOS III, Modbus TCP) alongside 6.375 Gbps SERDES for backplane uplinks. Industrial designs benefit from the commercial 0-85C temperature range when mounted in air-conditioned enclosures, plus abundant block RAM for protocol stack buffering. Designers pair the FPGA with external PHYs (e.g., TI DP83867) and use Quartus II 13.1 industrial Ethernet IP cores. Heatsinking and conformal coating are recommended for harsher environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30DF780C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30DF780C6 | EP2SGX30DF780C5N | EP2SGX30DF780C5 | EP2SGX30DF780C4N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-BGA (DF780), 1.0 mm pitch | 780-BGA (DF780), 1.0 mm pitch - same | 780-BGA (DF780), 1.0 mm pitch - same | 780-BGA (DF780), 1.0 mm pitch - same | 780-BGA (DF780), 1.0 mm pitch - same |
| Speed Grade | -7 (fastest) | -6 | -5 (lead-free) | -5 | -4 (lead-free) |
| Logic Elements | 33,880 LE | 33,880 LE | 33,880 LE | 33,880 LE | 33,880 LE |
| Embedded Memory | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits |
| DSP Blocks (18x18 Mults) | 24 blocks (192 mults) | 24 blocks (192 mults) | 24 blocks (192 mults) | 24 blocks (192 mults) | 24 blocks (192 mults) |
| Maximum User I/O | 361 | 361 | 361 | 361 | 361 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
Key Differentiators
- Fastest commercial speed grade in Stratix II GX family (vs EP2SGX30DF780C6)
- Largest logic-element count for a 780-BGA Stratix II GX (vs EP2SGX30CF780C7)
- On-chip SERDES eliminates external PHY on PCIe, XAUI, CPRI links (vs EP1C20F400C7N (Cyclone II))
- 192 18x18 multipliers deliver ~50 GMACs for DSP (vs EP2S30F484C5 (Stratix II non-GX))
Design Notes
The EP2SGX30DF780C7 requires multiple supply rails: 1.2 V VCCINT (core), 2.5 V/3.3 V VCCIO (per bank), 2.5 V/3.3 V VCCAUX (auxiliary), and a dedicated transceiver supply (typically 1.2 V or 1.5 V depending on data rate). Power sequencing is critical - VCCINT must rise before VCCIO/VCCAUX to prevent latch-up. Use a TI TPS74401 or similar multi-rail sequencer with Power Good (PG) feedback. Decouple every VCC pin with a 100 nF X7R 0402 ceramic plus a 10 uF X5R bulk per bank. Total device power consumption scales with logic utilization, clock frequency, and toggle rate; a fully populated -7 design at 200 MHz logic clock can draw 3-5 W from the core supply alone.
Estimated: at 4 W total power dissipation (1.2 V core draw plus I/O and transceiver power), with a 780-BGA thermal resistance of approximately 11-13 C/W (theta_JA, still air, JEDEC 4-layer test board), the junction temperature rises about 44-52 C above ambient. At 25 C ambient, junction reaches 69-77 C - within the 85 C commercial limit. At 55 C ambient (industrial enclosure), junction may exceed the limit; add a heat spreader (e.g., 25x25 mm copper pad under the BGA, top-side heatsink, or forced-air cooling). Avoid placing the BGA directly against a low-thermal-mass FR-4 region; a 4-layer board with continuous VCCINT and GND planes is mandatory for heat spreading.
The 780-ball FBGA with 1.0 mm pitch requires HDI PCB fabrication: laser-drilled microvias, 4-6 mil trace/space, and a minimum 8-layer stack-up to break out the inner-row balls. Use a 1-2-1-2-1-2-1 via pattern with microvia-in-pad if the assembly house supports it; otherwise, dog-bone fan-out with 0.2 mm via pads. Reference the Altera AN-532 (Stratix II GX PCB Design Guidelines) for differential pair routing, length matching, and AC-coupling capacitor placement on SERDES channels. All transceiver TX/RX differential pairs require 100 ohm differential impedance and AC coupling caps of 100 nF placed close to the transmitter.
Common pitfalls: (1) Failing to instantiate the Altera Transceiver Reconfiguration Controller megafunction - SERDES channels will not work without it. (2) Mixing -7 and -5 speed-grade parts on the same board during a transition - identical pinout but different Fmax, so multi-FPGA timing closure must target the slowest part. (3) Using Quartus Prime 14.0 or later - Stratix II GX support ends at Quartus II 13.1; keep an older install for legacy builds. (4) Configuring with an incompatible EPC device - the EP2SGX30 requires an EPCS64 or larger for passive-serial mode with design decryption enabled. (5) Ignoring pull-up requirements on nCONFIG, nSTATUS, and CONF_DONE - all require external 10 kohm pull-ups to VCCIO3.
Compliance Information
Stratix II GX family EOL announced 2011. RoHS/REACH/lead-free status varies by date code and suffix (N suffix denotes lead-free reflow compliance). AEC-Q100 not applicable for FPGAs.
