EP2SGX60DF780C3 vs EP2SGX60CF780C7 Comparison

Detailed side-by-side comparison of EP2SGX60DF780C3 by Intel and EP2SGX60CF780C7 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX60DF780C3 EP2SGX60CF780C7
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $218.00 $215.00
Family Stratix II GX Stratix II GX
Series Stratix II β€”
Logic Elements / Cells 60,440 β€”
Logic Array Blocks (LABs) 3,022 β€”
Total RAM Bits [DATA_NEEDED: total embedded memory bits] β€”
Number of I/O 364 β€”
Number of Transceivers Up to 20 β€”
Transceiver Data Rate Up to 6.375 Gbps 600 Mbps to 6.375 Gbps
Core Voltage 1.2 V 1.2 V
Process Technology 90 nm β€”
Internal Frequency (max) ~717 MHz β€”
Package 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch 780-ball FCBGA
Mounting Type Surface Mount β€”
Operating Temperature (TJ) 0 Β°C to +85 Β°C (commercial, C speed grade) β€”
Speed Grade C3 (fastest commercial) C7
RoHS Status Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) [DATA_NEEDED: RoHS compliance]
Logic Elements β€” 60,440
Adaptive Logic Modules (ALMs) β€” [DATA_NEEDED: ALM count]
Embedded Memory Bits β€” 2,544,192 bits
DSP Blocks β€” 24 (18x18 multipliers)
Maximum User I/O β€” 364
Transceiver Channels β€” 12
Process Node β€” 90 nm
Ball Pitch β€” 1.0 mm
Operating Temperature β€” 0C to +85C (commercial)
Configuration Scheme β€” Enhanced Configuration (EPC)

Datasheets & Resources

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