EP2SGX60DF780C3 - Stratix II GX 60K LE FPGA, 780-BGA | Intel
MPN: EP2SGX60DF780C3 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $412 | $412.00 |
| 10 | $365 | $3,650.00 |
| 100 | $295 | $29,500.00 |
| 250 | $268 | $67,000.00 |
| 500 | $245 | $122,500.00 |
| 1,000 | $218 | $218,000.00 |
EP2SGX60DF780C3 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as transceivers, DSP blocks, and memory. FPGAs sit at the top of the programmable-logic taxonomy: programmable logic device -> CPLD/FPGA -> high-density FPGA -> transceiver-equipped FPGA. The Stratix II GX family specifically integrates multi-gigabit transceivers, making it part of the high-speed transceiver-equipped FPGA category used in communications, video, and signal-processing systems.
Key features of the EP2SGX60DF780C3 include up to 20 embedded transceivers supporting serial rates up to 6.375 Gbps, dedicated DSP blocks for high-throughput signal processing, distributed and M512K/M4K TriMatrix memory, and support for external memory interfaces including DDR/DDR2/QDRII SRAM. The "DF780" suffix denotes the 780-ball FC-FBGA FineLine BGA package; the "C3" speed grade is the fastest commercial grade offered in the Stratix II GX family, with -4 (medium) and -5 (slow) grades also available. The commercial operating range is 0 Β°C to +85 Β°C (TJ).
Architecturally, Stratix II GX uses an ALM (Adaptive Logic Module) based core rather than the legacy 4-LUT architecture, providing improved logic utilization. The transceiver hard IP supports CPRI/OBSAI, Serial RapidIO, PCI Express (Gen1), and Gigabit Ethernet, offloading high-speed serialization from soft logic. MultiTrack interconnect routing and the Quartus II design suite complete the design ecosystem.
Typical applications include high-speed serial backplane interfaces, telecom line cards, wireless baseband signal processing, video broadcast and editing systems, and ASIC prototyping. The 6.375 Gbps transceiver capability makes it especially suitable for chip-to-chip and backplane links.
Design consideration: at 780-ball FC-FBGA with 1 mm pitch, PCB stack-up and via-in-pad design with proper thermal vias under the exposed die region are essential. The transceiver reference clock jitter budget must be analyzed using the Stratix II GX Transceiver User Guide.
This page synthesizes distributor inventory, parametric context, and practical design guidance not consolidated on any single manufacturer or distributor page.
Drop-in alternatives for EP2SGX60DF780C3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60DF780C3 (same form factor and footprint) β differing in Speed Grade, Package, Operating Temperature, RoHS Status, Package Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX60CF780C3
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$870 / Unit
View Datasheet βEP2SGX60CF780C3N
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$285 / Unit
View Datasheet βEP2SGX60CF780C4
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$171 / Unit
View Datasheet βEP2SGX60CF780I4N
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$171 / Unit
View Datasheet βEP2SGX60CF780I5N
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$1380 / Unit
View Datasheet βEP2SGX60CF780C7
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$215 / Unit
View Datasheet βEP2SGX60CF780C5N
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$485 / Unit
View Datasheet βEP2SGX60CF780C4N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$220 / Unit
View Datasheet βEP2SGX60DF780C3 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Series | Stratix II |
| Logic Elements / Cells | 60,440 |
| Logic Array Blocks (LABs) | 3,022 |
| Number of I/O | 364 |
| Number of Transceivers | Up to 20 |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Internal Frequency (max) | ~717 MHz |
| Package | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature (TJ) | 0 Β°C to +85 Β°C (commercial, C speed grade) |
| Speed Grade | C3 (fastest commercial) |
| RoHS Status | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) |
EP2SGX60DF780C3 780-ball fc-fbga (fineline bga), 29 x 29 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX60DF780C3 (780-ball fc-fbga (fineline bga), 29 x 29 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60DF780C3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60DF780C3 is suitable for 6 applications: Telecom Line Card with CPRI/OBSAI Backhaul, High-Speed Serial Backplane Switching, Video Broadcast and Editing Systems, ASIC Prototyping Platform, PCI Express Endpoint / Root Complex, Industrial Signal Processing & Imaging.
Telecom Line Card with CPRI/OBSAI Backhaul
The EP2SGX60DF780C3 is well-suited for wireless base-station line cards that aggregate CPRI or OBSAI links from remote radio heads. Its up-to-20 multi-gigabit transceivers support the 6.144 Gbps CPRI option used in 4G LTE without soft-logic overhead, while the 60,440 logic elements and embedded DSP blocks handle PHY-layer processing, packet assembly, and backpressure buffering. The -3 speed grade enables meeting tight baseband loop latency targets, and the 780-ball FC-FBGA with controlled-impedance signal paths preserves jitter margins at 6 Gbps.
Recommended
High-Speed Serial Backplane Switching
For enterprise routers and ATCA/AdvancedTCA backplane aggregation, the EP2SGX60DF780C3 provides ample transceiver channels to drive multiple 4.25 Gbps Serial RapidIO or proprietary SERDES links across the backplane simultaneously. The 60K LE capacity absorbs routing tables, congestion management logic, and serializer-deserializer wrappers. Transceiver pre-emphasis and equalization blocks, configured via the ALT2GXB megafunction, compensate PCB channel loss; the C3 speed grade preserves link margins at long trace lengths.
Recommended
Video Broadcast and Editing Systems
In professional video broadcast, the EP2SGX60DF780C3 handles uncompressed HD-SDI/3G-SDI capture, frame-store buffer control, and SDI-to-IP conversion. Its 364 user I/Os support parallel data paths from SDI deserializers and into DDR2 frame buffers, while transceivers drive SMPTE 2022 IP outputs. The 60K LE budget covers de-interlacing, scaling, and colour-space conversion in soft logic alongside embedded DSP blocks handling chroma filtering and 4:2:2 / 4:4:4 conversion pipelines.
Recommended
ASIC Prototyping Platform
The EP2SGX60DF780C3 serves as a prototyping vehicle for mid-complexity ASIC designs in the 1M to 2M gate range. Quartus II synthesis maps RTL into the 60,440-LE ALM fabric with high effective density due to the 8-input fracturable ALM structure. The 780-ball FC-FBGA exposes sufficient user I/Os to bring out prototype boundary-scan and GPIO test points, while 20 transceivers emulate SerDes interfaces of the target ASIC. Designers can partition the design across multiple Stratix II GX devices if higher capacity is required.
Recommended
PCI Express Endpoint / Root Complex
The EP2SGX60DF780C3's hardened PCI Express IP block supports Gen1 (2.5 Gbps) endpoint and root-port configurations directly, freeing soft logic for application-layer DMA engines. The 60K LE capacity is sufficient to implement device drivers, protocol stacks (e.g., custom PCIe-over-cable), or PIPE-to-application conversion. The 364 user I/Os expose ample parallel interfaces to host memories and external controllers, while the C3 speed grade maintains PCIe 2.5 Gbps link training within margin.
Recommended
Industrial Signal Processing & Imaging
The EP2SGX60DF780C3 is deployed in industrial imaging and machine-vision systems where Camera Link, CoaXPress, or proprietary LVDS streams from high-resolution sensors must be processed in real time. The transceiver channels handle CoaXPress up to 6.25 Gbps, while embedded DSP blocks accelerate image preprocessing (filtering, thresholding, FFT). The 60,440 LE fabric is well-matched to mid-range FPGA-based industrial cameras and inspection platforms. Industrial-temperature-grade variants like EP2SGX60CF780I4 share the same silicon and footprint for harsher environments.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60DF780C3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60CF780C3 | EP2SGX60CF780C3N | EP2SGX60CF780C4 | EP2SGX60CF780I4 | EP2SGX60CF780I5N | EP2SGX60CF780C7 |
|---|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (DF) | 780-ball FC-FBGA (CF) - same ball map | 780-ball FC-FBGA (CF) - same ball map | 780-ball FC-FBGA (CF) - same ball map | 780-ball FC-FBGA (CF) - same ball map | 780-ball FC-FBGA (CF) - same ball map | 780-ball FC-FBGA (CF) - same ball map |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 60,440 | 56,760 | 56,760 | 56,760 | 56,760 | 56,760 | 56,760 |
| Speed Grade | C3 (fastest commercial) | C3 | C3 | C4 | I4 (industrial) | I5 (industrial) | C7 |
| Operating Temperature (TJ) | 0 to +85 C (commercial) | 0 to +85 C | 0 to +85 C | 0 to +85 C | -40 to +100 C (industrial) | -40 to +100 C (industrial) | 0 to +85 C |
| Transceiver Count (max) | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| User I/Os | 364 | 364 | 364 | 364 | 364 | 364 | 364 |
| Lifecycle Status | Obsolete | Obsolete (factory stock via Rochester) | Obsolete (factory stock via Rochester) | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest logic capacity in the Stratix II GX EP2SGX60 family (vs EP2SGX60CF780C3)
- Fastest commercial speed grade available (vs EP2SGX60CF780C4)
- Full 364 I/O count vs smaller-package options (vs EP2SGX60CF484I4)
- Stratix II GX is the second-generation transceiver-equipped FPGA from Altera/Intel (vs Cyclone IV GX (lower-tier family))
Design Notes
Estimated: The 780-ball FC-FBGA package has no exposed top-side heatsink; thermal dissipation occurs primarily through the BGA balls to internal PCB copper planes. For continuous multi-transceiver operation at 6 Gbps, design at least four PCB layers with solid ground/power planes directly beneath the package, and provide a thermal-via array (0.3 mm pitch, 0.2 mm drill) under the central die region. Without these provisions, junction temperatures can exceed 100 Β°C at full transceiver utilization, reducing device lifetime.
Use microvia-in-pad or laser-drilled stacked-via technology for the 1.0 mm pitch BGA fanout. Route all 20 transceiver channels on stripline layers with controlled impedance (100 ohm differential per the Stratix II GX Transceiver User Guide), and place AC-coupling capacitors within 200 mil of the BGA pads. Reference-clock traces must be length-matched to within 5 mil and isolated from noisy signal paths by GND stitching vias every 100 mil.
Do not confuse the EP2SGX60 'DF' package suffix with the 'CF' package suffix in schematic symbols and footprints. Both are 780-ball FineLine BGAs but the ball map differs in power/ground ball assignments. Mixing DF and CF pinouts will produce a non-functional board. Verify the exact ordering code against the Stratix II GX device handbook pinout tables before committing the layout. Additionally, the Stratix II GX requires separate VCCPD (3.3 V / 2.5 V) and VCCA_PLL rails in addition to the 1.2 V VCCINT core supply; do not power from a single rail.
Estimated: At full utilization of 20 transceivers at 6.375 Gbps with 60% logic utilization and 25% toggle rate, total power dissipation approaches 12-15 W. A bulk 1.2 V core regulator rated for at least 15 A continuous (with adequate thermal headroom) is required. Use a multi-phase or high-efficiency buck regulator with output accuracy better than Β±3%. Decoupling follows the Stratix II GX PDN guidance: 0402-size 0.1 Β΅F X7R caps under each power ball pair, with bulk 22 Β΅F tantalum or polymer caps placed around the package periphery.
Compliance Information
Stratix II GX BGAs were originally manufactured with non-RoHS bump finish per legacy Altera process; lead-free variants carry the 'N' suffix in their ordering code (e.g., EP2SGX60CF780C3N). AEC-Q100 not applicable as this is an FPGA, not an automotive-grade qualified IC. Compliance values not explicitly provided in verified web data; REACH, halogen, and conflict-mineral status should be requested from Intel/Rochester Electronics per lot.
