EP2SGX60DF780C3 vs EP2SGX60DF780C4 Comparison
Detailed side-by-side comparison of EP2SGX60DF780C3 by Intel and EP2SGX60DF780C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2SGX60DF780C3 | EP2SGX60DF780C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $218.00 | $1,350.00 |
| Family | Stratix II GX | β |
| Series | Stratix II | β |
| Logic Elements / Cells | 60,440 | β |
| Logic Array Blocks (LABs) | 3,022 | β |
| Total RAM Bits | [DATA_NEEDED: total embedded memory bits] | β |
| Number of I/O | 364 | β |
| Number of Transceivers | Up to 20 | β |
| Transceiver Data Rate | Up to 6.375 Gbps | β |
| Core Voltage | 1.2 V | β |
| Process Technology | 90 nm | 90 nm CMOS |
| Internal Frequency (max) | ~717 MHz | β |
| Package | 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch | β |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 Β°C to +85 Β°C (commercial, C speed grade) | β |
| Speed Grade | C3 (fastest commercial) | 4 (C4) |
| RoHS Status | Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) | Compliant |
| Device Family | β | Stratix II GX |
| Logic Elements | β | 60,440 |
| Embedded Memory Bits | β | 2,544,192 |
| User I/O Count | β | 364 |
| Maximum Internal Frequency | β | 717 MHz |
| Transceiver Channels | β | [DATA_NEEDED: exact transceiver count and data rate] |
| Number of CLBs | β | 60,440 |
| Core Supply Voltage | β | 1.2 V |
| Package Type | β | 780-ball FC-FBGA |
| Package Dimensions | β | 29 x 29 mm |
| Ball Pitch | β | 1.0 mm |
| Operating Temperature Grade | β | Commercial (C) |