EP2SGX60EF1152C3 vs EP2SGX60EF1152I3N Comparison
Detailed side-by-side comparison of EP2SGX60EF1152C3 by Intel and EP2SGX60EF1152I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
EP2SGX60EF1152C3 β Last Time BuySpecification Comparison
| Parameter | EP2SGX60EF1152C3 | EP2SGX60EF1152I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,210.00 | $1,195.00 |
| Device Family | Stratix II GX | β |
| Logic Elements | 60,440 | β |
| LABs / CLBs | 3,022 | β |
| User I/Os | 534 | β |
| Total Memory Bits | 2,544,192 | β |
| Number of Transceivers | 36 | β |
| Maximum Transceiver Data Rate | 6.375 Gbps | β |
| Internal Frequency | 717 MHz | β |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | β |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm |
| Multipliers (18x18) | 252 | β |
| Package | 1152-ball FC-FBGA (35 x 35 mm) | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | 0C to +85C (Commercial, C3 suffix) | β |
| Configuration Memory Interface | EPCS serial configuration devices | β |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Family | β | Stratix II GX |
| Device Type | β | Field-Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | β | 60,440 |
| Configurable Logic Blocks (CLBs) | β | 60,440 |
| Embedded Memory Bits | β | 2,544,192 bits |
| Internal Frequency (max) | β | 717 MHz |
| Package Type | β | 1152-ball FC-FBGA |
| Package Size | β | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | β | 1152 |
| Terminal Form | β | Ball |
| Temperature Grade | β | Industrial (-40C to +100C junction) |
| MSL Level | β | [DATA_NEEDED: MSL level] |