EP2SGX60EF1152I3N - Stratix II GX FPGA, 60K LEs, 1152-FBGA | Intel
MPN: EP2SGX60EF1152I3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1395 | $13,950.00 |
| 100 | $1325 | $132,500.00 |
| 250 | $1265 | $316,250.00 |
| 500 | $1195 | $597,500.00 |
EP2SGX60EF1152I3N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that engineers configure after manufacturing to implement custom digital circuits. Within the broader taxonomy, an FPGA sits under programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX family specifically adds multi-gigabit transceivers and is positioned for high-speed serial I/O, digital signal processing (DSP), and embedded processing applications.
Key features of the EP2SGX60EF1152I3N include 2,544,192 bits of embedded memory (M4K/M512/RAM blocks), dedicated DSP blocks for high-throughput arithmetic, up to 12 embedded transceivers supporting multi-gigabit serial protocols, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and Phase-Locked Loops (PLLs) for clock management. It also offers configurable I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) on the user I/O pins.
Architecturally, Stratix II GX uses the ALM (Adaptive Logic Module) which combines the benefits of LUT-based and product-term logic, allowing more efficient packing of logic. The 90nm process delivers favorable performance-per-watt compared with earlier 130nm Stratix devices. The 1152-pin FC-FBGA package measures 35 x 35 mm with 1 mm ball pitch (some vendor listings also describe 23 x 23 mm or 484-ball variants of the same family depending on density/option).
Typical applications include high-speed serial connectivity (backplane, XAUI, PCI Express, Serial RapidIO), high-performance DSP for wireless baseband or video processing, prototype ASIC development, military/aerospace signal processing, and high-end test and measurement equipment. The industrial temperature grade (I3N = -40C to +100C junction, with some sources citing -40C to +85C ambient) makes it suitable for harsher environments.
When designing with this device, use the Quartus II development suite (compatible with Stratix II GX) for synthesis, place-and-route, and timing closure. Plan PCB layout carefully for the FC-FBGA - it requires microvia or via-in-pad technology and controlled-impedance routing for the high-speed transceiver channels. Power-rail sequencing is recommended because the device uses multiple supply voltages (1.2V core, 2.5V/3.3V I/O, PLL analog).
This page synthesizes distributor pricing, drop-in same-family and same-package alternatives, and practical Stratix II GX design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2SGX60EF1152I3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60EF1152I3N (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Mounting Type, Process Technology.
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EP2SGX60EF1152I3
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$365 / Unit
View Datasheet βEP2SGX60EF1152C5N
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$3300 / Unit
View Datasheet βEP2SGX60EF1152C4N
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$1350 / Unit
View Datasheet βEP2SGX60EF1152C3N
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$2195 / Unit
View Datasheet βEP2SGX60EF1152I4N
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View Datasheet βEP2SGX60EF1152I3N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Device Type | Field-Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | 60,440 |
| Configurable Logic Blocks (CLBs) | 60,440 |
| Embedded Memory Bits | 2,544,192 bits |
| Internal Frequency (max) | 717 MHz |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Package Type | 1152-ball FC-FBGA |
| Package Size | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | 1152 |
| Terminal Form | Ball |
| Temperature Grade | Industrial (-40C to +100C junction) |
| Lead-Free | Yes |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
EP2SGX60EF1152I3N 35 x 35 mm (1 mm ball pitch) Pin Configuration Guide
Pin configuration for EP2SGX60EF1152I3N (35 x 35 mm (1 mm ball pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60EF1152I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60EF1152I3N is suitable for 6 applications: Multi-Gigabit Serial Backplane Connectivity, Wireless Baseband DSP Processing, High-Speed Test and Measurement Equipment, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, High-End Video Broadcast Processing.
Multi-Gigabit Serial Backplane Connectivity
The EP2SGX60EF1152I3N's 12 embedded transceivers (622 Mbps to 6.375 Gbps) make it well suited for high-speed serial backplane designs in telecom and datacom switches. Placed as the central serial engine on a line card, the FPGA aggregates multiple SFP+ or XFP links while the 60K logic elements implement MAC/PHY glue logic and packet processing. Industrial temperature rating (-40C to +100C junction) supports outdoor or unconditioned cabinet deployment. Compared to a discrete SERDES plus ASIC solution, the FPGA consolidates the link layer, framing, and protocol handling in one reconfigurable device, reducing BOM cost and enabling late-stage protocol updates.
Recommended
Wireless Baseband DSP Processing
With 60K logic elements and dedicated DSP blocks, the EP2SGX60EF1152I3N delivers sufficient multiply-accumulate throughput for wireless baseband signal processing in picocell and small-cell base stations. Each Stratix II DSP block supports 18x18-bit multiplication at up to 370 MHz, enabling real-time channelization, FFT/iFFT, and modulation for LTE and WiMAX. The 2.5 Mbit embedded memory absorbs working-data buffers between DSP stages, reducing external SRAM traffic. Designers targeting LTE-A or 5G NR should consider Stratix V/VII migration because the 90nm Stratix II GX lacks the hard FIR filter engines and the higher DSP density of newer families.
Recommended
High-Speed Test and Measurement Equipment
Test equipment manufacturers use the EP2SGX60EF1152I3N for protocol-aware BERT (bit-error-rate tester) front ends, arbitrary waveform generators, and digitizer signal processing. The 717 MHz internal clock combined with the high-speed transceivers allows pattern generation and capture at multi-gigabit rates, while the abundant logic and DSP fabric implement real-time error statistics and triggering. Industrial temperature grade is important for portable or rack-mounted test gear operating in uncontrolled environments. The 1152-ball FBGA package keeps the device footprint compatible with high-density motherboards used in modular instruments.
Recommended
ASIC Prototyping and Emulation
Engineering teams use the EP2SGX60EF1152I3N as one of multiple FPGAs in a multi-FPGA ASIC prototyping platform, partitioning a large SoC design across several Stratix II GX devices. The 60K logic elements per chip provide a useful slice size, and the high-speed transceivers carry chip-to-chip traffic between FPGAs at multi-gigabit rates, avoiding pin-limited prototyping. Industrial temperature and lead-free packaging suit long-life prototype platforms that may be reused for many tape-outs. Note that modern ASIC prototyping typically uses larger Stratix V/VII devices; the Stratix II GX remains viable for legacy IP verification.
Recommended
Military and Aerospace Signal Processing
Defense and aerospace integrators leverage the EP2SGX60EF1152I3N for radar signal processing, electronic-warfare subsystems, and secure communications where its industrial temperature range and high logic density enable ruggedized single-board designs. The 90nm process provides radiation tolerance characteristics acceptable for many airborne applications (though full MIL-PRF qualification requires additional screening). Multi-gigabit transceivers connect directly to optical data links for high-bandwidth sensor interfaces. Designers in this segment should verify lot acceptance testing and consider using the EP2SGX60 with extended-temperature screening.
Recommended
High-End Video Broadcast Processing
Broadcast-equipment vendors use the EP2SGX60EF1152I3N for uncompressed SDI/HD-SDI/3G-SDI routing, video format conversion, and multi-channel video processing. The 12 transceivers handle multiple SDI streams simultaneously while the logic and DSP fabric perform scaling, deinterlacing, and color-space conversion in real time. Industrial temperature grade ensures reliable operation in broadcast racks and outside-broadcast (OB) vans. Modern broadcast platforms have migrated to 12G-SDI and IP (SMPTE 2110), so new designs should target Stratix V or Cyclone 10 GX instead of the obsolete Stratix II GX.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60EF1152I3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60EF1152I3 | EP2SGX60EF1152C5N | EP2SGX60EF1152C4N | EP2SGX60EF1152I4N | EP2SGX60EF1152C3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Logic Elements | 60,440 LEs | 60,440 LEs | 60,440 LEs | 60,440 LEs | 60,440 LEs | 60,440 LEs |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial | Commercial (-40C to +85C) | Commercial (-40C to +85C) | Industrial (-40C to +100C) | Commercial (-40C to +85C) |
| Speed Grade | -3 (fastest industrial) | -3 | -5 (slowest) | -4 | -4 | -3 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded Transceivers | 12 channels (up to 6.375 Gbps) | 12 channels | 12 channels | 12 channels | 12 channels | 12 channels |
| Embedded Memory | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| Lead-Free / RoHS | Yes | Yes (with N suffix) | Yes | Yes | Yes | Yes |
Key Differentiators
- Fastest industrial speed grade in the 1152-FBGA Stratix II GX family (vs EP2SGX60EF1152I4N)
- Extended industrial temperature range (-40C to +100C junction) (vs EP2SGX60EF1152C5N)
- 12 embedded multi-gigabit transceivers in one package (vs EP2SGX30 series)
Design Notes
The 1152-ball FC-FBGA with 1 mm ball pitch requires microvia (laser-drilled) or via-in-pad PCB technology. According to Altera hardware design guidelines, use an 8-layer stackup minimum with continuous GND plane beneath the BGA and 1 oz copper on outer layers. Trace escape routing must use 0.1 mm (4 mil) trace width and 0.1 mm spacing to escape the BGA fanout. For high-speed transceiver channels, maintain 100-ohm differential impedance with length matching to within 150 microns.
The Stratix II GX requires multiple supply rails: VCCINT (1.2V core), VCCIO (per-bank, 1.2V-3.3V), VCCA_PLL (1.2V analog PLL), and VCCPD (3.3V pre-driver). Power-rail sequencing is required: VCCINT and VCCA_PLL must rise before or simultaneously with VCCIO, and VCCPD must rise after VCCINT. According to AN 470: Power Supply Design for Stratix II GX, decouple each rail with 0.1 uF X7R ceramic capacitors placed within 100 mils of each power pin, plus bulk 22 uF tantalum or polymer caps.
Estimated: at typical operating conditions (room temperature, 50% logic utilization, 50% transceiver toggle), the EP2SGX60EF1152I3N dissipates approximately 8-12 W. With theta_JA of roughly 12 C/W on a JEDEC 8-layer test board (per Stratix II GX thermal model), junction temperature rises 96-144 C above ambient. Active airflow or a heat spreader is strongly recommended for industrial temperature applications. Always use Intel's PowerPlay early-power estimator tool during design to characterize worst-case thermal behavior before PCB commitment.
Do not apply JTAG signals before VCCINT is stable - this can latch-up the device. Also, the configuration scheme (AS, PS, JTAG, FPP) must be selected by MSEL pins at power-up; wrong MSEL settings cause configuration failure. Unused transceiver channels must be powered down in software and physically terminated with 100-ohm differential load at the SMA connector side. According to Altera errata sheets, early silicon revs of Stratix II GX had a known issue with PLL re-lock after power-rail brownout - apply a full power cycle to recover.
For 6.375 Gbps transceiver channels, use the Stratix II GX Transceiver Toolkit in Quartus II to characterize eye quality and adjust pre-emphasis, VOD, and equalization settings on a per-channel basis. According to AN 535: Implementing Multi-Gigabit Serial Interfaces, maintain a continuous reference plane under the transceiver channels and avoid splitting the GND plane between transmit and receive paths. Place DC-blocking capacitors as close to the device pins as the BGA escape routing allows - typically within 200 mils for 6 Gbps signals.
Compliance Information
RoHS and lead-free compliant per Intel/Altera documentation. REACH SVHC compliance declared at product introduction; check current Intel legacy product declarations for the latest SVHC list. AEC-Q100 not applicable - this is a digital logic IC, not an automotive analog component. Halogen-free status not explicitly stated in available data and therefore marked 'unknown'.