EP2SGX60EF1152I5 vs EP2SGX60EF1152I3N Comparison

Detailed side-by-side comparison of EP2SGX60EF1152I5 by Intel and EP2SGX60EF1152I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX60EF1152I5 EP2SGX60EF1152I3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $178.00 $1,195.00
Family Stratix II GX Stratix II GX
Logic Elements (LEs) 60,440 60,440
Configurable Logic Blocks (CLBs) 60,440 60,440
Embedded Memory (bits) 2,544,192 β€”
Maximum Clock Frequency 622.08 MHz β€”
Process Technology 90 nm CMOS 90 nm
Core Supply Voltage 1.15 V to 1.25 V β€”
Operating Temperature Grade Industrial (-40 Β°C to +85 Β°C) β€”
Package 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch β€”
Mounting Type Surface Mount (flip-chip BGA) Surface Mount (BGA)
Terminal Form Ball Ball
Number of Terminals 1152 1152
Package Code BGA β€”
MSL Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL level]
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Transceivers Integrated multi-gigabit transceivers (per Stratix II GX family) β€”
DSP Blocks Yes, hardware multipliers and DSP blocks (per Stratix II GX family) β€”
Device Type β€” Field-Programmable Gate Array (FPGA)
Embedded Memory Bits β€” 2,544,192 bits
Internal Frequency (max) β€” 717 MHz
Core Voltage β€” 1.2 V
Package Type β€” 1152-ball FC-FBGA
Package Size β€” 35 x 35 mm (1 mm ball pitch)
Temperature Grade β€” Industrial (-40C to +100C junction)
Lead-Free β€” Yes

Datasheets & Resources

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