EP2SGX60EF1152I5 vs EP2SGX60EF1152I5N Comparison

Detailed side-by-side comparison of EP2SGX60EF1152I5 by Intel and EP2SGX60EF1152I5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX60EF1152I5 EP2SGX60EF1152I5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Unknown
Stock Status In Stock In Stock
Unit Price (USD) $178.00 $0.00
Family Stratix II GX Stratix II GX
Logic Elements (LEs) 60,440 β€”
Configurable Logic Blocks (CLBs) 60,440 β€”
Embedded Memory (bits) 2,544,192 β€”
Maximum Clock Frequency 622.08 MHz 622.08 MHz
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage 1.15 V to 1.25 V 1.2 V
Operating Temperature Grade Industrial (-40 Β°C to +85 Β°C) β€”
Package 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch 1152-ball BGA
Mounting Type Surface Mount (flip-chip BGA) β€”
Terminal Form Ball Ball
Number of Terminals 1152 1152
Package Code BGA β€”
MSL Level [DATA_NEEDED: MSL rating] β€”
RoHS Status [DATA_NEEDED: RoHS status] unknown
Transceivers Integrated multi-gigabit transceivers (per Stratix II GX family) β€”
DSP Blocks Yes, hardware multipliers and DSP blocks (per Stratix II GX family) β€”
Device Type β€” Field Programmable Gate Array (FPGA)
Logic Cells β€” 60,440
Logic Blocks β€” 60,440
Internal Frequency β€” 717 MHz
Reported Internal Frequency β€” 609.76 MHz
Operating Temperature Range β€” -40 Β°C to 85 Β°C
Package Type β€” FC-FBGA
Package Dimensions β€” 23 x 23 mm
Terminal Pitch β€” 1 mm
Temperature Grade β€” Industrial
Propagation Delay β€” [DATA_NEEDED: propagation delay]
Configuration Memory β€” [DATA_NEEDED: configuration memory type and size]
I/O Count β€” [DATA_NEEDED: user I/O count]
Transceiver Count β€” [DATA_NEEDED: transceiver count]
REACH Status β€” unknown

Datasheets & Resources

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